Abstract: A pad electrode is formed on a main surface of a semiconductor chip. A passivation film, which covers a surface portion of the pad electrode, is formed on the main surface of the semiconductor chip. An internal connection conductor is formed on a surface portion of the pad electrode. The semiconductor chip is covered with a molding resin which exposes only a top surface of the internal connection conductor. An external connection conductor is formed on a top surface of the internal connection conductor. The external connection conductor has a substantially flat top surface. Thereby, a plastic molded semiconductor package can be easily mounted on a printed board, and can have improved reliability after being joined on the printed board.

Abstract: A pad electrode is formed on a main surface of a semiconductor chip. A passivation film, which covers a surface portion of the pad electrode, is formed on the main surface of the semiconductor chip. An internal connection conductor is formed on a surface portion of the pad electrode. The semiconductor chip is covered with a molding resin which exposes only a top surface of the internal connection conductor. An external connection conductor is formed on a top surface of the internal connection conductor. The external connection conductor has a substantially flat top surface. Thereby, a plastic molded semiconductor package can be easily mounted on a printed board, and can have improved reliability after being joined on the printed board.

Abstract: A pad electrode is formed on a main surface of a semiconductor chip. A passivation film, which covers a surface portion of the pad electrode, is formed on the main surface of the semiconductor chip. An internal connection conductor is formed on a surface portion of the pad electrode. The semiconductor chip is covered with a molding resin which exposes only a top surface of the internal connection conductor. An external connection conductor is formed on a top surface of the internal connection conductor. The external connection conductor has a substantially flat top surface. Thereby, a plastic molded semiconductor package can be easily mounted on a printed board, and can have improved reliability after being joined on the printed board.

Abstract: A pad electrode is formed on a main surface of a semiconductor chip. A passivation film, which covers a surface portion of the pad electrode, is formed on the main surface of the semiconductor chip. An internal connection conductor is formed on a surface portion of the pad electrode. The semiconductor chip is covered with a molding resin which exposes only a top surface of the internal connection conductor. An external connection conductor is formed on a top surface of the internal connection conductor. The external connection conductor has a substantially flat top surface. Thereby, a plastic molded semiconductor package can be easily mounted on a printed board, and can have improved reliability after being joined on the printed board.

Abstract: An IC card includes a substrate, semiconductor devices mounted on at least one of the major surfaces of the substrate and a casing in which the substrate with the semiconductor devices mounted on it is housed. The casing includes a frame and panels bonded to the frame on the opposite sides of the frame by means of adhesive layers. The semiconductor devices are prevented from being bonded to the panel via the adhesive layers at locations on the adhesive layers facing the semiconductor devices.

Abstract: A semiconductor device according to the present invention has reduced inductance on a power supply line, a grounding line, and signal lines. In this invention, to reduce the length of the power supply connection and that of the grounding connection, a power supply metal post and a grounding metal post are respectively provided on a power supply lead of a semiconductor chip and grounding lead of the semiconductor chip perpendicular to the leads. The metal posts protrude from the resin encapsulating the chip and are connected to lands or a conductive circuit pattern on a printed circuit board. Furthermore, a planar conductor commonly connecting the power supply or grounding potentials is provided.

Abstract: In a portable electrical device, a plurality of engaging portions of a frame on surfaces of the frame are directed in the same direction and engaging portions on two connecting terminals can be brought into engagement with the engaging portions along the same direction. Thus, both of the connecting terminals can be mounted on the frame from the same direction, and the efficiency of the mounting operation is improved and can be automated. Furthermore, deformation of or damage to the connecting terminals, caused by the mounting process, is reduced.

Abstract: An IC card is disclosed which would not be deformed, and hence, which maintains its quality reliability. A frame is provided to house a substrate which mounts ICs. Panels for protecting the ICs are fixed to the frame by first adhesive material layers. A connector is disposed, in contact with the substrate, between the panels. The connector is fixed to the frame by a second adhesive material layer. This prohibits that external force which acts on the connector at insertion and detachment of the IC card into and from external equipment from acting on the first adhesive material layers. Hence, insertion and detachment of the IC card do not cause deterioration in adhesion between the panels and the frame. Thus, deformation of the ICs due to the external force is prevented, thereby the quality reliability of the IC card being better maintained.

Abstract: A semiconductor device card includes an electric circuit board, at least one panel having self-locking pawls formed at several places along the edge thereof, and a frame having engagement surfaces for engaging the pawls.

Abstract: A semiconductor device card and a method of manufacturing the card. A frame includes an integral spacer which fills a dead space on a circuit board to eliminate the need for positioning a separate spacer in the dead space on the circuit board and fixing the spacer in place with a bonding sheet or the like. In a semiconductor device card in which a spacer for filling a dead space on the circuit board is bonded to a corresponding panel, a recess is formed on the surface of the spacer bonded to the obverse or reverse panel to reduce undulations occurring in the panel surface.

Abstract: The semiconductor device has leads projecting from at least two sides of all of a package which are bent in a zigzag manner so that ends of the leads lie on at least two planes. The semiconductor device may be mounted across a plurality of printed circuit boards by fixing a part of the leads from one side to a first board and fixing a remaining part of the leads from the other side to a second board, or by fixing a part of the leads on one plane to a first board and fixing a remaining part of the leads on the other plane to a second board.

Abstract: A modular semiconductor device includes a pair of generally parallel electronic circuit boards and a plurality of IC packages mounted between the electronic circuit boards. Two or more modular semiconductor devices may be stacked on each other so that memory capacity can be readily enlarged and the function level can be readily improved. A heating, radiating fin of planar or honeycomb structure may be provided in near contact with an IC package.

Abstract: A connecting electrode includes an electrode substrate, a contact having a buttonhook-shaped section provided on the electrode substrate, a convex surface of the contact projecting from the electrode substrate for deformation by a battery and a projection from the substrate beside the convex surface for controlling the amount of deformation of the contact by a battery.

Abstract: The invention relates to oil or fat coated 5'-ribonucleotides and a method of making the same.