Abstract: A cold-cathode tube driving apparatus wherein the number of booster transformers has been reduced and the increase in installation space and in cost has been suppressed. This cold-cathode tube driving apparatus comprises a booster transformer (2); a plurality of cold-cathode tubes (3-1 to 3-N); and a time division control circuit (control circuit 6 and time division FETs 4-1 to 4-N) for lighting one or more of the plurality of cold-cathode tubes (3-1 to 3-N) in a time division manner by use of a high frequency voltage after boosted by the booster transformer (2).

Abstract: The present invention provides an IC tag which has a structure comprising a first adhesive layer formed on a surface of a substrate sheet, an electronic circuit and an IC chip connecting both ends of the electronic circuit, both formed on the surface of the first adhesive layer, and a second adhesive layer covering the electronic circuit and the IC chip. The IC tag further includes a release agent layer formed at positions corresponding to the both ends of the electronic circuit and located at the interface between the substrate sheet and the first adhesive layer. When the IC tag attached to an article is peeled off, the built-in electronic circuit is surely broken.

Abstract: A cold-cathode tube driving apparatus wherein the number of booster transformers has been reduced and the increase in installation space and in cost has been suppressed. This cold-cathode tube driving apparatus comprises a booster transformer (2); a plurality of cold-cathode tubes (3-1 to 3-N); and a time division control circuit (control circuit 6 and time division FETs 4-1 to 4-N) for lighting one or more of the plurality of cold-cathode tubes (3-1 to 3-N) in a time division manner by use of a high frequency voltage after boosted by the booster transformer (2).

Abstract: The present invention provides an IC tag which has a structure comprising a first adhesive layer formed on a surface of a substrate sheet, an electronic circuit and an IC chip connecting both ends of the electronic circuit, both formed on the surface of the first adhesive layer, and a second adhesive layer covering the electronic circuit and the IC chip. The IC tag further includes a release agent layer formed at positions corresponding to the both ends of the electronic circuit and located at the interface between the substrate sheet and the first adhesive layer. When the IC tag attached to an article is peeled off, the built-in electronic circuit is surely broken.

Abstract: A process for producing an IC chip having a protective layer is provided. The process comprises attaching an adhesive sheet comprising a base material and a layer of a curable resin disposed on one face of the base material to at least one face of an IC chip attached to a circuit substrate under pressure in a manner such that the layer of a curable resin contacts the face of the IC chip and curing the layer of a curable resin.

Abstract: A pixel data encoder for use in a facsimile apparatus features a first in first out memory for storing one-dimensional binary pixel data sequences in synchronism with a data acquisition clock; a run length determiner coupled to receive the one-dimensional binary pixel data sequences stored in the first in first out memory, the run length determiner calculating a run length for each of the one-dimensinal binary pixel data sequences received; and an encoding section which issues a one-bit address signal for indicating raw data will be issued and N-bit raw data in the event that the run length is less than a predetermined run length N, the encoding section issuing an address code and a remainder code in the event that the run length exceeds N, the address code consisting of consecutive binary level "1"s with a bit length (M-2) and a binary level "0", and the remainder code consisting of a binary sequence representing the run length wherein the most significant bit of the binary sequence is omitted, M representin