Patents by Inventor Toru Takasone
Toru Takasone has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11585494Abstract: A fluorescent module includes a fluorescent member including a phosphor-containing layer, and a light reflecting layer disposed on the phosphor-containing layer. The phosphor-containing layer contains a YAG phosphor and a Ga-YAG phosphor within the same layer, the Ga-YAG phosphor being a phosphor in which a portion of the aluminum constituting the YAG phosphor is substituted with gallium. A volumetric ratio of the Ga-YAG phosphor to the entirety of the YAG phosphor and the Ga-YAG phosphor is in a range of 19.0% to 80%.Type: GrantFiled: August 24, 2021Date of Patent: February 21, 2023Assignee: NICHIA CORPORATIONInventors: Takafumi Sugiyama, Toshiyuki Hirai, Masahiko Sano, Toru Takasone
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Publication number: 20210381662Abstract: A fluorescent module includes a fluorescent member including a phosphor-containing layer, and a light reflecting layer disposed on the phosphor-containing layer. The phosphor-containing layer contains a YAG phosphor and a Ga-YAG phosphor within the same layer, the Ga-YAG phosphor being a phosphor in which a portion of the aluminum constituting the YAG phosphor is substituted with gallium. A volumetric ratio of the Ga-YAG phosphor to the entirety of the YAG phosphor and the Ga-YAG phosphor is in a range of 19.0% to 80%.Type: ApplicationFiled: August 24, 2021Publication date: December 9, 2021Inventors: Takafumi SUGIYAMA, Toshiyuki HIRAI, Masahiko SANO, Toru TAKASONE
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Patent number: 11131433Abstract: A fluorescent module includes a fluorescent member, a heat dissipation member, and an optical relaxation member. The fluorescent member includes a phosphor-containing layer, and a light reflecting layer. The fluorescent member is secured to the heat dissipation member so that the light reflecting layer is arranged between the phosphor-contacting layer and the heat dissipation member. The optical relaxation member is configured to absorb and/or diffuse light. The optical relaxation member is arranged with respect to the fluorescent member so that the light reflecting layer is arranged between the phosphor-containing layer and the optical relaxation member.Type: GrantFiled: August 8, 2019Date of Patent: September 28, 2021Assignee: NICHIA CORPORATIONInventors: Takafumi Sugiyama, Toshiyuki Hirai, Masahiko Sano, Toru Takasone
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Publication number: 20210187928Abstract: A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.Type: ApplicationFiled: March 10, 2021Publication date: June 24, 2021Inventors: Daisuke SANGA, Masatsugu ICHIKAWA, Shunsuke MINATO, Toru TAKASONE, Masahiko SANO
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Patent number: 10974492Abstract: A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.Type: GrantFiled: February 19, 2020Date of Patent: April 13, 2021Assignee: NICHIA CORPORATIONInventors: Daisuke Sanga, Masatsugu Ichikawa, Shunsuke Minato, Toru Takasone, Masahiko Sano
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Publication number: 20200180292Abstract: A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.Type: ApplicationFiled: February 19, 2020Publication date: June 11, 2020Inventors: Daisuke SANGA, Masatsugu ICHIKAWA, Shunsuke MINATO, Toru TAKASONE, Masahiko SANO
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Patent number: 10603889Abstract: A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.Type: GrantFiled: January 30, 2018Date of Patent: March 31, 2020Assignee: NICHIA CORPORATIONInventors: Daisuke Sanga, Masatsugu Ichikawa, Shunsuke Minato, Toru Takasone, Masahiko Sano
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Publication number: 20200056751Abstract: A fluorescent module includes a fluorescent member, a heat dissipation member, and an optical relaxation member. The fluorescent member includes a phosphor-containing layer, and a light reflecting layer. The fluorescent member is secured to the heat dissipation member so that the light reflecting layer is arranged between the phosphor-contacting layer and the heat dissipation member. The optical relaxation member is configured to absorb and/or diffuse light. The optical relaxation member is arranged with respect to the fluorescent member so that the light reflecting layer is arranged between the phosphor-containing layer and the optical relaxation member.Type: ApplicationFiled: August 8, 2019Publication date: February 20, 2020Inventors: Takafumi SUGIYAMA, Toshiyuki HIRAI, Masahiko SANO, Toru TAKASONE
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Patent number: 10442987Abstract: A fluorescent member includes: a plurality of fluorescent particles; an inorganic binder; and a plurality of pores. An upper surface of the fluorescent member is a light extraction surface of the fluorescent member. The plurality of pores are localized in a vicinity of at least one of the plurality of fluorescent particles in a cross section that is parallel to the upper surface of the fluorescent member and extends through the fluorescent particles and the pores.Type: GrantFiled: August 30, 2018Date of Patent: October 15, 2019Assignee: NICHIA CORPORATIONInventors: Toru Takasone, Masahiko Sano, Hiroyuki Inoue, Shoichi Yamada, Takafumi Sugiyama
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Publication number: 20190062627Abstract: A fluorescent member includes: a plurality of fluorescent particles; an inorganic binder; and a plurality of pores. An upper surface of the fluorescent member is a light extraction surface of the fluorescent member. The plurality of pores are localized in a vicinity of at least one of the plurality of fluorescent particles in a cross section that is parallel to the upper surface of the fluorescent member and extends through the fluorescent particles and the pores.Type: ApplicationFiled: August 30, 2018Publication date: February 28, 2019Applicant: NICHIA CORPORATIONInventors: Toru TAKASONE, Masahiko SANO, Hiroyuki INOUE, Shoichi YAMADA, Takafumi SUGIYAMA
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Patent number: 10180237Abstract: A light emitting device includes a laser light, a wavelength conversion member, a base member and a lid. The wavelength conversion member includes a plurality of projected portions each extending along a first direction on an upper surface side thereof and arranged side by side in a second direction. Each of the plurality of projected portions has a first surface extending along the first direction. The first surface is inclined with respect to a reference surface. The laser light source and the wavelength conversion member are arranged so that an optical axis of first light from the laser light source extends along the second direction when viewed from above and is inclined with respect to the reference surface, and light directly incident to the first surface along a direction parallel to the optical axis of the first light is regularly reflected toward an upward direction.Type: GrantFiled: June 13, 2017Date of Patent: January 15, 2019Assignee: NICHIA CORPORATIONInventors: Masahiko Sano, Hiroaki Yuto, Naoki Eboshi, Toru Takasone
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Publication number: 20180229491Abstract: A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.Type: ApplicationFiled: January 30, 2018Publication date: August 16, 2018Inventors: Daisuke SANGA, Masatsugu ICHIKAWA, Shunsuke MINATO, Toru TAKASONE, Masahiko SANO
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Patent number: 9914288Abstract: A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.Type: GrantFiled: November 6, 2014Date of Patent: March 13, 2018Assignee: NICHIA CORPORATIONInventors: Daisuke Sanga, Masatsugu Ichikawa, Shunsuke Minato, Toru Takasone, Masahiko Sano
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Publication number: 20170363269Abstract: A light emitting device includes a laser light, a wavelength conversion member, a base member and a lid. The wavelength conversion member includes a plurality of projected portions each extending along a first direction on an upper surface side thereof and arranged side by side in a second direction. Each of the plurality of projected portions has a first surface extending along the first direction. The first surface is inclined with respect to a reference surface. The laser light source and the wavelength conversion member are arranged so that an optical axis of first light from the laser light source extends along the second direction when viewed from above and is inclined with respect to the reference surface, and light directly incident to the first surface along a direction parallel to the optical axis of the first light is regularly reflected toward an upward direction.Type: ApplicationFiled: June 13, 2017Publication date: December 21, 2017Inventors: Masahiko SANO, Hiroaki YUTO, Naoki EBOSHI, Toru TAKASONE
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Publication number: 20150124457Abstract: A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.Type: ApplicationFiled: November 6, 2014Publication date: May 7, 2015Inventors: Daisuke SANGA, Masatsugu ICHIKAWA, Shunsuke MINATO, Toru TAKASONE, Masahiko SANO
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Patent number: 8980661Abstract: Provided is a method for manufacturing a light emitting device comprising a light emitting element and an optical part, the method comprising the steps of (i) forming a hydroxyl film on a bonding surface of each of the light emitting element and the optical part by an atomic layer deposition, and (ii) bonding the bonding surfaces of the light emitting element and the optical part with each other, each of the bonding surfaces having the hydroxyl film formed thereon, wherein a substep is repeated at least one time in the step (i), in which substep a first raw material gas and a second raw material gas are sequentially supplied onto the bonding surfaces of the light emitting element and the optical part, and wherein the bonding of the bonding surfaces in the step (ii) is performed without a heating treatment.Type: GrantFiled: April 28, 2014Date of Patent: March 17, 2015Assignee: Nichia CorporationInventors: Masatsugu Ichikawa, Masahiko Sano, Daisuke Sanga, Toru Takasone, Shunsuke Minato
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Publication number: 20140322844Abstract: Provided is a method for manufacturing a light emitting device comprising a light emitting element and an optical part, the method comprising the steps of (i) forming a hydroxyl film on a bonding surface of each of the light emitting element and the optical part by an atomic layer deposition, and (ii) bonding the bonding surfaces of the light emitting element and the optical part with each other, each of the bonding surfaces having the hydroxyl film formed thereon, wherein a substep is repeated at least one time in the step (i), in which substep a first raw material gas and a second raw material gas are sequentially supplied onto the bonding surfaces of the light emitting element and the optical part, and wherein the bonding of the bonding surfaces in the step (ii) is performed without a heating treatment.Type: ApplicationFiled: April 28, 2014Publication date: October 30, 2014Applicant: NICHIA CORPORATIONInventors: Masatsuga Ichikawa, Masahiko Sano, Daisuke Sanga, Toru Takasone, Shunsuke Minato
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Patent number: 7615472Abstract: A method for manufacturing a nitride semiconductor substrate includes the steps of growing a first nitride semiconductor on a substrate, patterning the first nitride semiconductor to obtain a pattern surrounded by a plane equivalent to the (11-20) plane and having at least two concave portions that are similar in their planar shape, and growing a second nitride semiconductor layer, using a plane equivalent to the (11-20) plane in the first nitride semiconductor pattern as a growth nucleus.Type: GrantFiled: June 8, 2009Date of Patent: November 10, 2009Assignee: Nichia CorporationInventor: Toru Takasone
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Patent number: 7608525Abstract: A method for manufacturing a nitride semiconductor substrate comprises the steps of: growing a first nitride semiconductor on a substrate, patterning the first nitride semiconductor to obtain a pattern surrounded by a plane equivalent to the (11-20) plane and having at least two concave portions that are similar in their planar shape, and growing a second nitride semiconductor layer, using a plane equivalent to the (11-20) plane in the first nitride semiconductor pattern as a growth nucleus.Type: GrantFiled: September 25, 2006Date of Patent: October 27, 2009Assignee: Nichia CorporationInventor: Toru Takasone
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Publication number: 20090246945Abstract: A method for manufacturing a nitride semiconductor substrate includes the steps of growing a first nitride semiconductor on a substrate, patterning the first nitride semiconductor to obtain a pattern surrounded by a plane equivalent to the (11-20) plane and having at least two concave portions that are similar in their planar shape, and growing a second nitride semiconductor layer, using a plane equivalent to the (11-20) plane in the first nitride semiconductor pattern as a growth nucleus.Type: ApplicationFiled: June 8, 2009Publication date: October 1, 2009Applicant: NICHIA CORPORATIONInventor: Toru TAKASONE