Patents by Inventor Toru Takebe
Toru Takebe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8300875Abstract: A speaker diaphragm includes a thermoplastic resin having a three-layer structure. The three-layer structure includes a polyester film as a base material of the three-layer structure, a polyimide-based resin layer as a top layer of the three-layer structure, and another polyimide-based resin layer as a bottom layer of the three-layer structure.Type: GrantFiled: February 20, 2008Date of Patent: October 30, 2012Assignee: Sony CorporationInventors: Toru Takebe, Kunihiko Tokura, Masaru Uryu, Takahisa Tagami, Emiko Ikeda
-
Patent number: 8217276Abstract: A multilayer printed circuit board which can surely establish interlayer connection with low resistance. The multilayer printed circuit board comprises: a first substrate having a conductive pattern on one face and a non-penetration connection hole on the other face, for exposing the conductive pattern to outside; a second substrate having a conductive pattern formed on a face opposed to the other face of first substrate and a conductive bump on the conductive pattern integrally. The first substrate and the second substrate are integrated by engaging the bump of the second substrate with the connection hole of the first substrate and by intervening a conductive cement between the bumps and the conductive pattern exposed to outside from the connection holes.Type: GrantFiled: April 10, 2003Date of Patent: July 10, 2012Assignee: Sony CorporationInventors: Kentaro Fujii, Yoshio Watanabe, Toru Takebe
-
Patent number: 7980355Abstract: There is provided an acoustic diaphragm used for a loudspeaker, having an injection-molded edge molded using a thermoplastic elastomer, in which the edge is formed using a workable polyolefinic elastomer, as a material, containing a soft segment having rubber particles of 1 ?m to 10 ?m in diameter uniformly dispersed therein, and a hard segment composed of an olefinic resin, and the edge is formed into a shape allowing the resin to be aligned as being not causative of anisotropy in the physical characteristics of the edge, as a result of thin-wall molding by the injection molding.Type: GrantFiled: November 20, 2006Date of Patent: July 19, 2011Assignee: Sony CorporationInventors: Kunihiko Tokura, Masaru Uryu, Toru Takebe
-
Patent number: 7546897Abstract: A speaker diaphragm made of a resin containing a thermoplastic polymeric material is provided. The speaker diaphragm includes a changed portion formed on the diaphragm that is molded using the resin. The changed portion is formed by partially changing physical properties of the thermoplastic polymeric material for dispersing local vibrations based on a characteristic of local vibrations measured in advance.Type: GrantFiled: July 14, 2006Date of Patent: June 16, 2009Assignee: Sony CorporationInventors: Toru Takebe, Kunihiko Tokura, Masaru Uryu
-
Patent number: 7527124Abstract: Wholly aromatic polyamide fibers cut to a length of 0.5 to 5 mm are dispersedly contained in an injection-moldable thermoplastic resin, and the resin is molded by ultrahigh-speed thin-wall injection molding so as to produce a loudspeaker diaphragm in which the wholly aromatic polyamide fibers are dispersed in a direction perpendicular to the resin flow direction, whereby the loudspeaker diaphragm is improved in internal loss.Type: GrantFiled: August 8, 2006Date of Patent: May 5, 2009Assignee: Sony CorporationInventors: Kunihiko Tokura, Toru Takebe, Masaru Uryu, Takahisa Tagami
-
Publication number: 20080199028Abstract: A speaker diaphragm includes a thermoplastic resin having a three-layer structure. The three-layer structure includes a polyester film as a base material of the three-layer structure, a polyimide-based resin layer as a top layer of the three-layer structure, and another polyimide-based resin layer as a bottom layer of the three-layer structure.Type: ApplicationFiled: February 20, 2008Publication date: August 21, 2008Applicant: Sony CorporationInventors: Toru Takebe, Kunihiko Tokura, Masaru Uryu, Takahisa Tagami, Emiko Ikeda
-
Publication number: 20070133838Abstract: There is provided an acoustic diaphragm used for a loudspeaker, having an injection-molded edge molded using a thermoplastic elastomer, in which the edge is formed using a workable polyolefinic elastomer, as a material, containing a soft segment having rubber particles of 1 ?m to 10 ?m in diameter uniformly dispersed therein, and a hard segment composed of an olefinic resin, and the edge is formed into a shape allowing the resin to be aligned as being not causative of anisotropy in the physical characteristics of the edge, as a result of thin-wall molding by the injection molding.Type: ApplicationFiled: November 20, 2006Publication date: June 14, 2007Applicant: Sony CorporationInventors: Kunihiko Tokura, Masaru Uryu, Toru Takebe
-
Publication number: 20070034443Abstract: Wholly aromatic polyamide fibers cut to a length of 0.5 to 5 mm are dispersedly contained in an injection-moldable thermoplastic resin, and the resin is molded by ultrahigh-speed thin-wall injection molding so as to produce a loudspeaker diaphragm in which the wholly aromatic polyamide fibers are dispersed in a direction perpendicular to the resin flow direction, whereby the loudspeaker diaphragm is improved in internal loss.Type: ApplicationFiled: August 8, 2006Publication date: February 15, 2007Applicant: Sony CorporationInventors: Kunihiko Tokura, Toru Takebe, Masaru Uryu, Takahisa Tagami
-
Publication number: 20070017736Abstract: A speaker diaphragm made of a resin containing a thermoplastic polymeric material is provided. The speaker diaphragm includes a changed portion formed on the diaphragm that is molded using the resin. The changed portion is formed by partially changing physical properties of the thermoplastic polymeric material for dispersing local vibrations based on a characteristic of local vibrations measured in advance.Type: ApplicationFiled: July 14, 2006Publication date: January 25, 2007Applicant: Sony CorporationInventors: Toru Takebe, Kunihiko Tokura, Masaru Uryu
-
Publication number: 20050219221Abstract: A remote control device is configured so that a display direction of contents on a liquid crystal display section can be switched according to slide operation of a slide switch. The remote control device can prevent the display direction from being switched despite the intention of a user, thus more appropriately switching the display direction of contents displayed on the liquid crystal display section.Type: ApplicationFiled: March 31, 2005Publication date: October 6, 2005Applicant: Sony CorporationInventors: Kazunobu Ohkuri, Yoshio Ohashi, Masaru Uryu, Kunihiko Tokura, Taro Nakagami, Toru Takebe
-
Patent number: 6710261Abstract: A conductive bond comprises conductive colloidal particles and a dispersant for dispersing the conductive colloidal particles. A multilayer printed circuit board includes a plurality of substrates, each having a conductive pattern on at least one face thereof. Any adjacent two of the substrates are separated by an insulating layer, and the conductive pattern of a first substrate of the two substrates faces the conductive pattern of a second substrate of the two substrate. The conductive pattern of a first substrate has one or more bumps for electrical connection to the second substrate. The bump and the conductive pattern of the second substrate are bonded to each other with the conductive bond applied to the tip of the bump.Type: GrantFiled: June 18, 2002Date of Patent: March 23, 2004Assignee: Sony CorporationInventors: Toru Takebe, Yoshio Watanabe, Kentaro Fujii
-
Publication number: 20030196833Abstract: A multilayer printed circuit board which can surely establish interlayer connection with low resistance. The multilayer printed circuit board comprises: a first substrate having a conductive pattern on one face and a non-penetration connection hole on the other face, for exposing the conductive pattern to outside; a second substrate having a conductive pattern formed on a face opposed to the other face of first substrate and a conductive bump on the conductive pattern integrally. The first substrate and the second substrate are integrated by engaging the bump of the second substrate with the connection hole of the first substrate and by intervening a conductive cement between the bumps and the conductive pattern exposed to outside from the connection holes.Type: ApplicationFiled: April 10, 2003Publication date: October 23, 2003Inventors: Kentaro Fujii, Yoshio Watanabe, Toru Takebe
-
Publication number: 20030006069Abstract: A conductive bond comprises conductive colloidal particles and a dispersant for dispersing the conductive colloidal particles. A multilayer printed circuit board includes a plurality of substrates, each having a conductive pattern on at least one face thereof. Any adjacent two of the substrates are separated by an insulating layer, and the conductive pattern of a first substrate of the two substrates faces the conductive pattern of a second substrate of the two substrate. The conductive pattern of a first substrate has one or more bumps for electrical connection to the second substrate. The bump and the conductive pattern of the second substrate are bonded to each other with the conductive bond applied to the tip of the bump.Type: ApplicationFiled: June 18, 2002Publication date: January 9, 2003Inventors: Toru Takebe, Yoshio Watanabe, Kentaro Fujii
-
Patent number: 6469255Abstract: There is provided a composite wiring board that occupies a small space and is low in price and a manufacturing method thereof; the composite wiring board comprises at least two rigid wiring boards on end faces of which connection portions are formed, in which each of the rigid wiring boards is arranged so that each of the connection portions is situated on a plane and each of corresponding connection portions is connected with each other in the plane.Type: GrantFiled: May 16, 2001Date of Patent: October 22, 2002Assignee: Sony CorporationInventors: Yoshio Watanabe, Toru Takebe, Mayumi Kosemura
-
Publication number: 20020006503Abstract: There is provided a composite wiring board that occupies a small space and is low in price and a manufacturing method thereof; the composite wiring board comprises at least two rigid wiring boards on end faces of which connection portions are formed, in which each of the rigid wiring boards is arranged so that each of the connection portions is situated on a plane and each of corresponding connection portions is connected with each other in the plane.Type: ApplicationFiled: May 16, 2001Publication date: January 17, 2002Inventors: Yoshio Watanabe, Toru Takebe, Mayumi Kosemura