Abstract: A coil device 2 including a core 4, a coil 6 having a winding 60 embedded inside the core 4, and a lead-out 6b led out from the winding 60 to a bottom 4a of the core 4. The lead-out 6b includes a terminal 61 arranged at the bottom 4a of the core 4, the terminal 61 includes an embedded part 610 embedded inside the core 4 and an exposed part 611 exposed from the core 4. A metal layer 8 is formed on a surface of the exposed part 611.

Abstract: Disclosed herein is a coil component that includes a magnetic element body, a coil conductor embedded in the magnetic element body and having an end portion exposed from the magnetic element body, and a terminal electrode connected to the end portion of the coil conductor. The terminal electrode includes a conductive resin contacting the end portion of the coil conductor and containing conductive particles and a resin material, and a metal film covering the conductive resin. The end portion of the coil conductor has an exposed surface exposed from the magnetic element body and contacting the conductive resin and a non-exposed surface covered with the magnetic element body. The exposed surface is larger in surface roughness than the non-exposed surface.

Abstract: Disclosed herein is a coil component that includes a magnetic element body, a coil conductor embedded in the magnetic element body and having an end portion exposed from the magnetic element body, and a terminal electrode connected to the end portion of the coil conductor. The terminal electrode includes a conductive resin contacting the end portion of the coil conductor and containing conductive particles and a resin material, and a metal film covering the conductive resin. The conductive resin including a first conductive resin contacting the end portion of the coil conductor, and a second conductive resin contacting the metal film without contacting the end portion of the coil conductor. A specific surface area of the conductive particles contained in the first conductive resin is larger than that of a conductive particles contained in the second conductive resin.

Abstract: A coil device 2 comprises an element body 4 including a magnetic body, a coil 6? incorporated in the element body 4, and a terminal electrode 8 connected to a lead portion of the coil 6?. A shielding layer 10 including a metal and a resin is formed on at least one outer surface 4a of the element body 4.

Abstract: An element body 4 includes a metal particle dispersion element 15 in which metal particles 12 are dispersed. A surface of the metal particle dispersion element 15 includes an indicator area 10. The indicator area 10 includes a recess 10a having a predetermined depth measured from a reference plane L of the metal particle dispersion element 15. The predetermined depth D1 is deeper than D50 of the metal particles 12 included in the metal particle dispersion element 15.

Abstract: An inductor has a coil portion made of a wire wound in a coil shape and an element body in which the coil portion is provided. The element body has a first core member, a second core member, and a third core member. The first core member has a winding core portion configured to be positioned inside the coil portion. The second core member is accommodated in the winding core portion. The third core member covers the coil portion and the first core member in which the second core member is accommodated in the winding core portion.

Abstract: A coil device including: a core containing magnetic particles and a resin component; a coil including a conductor having a coil shape; and a terminal electrode formed on a part of an outer surface of the core and electrically connected to an end of the conductor drawn from the coil. The terminal electrode includes a first electrode layer in contact with the end of the conductor and a second electrode layer located outside the first electrode layer. The first electrode layer and the second electrode layer both include conductive powder and resin, and a content of the resin in the second electrode layer is higher than a content of the resin in the first electrode layer.

Abstract: An element body includes a metal-particle-dispersed body in which metal particles are dispersed, the metal-particle-dispersed body includes a display region on a surface, and the display region includes a display pattern in which a resin exposed portion where a resin appears on a surface and a metal exposed portion where the metal particles appear on the surface are alternately repeated.

Abstract: Disclosed herein is a coil component that includes a plate-like base member, a magnetic core mounted on the base member, a wire wound around the magnetic core such that an axis direction thereof is substantially parallel to the base member, and a terminal electrode fixed to the base member and connected to an end portion of the wire. The base member is made of a material having a permeability lower than that of the magnetic core.

Abstract: An electronic component according to the present invention includes: a leadout electrode portion provided on an outer surface of an element main body; and a resin electrode layer formed at a part of the outer surface of the element main body and connected to the leadout electrode portion. The leadout electrode portion contains copper as a main component, and the resin electrode layer includes a conductor powder containing silver, and a resin. Further, a diffusion layer containing copper oxide and silver is formed at an interface between the leadout electrode portion and the resin electrode layer.

Abstract: An electronic component according to the present invention includes: an element body containing metal particles and a resin; and a resin electrode layer formed on an electrode facing portion which is a part of an outer surface of the element body. The resin electrode layer contains a resin component and a conductor powder. In addition, the electrode facing portion includes an exposed portion formed by removing the resin on an outermost surface of the element body to expose a part of an outer periphery of the metal particles located on the outermost surface. Then, the resin electrode layer and the exposed portion of the electrode facing portion are joined to each other.

Abstract: Disclosed herein is a coil component that includes a magnetic element body, a coil conductor embedded in the magnetic element body and having an end portion exposed from the magnetic element body, and a terminal electrode connected to the end portion of the coil conductor. The terminal electrode includes a conductive resin contacting the end portion of the coil conductor and containing conductive particles and a resin material, and a metal film covering the conductive resin. The end portion of the coil conductor has an exposed surface exposed from the magnetic element body and contacting the conductive resin and a non-exposed surface covered with the magnetic element body. The exposed surface is larger in surface roughness than the non-exposed surface.

Abstract: Disclosed herein is a coil component that includes a magnetic element body, a coil conductor embedded in the magnetic element body and having an end portion exposed from the magnetic element body, and a terminal electrode connected to the end portion of the coil conductor. The terminal electrode includes a conductive resin contacting the end portion of the coil conductor and containing conductive particles and a resin material, and a metal film covering the conductive resin. The conductive resin including a first conductive resin contacting the end portion of the coil conductor, and a second conductive resin contacting the metal film without contacting the end portion of the coil conductor. A specific surface area of the conductive particles contained in the first conductive resin is larger than that of a conductive particles contained in the second conductive resin.

Abstract: An inductor has a coil portion made of a wire wound in a coil shape and an element body in which the coil portion is provided. The element body has a first core member, a second core member, and a third core member. The first core member has a winding core portion configured to be positioned inside the coil portion. The second core member is accommodated in the winding core portion. The third core member covers the coil portion and the first core member in which the second core member is accommodated in the winding core portion.

Abstract: A thick film green sheet slurry, a production method of thick film green sheet slurry, a production method of a thick film green sheet, a thick film green sheet and a production method of an electronic device are provided; by which coating of a relatively thick film becomes possible, a sheet formed after coating has excellent cutting property (strength capable of being cut), and a sheet having high air permeability, excellent handleability and a high adhesive force can be formed. In the present invention, a thick film green sheet slurry comprises a ceramic powder, a binder resin including a butyral based resin as the main component, and a solvent: wherein the solvent includes a good solvent for letting the binder resin dissolved well therein and a poor solvent having lower solubility to the binder resin comparing with that of the good solvent; and the poor solvent is included in a range of 30 to 60 wt % with respect to the entire solvent.

Abstract: A thick film green sheet slurry, a production method of thick film green sheet slurry, a production method of a thick film green sheet, a thick film green sheet and a production method of an electronic device are provided; by which coating of a relatively thick film becomes possible, a sheet formed after coating has excellent cutting property (strength capable of being cut), and a sheet having high air permeability, excellent handleability and a high adhesive force can be formed. In the present invention, a thick film green sheet slurry comprises a ceramic powder, a binder resin including a butyral based resin as the main component, and a solvent: wherein the solvent includes a good solvent for letting the binder resin dissolved well therein and a poor solvent having lower solubility to the binder resin comparing with that of the good solvent; and the poor solvent is included in a range of 30 to 60 wt % with respect to the entire solvent.

Abstract: A laminated ceramic electronic component includes a ceramic substrate, an internal electrode, and a buffer layer. The ceramic substrate includes a protective layer and a functional layer. The protective layer is disposed on at least one side of the functional layer. The internal electrode is embedded in the functional layer. The buffer layer is embedded in the protective layer and has a different burning shrinkage from the ceramic substrate.

Abstract: A laminated ceramic electronic component has a plurality of conductive layers embedded in a ceramic substrate. The laminated ceramic electronic component includes: a functional area composed of the plurality of conductive layers and ceramic layers interposed therebetween; and a protective area formed around the functional area to have a ring-like cross section. The laminated ceramic electronic component satisfies the following condition: 0<t/Wg?0.80, where t represents a wall thickness of the protective area in a vertical direction, and Wg represents a wall thickness of the protective area in a transverse direction.

Abstract: Internal electrode layers are superimposed in a dielectric substrate 1 at intervals. Step absorption layers are respectively provided on lateral sides of the internal electrode layers. A side portion of the internal electrode layer forms an inclined surface, and the step absorption layer is superimposed so as to partially overlap the inclined surface of the internal electrode layer. This is also applied to the other internal electrode layers and step absorption layers.

Abstract: A laminated ceramic electronic component has a plurality of conductive layers embedded in a ceramic substrate. The laminated ceramic electronic component includes: a functional area composed of the plurality of conductive layers and ceramic layers interposed therebetween; and a protective area formed around the functional area to have a ring-like cross section. The laminated ceramic electronic component satisfies the following condition: 0<t/Wg?0.80, where t represents a wall thickness of the protective area in a vertical direction, and Wg represents a wall thickness of the protective area in a transverse direction.