Patents by Inventor Toru Ueki

Toru Ueki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8436126
    Abstract: The present invention provides a resin composition for an adhesive sheet, comprising an acrylic copolymer containing (A) an acrylate ester, methacrylate ester, or a mixture thereof, (B) acrylonitrile, methacrylonitrile, or a mixture thereof, and (C) an unsaturated carboxylic acid; an epoxy resin; and a curing agent, wherein the curing agent comprises at least one selection from Lewis acid-amine complexes.
    Type: Grant
    Filed: July 17, 2007
    Date of Patent: May 7, 2013
    Assignee: Arisawa Mfg. Co., Ltd.
    Inventors: Shinichi Hasegawa, Fumiki Higuchi, Toru Ueki
  • Patent number: 7335460
    Abstract: An object of the present invention is to provide a photosensitive thermosetting resin composition that has a long shelf life and has excellent normal temperature storage stability, has good solder heat resistance after curing, and according to which high adhesive strength can be maintained. The present invention provides a photosensitive thermosetting resin composition containing a photosensitive prepolymer, a photosensitive monomer, a thermosetting resin, a curing agent, and a polymerization initiator, the photosensitive thermosetting resin composition containing (A) a carboxylic acid-modified bisphenol type epoxy (meth)acrylate as the photosensitive prepolymer.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: February 26, 2008
    Assignee: Arisawa Mfg. Co., Ltd.
    Inventors: Shinichi Hasegawa, Toru Ueki
  • Publication number: 20080021163
    Abstract: The present invention provides a resin composition for an adhesive sheet, comprising an acrylic copolymer containing (A) an acrylate ester, methacrylate ester, or a mixture thereof, (B) acrylonitrile, methacrylonitrile, or a mixture thereof, and (C) an unsaturated carboxylic acid; an epoxy resin; and a curing agent, wherein the curing agent comprises at least one selection from Lewis acid-amine complexes.
    Type: Application
    Filed: July 17, 2007
    Publication date: January 24, 2008
    Applicant: Arisawa Mfg. Co., Ltd.
    Inventors: Shinichi Hasegawa, Fumiki Higuchi, Toru Ueki
  • Publication number: 20070009834
    Abstract: An object of the present invention is to provide a photosensitive thermosetting resin composition that has a long shelf life and has excellent normal temperature storage stability, has good solder heat resistance after curing, and according to which high adhesive strength can be maintained. The present invention provides a photosensitive thermosetting resin composition containing a photosensitive prepolymer, a photosensitive monomer, a thermosetting resin, a curing agent, and a polymerization initiator, the photosensitive thermosetting resin composition containing (A) a carboxylic acid-modified bisphenol type epoxy (meth)acrylate as the photosensitive prepolymer.
    Type: Application
    Filed: July 6, 2006
    Publication date: January 11, 2007
    Applicant: Arisawa Mfg. Co., Ltd.
    Inventors: Shinichi Hasegawa, Toru Ueki
  • Patent number: 5349027
    Abstract: A modified polyolefin resin obtained by reacting a polyolefin resin with an epoxy group-containing acrylamide monomer represented by the following general formula I:H.sub.2 C.dbd.CR--CO--NH--CH.sub.2 --Ar:wherein Ar represents an aromatic hydrocarbon group having 6 to 24 carbon atoms which is substituted with at least one glycidyloxy group and R represents a hydrogen atom or a methyl group) in the presence of a free-radical initiator is herein provided.A thermoplastic resin composition comprising 5 to 95% by weight of the foregoing modified polyolefin resin and 95 to 5% by weight of another thermoplastic resin is herein provided.Further, a filler-reinforced polyolefin resin composition comprising 100 parts by weight of the foregoing modified polyolefin resin and 3 to 300 parts by weight of an inorganic or organic filler is herein provided.
    Type: Grant
    Filed: September 16, 1992
    Date of Patent: September 20, 1994
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Toru Ueki, Masaji Yoshimura, Kazuharu Kanezaki, Susumu Kishi, Takashi Satoh, Minoru Takiguchi
  • Patent number: 5263566
    Abstract: The present invention relates to a coin discriminating apparatus and method for discriminating genuine coins from counterfeit coins, and determining their denominations. And more particularly, the present invention purports to detect genuine coins based on the inherent difference in degree of peripheral thickening or convex configuration between genuine coins and counterfeit coins so as to provide a coin discriminating apparatus and method capable of preventing counterfeit coins from being used in an unauthorized or unfair way. In one specific example, there is provided a thickness detecting sensor 8 adjacent to a coin passage, and a coin face contour detecting apparatus 11 measures a time during which an output of the thickness sensor 8 exceeds a threshold value 22, thereby detecting degree of peripheral thickening or convex configuration of coins to discriminate genuine coins from counterfeit.
    Type: Grant
    Filed: April 1, 1992
    Date of Patent: November 23, 1993
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takehiko Nara, Toru Ueki
  • Patent number: 5149465
    Abstract: A conductive resin composition which has electrical conductivity and antistatic property, is excellent in heat resistance and processability, and comprises:(A) from 50 to 95% by weight of a polyphenylene ether resin,(B) from 50 to 5% by weight of a copolymer of a styrenic compound and an .alpha.,.beta.-unsaturated dicarboxylic acid imide compound,(C) from 5 to 30 parts by weight of a conductive carbon per 100 parts by weight of the sum of the resin (A) and the copolymer (B), and (D) from 1 to 20 parts by weight of a low molecular weight polystyrene per 100 parts by weight of the sum of the resin (A) and the copolymer (B).
    Type: Grant
    Filed: March 25, 1991
    Date of Patent: September 22, 1992
    Assignee: Mitsui Toatsu Chemicals, Incorporated
    Inventors: Toru Ueki, Kenji Sakata, Masaji Yoshimura, Kazuharu Kanezaki, Ineo Iwata
  • Patent number: 5075035
    Abstract: A molding material for electroconductive IC parts is here provided which has a preferable heat distortion temperature (heat resistance) and a desirable melt flow index (moldability) and which supplies molded articles having a suitable surface specific resistance. The above-mentioned molding material comprises 50% by weight or more of a polyphenylene ether resin, electroconductive carbon, an acid imide compound which can be used depending upon an intrinsic viscosity of the polyphenylene ether resin, a high-impact polystyrene resin and an A--B--A' type block copolymer elastomer.
    Type: Grant
    Filed: August 15, 1989
    Date of Patent: December 24, 1991
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Toru Ueki, Masaji Yoshimura, Kazuharu Kanezaki, Takashi Satoh, Ineo Iwata, Susumu Kishi
  • Patent number: 4983435
    Abstract: As an adhesive used between a polypropylene layer and an ethylene/vinyl alcohol copolymer layer, there is provided an adhesive composition that comprises 98.9 to 59.9% by weight of a modified polypropylene (A) partly or fully grafted with an unsaturated carboxylic acid or its derivative, 1.0 to 40% by weight of an ethylene/.alpha.-olefin copolymer (B) having a density of 0.915 to 0.940 g/cc, and a melting point of 115.degree. to 130.degree. C., and 0.1% by weight or more but less than 3% by weight of a hydrocarbon type synthetic elastomer (C).
    Type: Grant
    Filed: October 31, 1988
    Date of Patent: January 8, 1991
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Toru Ueki, Hajime Sentoku, Takashi Miyazaki, Eiichi Sugihara
  • Patent number: 4869938
    Abstract: Disclosed herein is a polypropylene sheet obtained by forming a resin composition, which contains a polypropylene resin and a hydrogenated petroleum resin in specific amounts, into a sheet at a particular chill-roll temperature and then annealing the sheet at a specific temperature for a specific period of time as well as an improved production process of such a polypropylene sheet. Also disclosed is a polypropylene sheet comprising a sheet obtained from the above resin composition and a polypropylene layer of at least 10 .mu.m thick applied on at least one side of the sheet. A polypropylene resin composition suitable for the production of such polypropylene sheets is also disclosed. The above polypropylene sheets are suitable for use in press-through packages.
    Type: Grant
    Filed: August 22, 1986
    Date of Patent: September 26, 1989
    Assignee: Mitsui Toatsu Chemicals Inc.
    Inventors: Katsuyuki Usami, Toru Ueki, Hajime Sentoku, Takashi Takahashi, Kazuharu Kanezaki
  • Patent number: 4826735
    Abstract: A polypropylene resin composition is provided by incorporating a metal salt of a fatty acid and the oxide or hydroxide of an alkaline earth metal, each, in an amount of 0.05-1 part by weight based on 100 parts by weight of polypropylene. The polypropylene resin composition shows excellent thermal processing stability even when subjected to remelting and extrusion molding after mixing of a scrap recycled from the production of multi-layered containers or sheets each of which is formed of a gas barrier layer made of nylon or an ethylene-vinyl alcohol copolymer and another layer made of a polypropylene resin composition.
    Type: Grant
    Filed: September 10, 1986
    Date of Patent: May 2, 1989
    Assignees: Mitsui Toatsu Chemicals, Incorporated, Toyo Seikan Kaisha Ltd.
    Inventors: Toru Ueki, Jinichi Yazaki, Akihiko Tamura, Hideo Amemiya, Takashi Miyazaki
  • Patent number: 4749074
    Abstract: A coin sorting apparatus in which the oscillation constants of oscillators change with the passage of a coin, and the amount of change in each of the oscillation constants or a value converted therefrom is compared with a reference value of a coin to be identified which is stored in a memory to identify whether the coin is genuine and the class thereof. Whether the reference values for each coin are corrected is determined by a plurality of counters which correct the reference values of corresponding classes of coins when their counts exceed a predetermined set value. At the same time, when the inserted coin is identified as genuine, a corresponding counter is activated, thus improving the performance of eliminating spurious coins without reducing the acceptability of genuine coins even under ambient temperature changes or secular variations of component elements with time.
    Type: Grant
    Filed: October 11, 1985
    Date of Patent: June 7, 1988
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toru Ueki, Shigeru Kakimi
  • Patent number: 4705154
    Abstract: A coin selection apparatus comprises a plurality of detection coils and an oscillation circuit which detects changes of impedances of the detection coils caused when a coin pass through the detection coils, as a change of a voltage output. The plurality of detection coils include at least two sets of detection coils each including two detection coils opposingly arranged to the coin path. One set of detection coils has its two coils connected in series and in phase and the other set of detection coil has its two coils connected in series and in phase opposition. The two sets of coils are arranged at a spacing along the coin path smaller than a minimum diameter of a coin to be selected and all of the coils are connected in series and connected as a resonance element of the oscillation circuit. Thus, material, thickness and diameter and other appearance characteristic of the coin are detected based on the voltage output of the oscillation circuit.
    Type: Grant
    Filed: September 23, 1985
    Date of Patent: November 10, 1987
    Assignee: Matsushita Electric Industrial Co. Ltd.
    Inventors: Yukio Masho, Shigeru Kakimi, Toru Ueki, Satoshi Miyauchi, Tugio Ohigashi, Hitoshi Kurohata
  • Patent number: 4617207
    Abstract: Disclosed herein are thermoplastic resin sheets having a thermal shrinkage within .+-.0.3%, and a process for producing thermoplastic resin sheets by co-extruding a first thermoplastic resin and a second thermoplastic resin which is nonadhesive to the first thermoplastic resin, into a sheet-like structure so that the first thermoplastic resin is covered on both surfaces thereof with the second thermoplastic resin and then peeling off the resulting outer layers of the second thermoplastic resin B to obtain a sheet of the first thermoplastic resin. The thermoplastic resin sheets obtained in accordance with the above production process have an extremely small thermal shrinkage, undergo an extremely low degree of mechanical strain, and exhibits a little optical anisotropy. Because of the small thermal shrinkage, they may be used in liquid crystal displays (LCDs), poultice or sticker.
    Type: Grant
    Filed: August 9, 1984
    Date of Patent: October 14, 1986
    Assignee: Mitsui Toatsu Chemicals, Incorporated
    Inventors: Toru Ueki, Yoshiaki Fukuda, Katsuyuki Usami, Kazuharu Kanasaki