Abstract: The purpose of the present invention is to provide tablets which contain magnesium oxide particles capable of achieving both of the reduction in friability and the reduction in a capping occurrence rate as a main component. Provided are tablets each of which comprises granules comprising both of magnesium oxide particles and an internal additive and an external additive, in which at least cellulose and/or a cellulose derivative is contained as the internal additive and the external additive and the [cellulose and/or a cellulose derivative contained as the internal additive]:[cellulose and/or a cellulose derivative contained as the external additive] ratio falls within the range from 75:25 to 10:90 by mass.

Abstract: An acoustic wave device includes a piezoelectric layer, at least one pair of electrodes, and a protective film. The piezoelectric layer includes first and second major surfaces opposing each other in a first direction. The at least one pair of electrodes are on at least one of the first and second major surfaces. The protective film covers at least a portion of the pair of electrodes. The protective film includes a first-component insulative film including a first component and in contact with the pair of electrodes, and a second-component insulative film including a second component and located at the surface layer of the protective film. The first-component insulative film has a higher moisture resistance than the second-component insulative film. The second-component insulative film has a higher plasma resistance than the first-component insulative film.

Abstract: An electronic component includes a mounting substrate, and first and second devices each including a functional element. The first device is spaced apart from and faces the mounting substrate. The second device is located on the mounting substrate and faces the first device. A functional element of the first device is located on a first surface facing the second device, in the first device. A functional element of the second device is located on a second surface facing the first device, in the second device.

Abstract: An acoustic resonator is provided that included a substrate; a piezoelectric layer supported by the substrate; and an interdigital transducer (IDT) on a surface of the piezoelectric layer that faces the substrate, with the IDT including a plurality of interleaved fingers. Moreover, the acoustic resonator includes an acoustic reflector, such as a Bragg reflector, disposed between the substrate and the piezoelectric layer. The acoustic reflector includes acoustic impedance layers with one or more layers having a shape that conforms to the interleaved fingers disposed on the surface of the piezoelectric layer.

Abstract: An acoustic wave device includes a support, a piezoelectric layer on the support, an IDT electrode on the piezoelectric layer and including busbars and electrode fingers, and mass-added films on the electrode fingers. An acoustic reflection portion is provided in the support and overlaps at least a portion of the IDT electrode. d/p is about 0.5 or less. When viewed in an electrode finger orthogonal direction, a region in which the electrode fingers adjacent to each other overlap each other is an intersecting region including a central region, and first and second edge regions. At least a portion of the mass-added films overlaps the central region in plan view.

Abstract: An acoustic wave device includes a support including a support substrate, a piezoelectric layer on the support in a first direction, a functional electrode on the piezoelectric layer, and a reinforcement film on the piezoelectric layer. The support includes a space portion that opens on a side of the piezoelectric layer, and an extended passage extending farther toward an outer side than an edge of the space portion in a second direction intersecting the first direction. A through-hole is provided at a position not overlapping the functional electrode in plan view in the first direction, communicates with the extended passage, and penetrates the piezoelectric layer. The reinforcement film is provided in a region between the through-hole and the space portion and overlaps at least a portion of a region where the piezoelectric layer and the extended passage overlap each other in the plan view.

Abstract: An acoustic wave device includes a piezoelectric substrate including a functional electrode on a first main surface of the piezoelectric substrate, a functional wire on the first main surface and connected to the functional electrode, and a connection wire on the first main surface, connected to the functional wire, and extending to an edge portion of the first main surface. An acoustic wave element chip is defined by the piezoelectric substrate, the functional electrode, the functional wire, and the connection wire. The acoustic wave device includes a mounting substrate on which the acoustic wave element chip is mounted and including a third main surface facing the first main surface of the piezoelectric substrate, and a mounting substrate wire on the third main surface. D1<(D22+H12)0.5 is satisfied.

Abstract: An acoustic wave device includes an element substrate, a piezoelectric layer, a functional electrode on the piezoelectric layer, and a mounting substrate. The element substrate includes a gap portion at a position overlapping at least a portion of the functional electrode as seen in a lamination direction of the element substrate and the piezoelectric layer, and the mounting substrate includes a ground electrode at a position overlapping the functional electrode in the lamination direction.

Abstract: A transmit/receive module includes plural duplexers, a power amplifier, and a sending transmission line. The plural duplexers operate in bands different from each other and each includes a transmit filter and a receive filter. The power amplifier amplifies signals of pass bands of the plural transmit filters and outputs the amplified signals. The sending transmission line is connected to the plural transmit filters. The signals of the pass bands of the plural transmit filters output from the power amplifier are transmitted through the sending transmission line.

Abstract: An acoustic wave device includes first and second acoustic wave elements. The first acoustic wave element is disposed on a piezoelectric substrate, and includes at least one first IDT electrode. The second acoustic wave element is disposed on the piezoelectric substrate, and includes at least one second IDT electrode. The first and second acoustic wave elements are adjacent to each other in the direction of acoustic wave propagation. A diffracting component that diffracts an acoustic wave is disposed between the first IDT electrode and the second IDT electrode. The diffracting component includes a gap that defines and functions as a slit to diffract an acoustic wave.

Abstract: An acoustic wave filter includes a first resonance circuit including a first series arm resonator and a first capacitive element. The first series arm resonator is provided on a path connecting a first terminal and a second terminal. The first capacitive element is coupled in parallel with the first series arm resonator. The first series arm resonator includes a first divided resonator and a second divided resonator coupled in series with each other. The first resonance circuit includes a second resonance circuit including the first divided resonator and a second capacitive element coupled in parallel with the first divided resonator.

Abstract: A surface acoustic wave device comprises a substrate and an interdigital transducer (IDT) electrode disposed on the substrate. The IDT electrode includes a lower electrode layer having a lower surface in contact with an upper surface of the substrate and an upper electrode layer having a lower surface defining a base in contact with an upper surface of the lower electrode layer. Side surfaces of the lower electrode layer are substantially perpendicular to the upper surface of the substrate. Side surfaces of the upper electrode layer are disposed at an acute angle relative to the upper surface of the substrate.

Abstract: An electronic component includes a mounting substrate, and first and second devices each including a functional element. The first device is spaced apart from and faces the mounting substrate. The second device is located on the mounting substrate and faces the first device. A functional element of the first device is located on a first surface facing the second device, in the first device. A functional element of the second device is located on a second surface facing the first device, in the second device.

Abstract: An electronic device package includes a lower surface for conducting electronic signals, a first solder bond pad having a first size disposed on the lower surface, and a plurality of second solder bond pads having second sizes smaller than the first size disposed on the lower surface and surrounding the first solder bond pad.

Abstract: An electronic device package includes a lower surface for conducting electronic signals, a first solder bond pad having a first size disposed on the lower surface, and a plurality of second solder bond pads having second sizes smaller than the first size disposed on the lower surface and surrounding the first solder bond pad.

Abstract: An acoustic wave device includes first and second acoustic wave elements. The first acoustic wave element is disposed on a piezoelectric substrate, and includes at least one first IDT electrode. The second acoustic wave element is disposed on the piezoelectric substrate, and includes at least one second IDT electrode. The first and second acoustic wave elements are adjacent to each other in the direction of acoustic wave propagation. A diffracting component that diffracts an acoustic wave is disposed between the first IDT electrode and the second IDT electrode. The diffracting component includes a gap that defines and functions as a slit to diffract an acoustic wave.

Abstract: An acoustic wave filter includes a first resonance circuit including a first series arm resonator and a first capacitive element. The first series arm resonator is provided on a path connecting a first terminal and a second terminal. The first capacitive element is coupled in parallel with the first series arm resonator. The first series arm resonator includes a first divided resonator and a second divided resonator coupled in series with each other. The first resonance circuit includes a second resonance circuit including the first divided resonator and a second capacitive element coupled in parallel with the first divided resonator.

Abstract: A SAW element configured to suppress spurious emissions resulting from non-periodicity of an IDT electrode finger arrangement. In one example, the SAW element is a resonator comprising an IDT electrode including a first plurality of IDT electrode fingers connected to a first busbar and a second plurality of IDT electrode fingers connected to a second busbar, and reflectors having a plurality of reflector fingers. The pluralities of first and second IDT electrode fingers are alternatively connected to each busbar by either normal connections or reversed connections and include regions arranged by at least two different types of pitches. The normal connections are such that either the odd-numbered or even-numbered IDT electrode fingers connect to the first busbar, and the reversed connections are such that the opposite group of IDT electrode fingers connect to the first busbar.

Abstract: A transmit/receive module includes plural duplexers, a power amplifier, and a sending transmission line. The plural duplexers operate in bands different from each other and each includes a transmit filter and a receive filter. The power amplifier amplifies signals of pass bands of the plural transmit filters and outputs the amplified signals. The sending transmission line is connected to the plural transmit filters. The signals of the pass bands of the plural transmit filters output from the power amplifier are transmitted through the sending transmission line.

Abstract: An electronic device package includes a lower surface for conducting electronic signals, a first solder bond pad having a first size disposed on the lower surface, and a plurality of second solder bond pads having second sizes smaller than the first size disposed on the lower surface and surrounding the first solder bond pad.