Patents by Inventor Tosaku Nishiyama

Tosaku Nishiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of Manufacturing a multi-layer circuit board
    Patent number: 6687985
    Abstract: A multilayer wiring board comprising a mother wiring board and a carrier wiring board, in which all of the composing layers have IVH structure. The mother wiring board (11) is formed in the manner that a plurality of resin-impregnated-fiber-sheets having mother wiring layers (13) and first inner-via-hole conductors (14) for connecting the wiring layers (13) each other are laminated. The mother wiring board (11) comprises a base board (11a) and container board (11b) having an opening for forming a cavity (15). The carrier wiring board (16) has lands (17) for mounting LSI bare chips, wirings (18), a plurality of carrier-board-wiring-layers (19) and second inner-via-hole conductors (20) for connecting the wiring layers (19) each other.
    Type: Grant
    Filed: July 12, 2001
    Date of Patent: February 10, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazunori Sakamoto, Hideo Hatanaka, Yukihiro Ishimaru, Tosaku Nishiyama
  • Multi-layer circuit board and method of manufacturing the same
    Publication number: 20020020554
    Abstract: A multilayer wiring board comprising a mother wiring board and a carrier wiring board, in which all of the composing layers have IVH structure. The mother wiring board (11) is formed in the manner that a plurality of resin-impregnated-fiber-sheets having mother wiring layers (13) and first inner-via-hole conductors (14) for connecting the wiring layers (13) each other are laminated. The mother wiring board (11) comprises a base board (11a) and container board (11b) having an opening for forming a cavity (15). The carrier wiring board (16) has lands (17) for mounting LSI bare chips, wirings (18), a plurality of carrier-board-wiring-layers (19) and second inner-via-hole conductors (20) for connecting the wiring layers. (19) each other.
    Type: Application
    Filed: July 12, 2001
    Publication date: February 21, 2002
    Inventors: Kazunori Sakamoto, Hideo Hatanaka, Yukihiro Ishimaru, Tosaku Nishiyama
  • Multi-layered circuit board and method of manufacturing the same
    Patent number: 6281446
    Abstract: A multilayer wiring board comprising a mother wiring board and a carrier wiring board, in which all of the composing layers have IVH structure. The mother wiring board (11) is formed in the manner that a plurality of resin-impregnated-fiber-sheets having mother wiring layers (13) and first inner-via-hole conductors (14) for connecting the wiring layers (13) each other are laminated. The mother wiring board (11) comprises a base board (11a) and container board (11b) having an opening for forming a cavity (15). The carrier wiring board (16) has lands (17) for mounting LSI bare chips, wirings (18), a plurality of carrier-board-wiring-layers (19) and second inner-via-hole conductors (20) for connecting the wiring layers (19) each other.
    Type: Grant
    Filed: February 16, 1999
    Date of Patent: August 28, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazunori Sakamoto, Hideo Hatanaka, Yukihiro Ishimaru, Tosaku Nishiyama