Abstract: A work piece is mixed with Ni pieces having an average diameter of 1 mm and exhibiting catalytic activity to oxidation reaction of sodium phosphinate (NaH2PO2) added as a reducing agent in a plating bath containing the reducing agent and a Ni salt to form a Ni—P film on an electrode made of Cu, Ag or Ag—Pd by auto-catalytic electroless plating. Then, the work piece is dipped in a plating bath containing an Au salt to form an Au film on the surface of the Ni—P film by substitutional electroless plating. This method is capable of forming a desired plating film only on a desired portion at a low cost.

Abstract: A work piece is mixed with Ni pieces having an average diameter of 1 mm and exhibiting catalytic activity to oxidation reaction of sodium phosphinate (NaH2PO2) added as a reducing agent in a plating bath containing the reducing agent and a Ni salt to form a Ni—P film on an electrode made of Cu, Ag or Ag—Pd by auto-catalytic electroless plating. Then, the work piece is dipped in a plating bath containing an Au salt to form an Au film on the surface of the Ni—P film by substitutional electroless plating. This method is capable of forming a desired plating film only on a desired portion at a low cost.

Abstract: The present invention provides a method for forming a desired plating film on a desired place at a reasonable cost. When workpieces are mixed in a plating solution containing Ni ions with a great number of Zn particles having an average diameter of 1 mm and having an electrochemically base immersion potential with respect to the precipitation potential of Ni, the Zn particles are dissolved and generates electrons, the potential of Cu electrodes in contact with the Zn particles is shifted to an electrochemically base potential side, and hence the Ni ions are precipitated on the electrodes, thereby forming Ni plating films on the surfaces of the electrodes.

Abstract: A choke coil equipped with a bobbin which is easy to form, which is resistant to mechanical impacts and which is light in weight and inexpensive. A bobbin 2 is formed, for example, by fitting or gluing together a bobbin member 21 formed of a magnetic substance and a bobbin member 22 formed of a non-magnetic substance. The magnetic substance bobbin member 21 is equipped with a core portion 23a with flange members 24a and 25a at the ends thereof and a flange member 26a provided in the central section thereof. The non-magnetic substance bobbin member 22 is equipped with a tubular portion 23b with flange members 24b and 25b provided at the ends thereof and a flange member 26b provided in the central section thereof. A tubular body portion 23 of the bobbin 2 is formed by the core portion 23a and the tubular portion 23b, and flange portions 24, 25 and 26 of the bobbin 2 are respectively formed by flange members 24a/24b, 25a/25b and 26a/26b.

Abstract: A work holder (12) for holding a workpiece (2) while partially masking the same by use of a mask (18). The workpiece and the mask are elastically pressed against each other by an aggregate (15) of heat-resistant fiber such as metal fiber or ceramic fiber, so that the workpiece and the mask are brought into close contact with each other. This work holder is adapted to form a resistor film (9) on a part of the surface of a chip (2) to form a chip-type resistor (1), for example, by a thin film forming method such as sputtering.

Abstract: A variable resistor of a type for mounting against the surface of a printed circuit substrate, the variable resistor having:an insulating substrate having one surface for supporting a resistor and an opposite surface for being positioned against the surface of a printed circuit substrate;a curved resistor on the one surface of the insulating substrate and having opposite ends;a sliding member rotatably mounted on the insulating substrate and sliding on the resistor;a plurality of outside electrodes on the insulating substrate, one for each end of the curved resistor, and extending from the corresponding end of the resistor along the one surface of the insulating substrate, along an edge of the insulating substrate, and along the opposite surface of the insulating substrate, each outside electrode having a three layer structure constituted by a lower layer against the insulating substrate, a middle layer and an outer layer, the lower layer being an electrically conductive material suitable for plating, the mid

Abstract: A chip inductor having a pair of terminal electrodes formed on the surface of a magnetic core which holds a winding therearound. The terminal electrodes have films which are made from a nickel alloy having a relatively high resistivity and a relatively low magnetic permeability. Such nickel alloys includes, for example, nickel-chromium alloy, nickel-phosphorus alloy and nickel-copper alloy.

Abstract: A thin-film resistor comprising a thin film of a nitride of at least one element belonging to groups III-VI of the periodic table. The thin-film resistor has a metal oxide layer comprising at least one metal oxide selected from the group consisting of manganese oxide, iron oxide, cobalt oxide, nickel oxide, zinc oxide, indium oxide, tin oxide and indium tin oxide interposed between the nitride thin film and an electrode for external connection.

Abstract: A monolithic ceramic capacitor comprises a dielectric ceramic element assembly, metal electrodes for external connection and conductive metal oxide layers formed between the ceramic element assembly and the metal electrodes for preventing reduction of metal oxide forming the dielectric ceramic material.