Abstract: A residual thermal strain distribution measurement method of measuring a residual thermal strain distribution as residual thermal deformation in a sample generated under application of a thermal load, comprises recording images of a periodic pattern present on the surface of the sample by an image recording unit at a first temperature and a sample formation temperature at which the sample is formed, generating moire fringes based on each recorded image of the periodic pattern, calculating a phase of the moire fringes for the sample at the first temperature, calculating a phase of the moire fringes for the sample at the sample formation temperature, acquiring a phase difference of the moire fringes at the sample formation temperature with respect to the first temperature, and calculating a residual thermal strain of the sample at the first temperature with respect to the sample formation temperature based on the acquired phase difference.

Abstract: A residual thermal strain distribution measurement method of measuring a residual thermal strain distribution as residual thermal deformation in a sample generated under application of a thermal load, comprises recording images of a periodic pattern present on the surface of the sample by an image recording unit at a first temperature and a sample formation temperature at which the sample is formed, generating moire fringes based on each recorded image of the periodic pattern, calculating a phase of the moire fringes for the sample at the first temperature, calculating a phase of the moire fringes for the sample at the sample formation temperature, acquiring a phase difference of the moire fringes at the sample formation temperature with respect to the first temperature, and calculating a residual thermal strain of the sample at the first temperature with respect to the sample formation temperature based on the acquired phase difference.

Abstract: Provided is a thermosetting resin composition, which can be used as underfill for obtaining favorable solder connectivity while suppressing the formation of voids in the case of treating under heating conditions required by the underfill in a semiconductor chip thermocompression bonding step using the thermal compression bonding technique. The thermosetting resin composition contains a thermosetting resin, a curing agent and a fluxing agent, and the temperature at which the rate of temperature change of viscosity when temperature is increased according to a prescribed heating profile reaches 30 Pa·s/° C. is 200° C. to 250° C.

Abstract: Provided is a thermosetting resin composition, which can be used as underfill for obtaining favorable solder connectivity while suppressing the formation of voids in the case of treating under heating conditions required by the underfill in a semiconductor chip thermocompression bonding step using the thermal compression bonding technique. The thermosetting resin composition contains a thermosetting resin, a curing agent and a fluxing agent, and the temperature at which the rate of temperature change of viscosity when temperature is increased according to a prescribed heating profile reaches 30 Pa·s/° C. is 200° C. to 250° C.

Abstract: A method of predicting viscosity behavior of a thermosetting resin is provided that is capable of predicting viscosity behavior of a thermosetting resin and void generation in the underfill is suppressed while good solder connection is obtained.

Abstract: A method of predicting viscosity behavior of a thermosetting resin is provided that is capable of predicting viscosity behavior of a thermosetting resin and void generation in the underfill is suppressed while good solder connection is obtained.

Abstract: A melting/vaporization substance 2 is melted and vaporized by supplying an electric energy of a predetermined amount from an electric energy supply circuit to the melting/vaporization substance 2. An explosive blasting substance 3 is exploded by a phenomenon caused in a process of melting and vaporization of the melting/vaporization substance 2, so that a to-be-blasted object 4 is blasted by that explosive force.