Abstract: A printed wiring board includes a substrate having first and second surfaces such that the substrate has a thickness in a range of 30 ?m to 100 ?m between the first and second surfaces, and through hole conductors including plating material such that the through hole conductors are formed in through holes extending from the first surface to the second surface. Each through hole has a first opening portion and a second opening portion connected to the first opening portion such that the first opening portion has a tapered shape decreasing in diameter from the first surface toward the second surface, the second opening portion has a tapered shape decreasing in diameter from the second surface toward the first surface, and center lines of the first and second opening portions are shifted from each other by a distance that is equal to or less than the thickness of the substrate.

Abstract: A printed wiring board includes a substrate having first and second surfaces such that the substrate has a thickness in a range of 30 ?m to 100 ?m between the first and second surfaces, and through hole conductors including plating material such that the through hole conductors are formed in through holes extending from the first surface to the second surface. Each through hole has a first opening portion and a second opening portion connected to the first opening portion such that the first opening portion has a tapered shape decreasing in diameter from the first surface toward the second surface, the second opening portion has a tapered shape decreasing in diameter from the second surface toward the first surface, and center lines of the first and second opening portions are shifted from each other by a distance that is equal to or less than the thickness of the substrate.

Abstract: A printed wiring board includes an insulating substrate having a penetrating hole formed through the substrate, a first conductive pattern formed on first surface of the substrate, a second conductive pattern formed on second surface of the substrate on the opposite side of the first surface, and a through-hole conductor formed in the penetrating hole in the substrate such that the conductor is connecting the first conductive pattern on the first surface of the substrate and the second conductive pattern on the second surface of the substrate. The penetrating hole has a first opening portion opening on the first surface of the substrate, a second opening portion opening on the second surface of the substrate and a third opening portion connecting the first and second opening portions, and the third opening portion has the maximum diameter which is greater than the minimum diameters of the first and second opening portions.

Abstract: A method for manufacturing a printed wiring board includes preparing a core substrate having a metal layer having a first penetrating hole and insulation layers formed on the metal layer such that the metal layer is interposed between the insulation layers, forming in the core substrate a second penetrating hole having a first opening portion aligned with the first penetrating hole on a first-surface side of the core substrate and a second opening portion aligned with the first penetrating hole on a second-surface side of the core substrate, forming a first conductor on a first surface of the core substrate, forming a second conductor on a second surface of the core substrate on the opposite side of the first surface of the core substrate, and filling a conductive material in the second penetrating hole such that a through-hole conductor connecting the first conductor and the second conductor is formed.

Abstract: A method for manufacturing a printed wiring board includes preparing a core substrate having a first surface and a second surface on the opposite side of the first surface, forming on the first-surface side of the substrate a first opening portion tapering from the first toward second surface, forming on the second-surface side of the substrate a second opening portion tapering from the second toward first surface, forming a third opening portion such that a penetrating hole formed of the first opening portion, the second opening portion and the third opening portion connecting the first and second opening portions is formed in the substrate, forming a first conductor on the first surface of the substrate, forming a second conductor on the second surface of the substrate, and filling a conductive material in the penetrating hole such that a through-hole conductor connecting the first and second conductors is formed.

Abstract: A printed wiring board includes an insulating substrate having a penetrating hole formed through the substrate, a first conductive pattern formed on first surface of the substrate, a second conductive pattern formed on second surface of the substrate on the opposite side of the first surface, and a through-hole conductor formed in the penetrating hole in the substrate such that the conductor is connecting the first conductive pattern on the first surface of the substrate and the second conductive pattern on the second surface of the substrate. The penetrating hole has a first opening portion opening on the first surface of the substrate, a second opening portion opening on the second surface of the substrate and a third opening portion connecting the first and second opening portions, and the third opening portion has the maximum diameter which is greater than the minimum diameters of the first and second opening portions.

Abstract: A method for manufacturing a printed wiring board includes preparing a core substrate having a first surface and a second surface on the opposite side of the first surface, forming on the first-surface side of the substrate a first opening portion tapering from the first toward second surface, forming on the second-surface side of the substrate a second opening portion tapering from the second toward first surface, forming a third opening portion such that a penetrating hole formed of the first opening portion, the second opening portion and the third opening portion connecting the first and second opening portions is formed in the substrate, forming a first conductor on the first surface of the substrate, forming a second conductor on the second surface of the substrate, and filling a conductive material in the penetrating hole such that a through-hole conductor connecting the first and second conductors is formed.

Abstract: A method for manufacturing a printed wiring board includes preparing a core substrate having a metal layer having a first penetrating hole and insulation layers formed on the metal layer such that the metal layer is interposed between the insulation layers, forming in the core substrate a second penetrating hole having a first opening portion aligned with the first penetrating hole on a first-surface side of the core substrate and a second opening portion aligned with the first penetrating hole on a second-surface side of the core substrate, forming a first conductor on a first surface of the core substrate, forming a second conductor on a second surface of the core substrate on the opposite side of the first surface of the core substrate, and filling a conductive material in the second penetrating hole such that a through-hole conductor connecting the first conductor and the second conductor is formed.