Patents by Inventor Toshiaki Ishihara

Toshiaki Ishihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070183127
    Abstract: A heat spreader module includes a laminated assembly, a heat spreader bonded to an upper surface of the laminated assembly, and a circuit board bonded to an upper surface of the heat spreader. The laminated assembly includes a base, an insulated substrate bonded to an upper surface of the base, and an intermediate metal plate bonded to an upper surface of the insulated substrate. A nonwoven fabric impregnated with a liquid is prepared, and an exposed portion of the insulated substrate, which extends out from below the intermediate metal plate, is wiped with the nonwoven fabric. Then, the entire structure is dried until the liquid on the exposed portion of the insulated substrate is removed. Thereafter, a pulsed voltage is applied between the circuit board and the base.
    Type: Application
    Filed: January 30, 2007
    Publication date: August 9, 2007
    Applicant: NGK Insulators, Ltd.
    Inventors: Shuhei ISHIKAWA, Yumihiko Kuno, Nobuaki Nakayama, Toshiaki Ishihara
  • Patent number: 5547544
    Abstract: A mold composed of bonded water-insoluble particles and having a molding layer and a support layer. The molding layer includes first water insoluble particles, having an average size of 0.2 -1.0 mm bonded to form a layer having a thickness 1-20 times the average size of the first particles. The support layer positioned on the inner surface of the molding layer, on which the fiber bodies are not formed, includes second water-insoluble particles, having an average size of 1.0-10.0 mm, bonded to form a layer having a thickness of at least the average size of the second particles. The pulp mold has advantages in that it hardly suffers from clogging, it produces fiber bodies each having a smooth surface, it is free from damage caused by repeated use, and it produces fiber bodies in a short period of time.
    Type: Grant
    Filed: February 6, 1995
    Date of Patent: August 20, 1996
    Assignee: NGK Insulators, Ltd.
    Inventors: Yasuhiro Miyamoto, Toshiaki Ishihara, Minoru Uda
  • Patent number: 5531864
    Abstract: A pulp molding die for molding shaped articles from fiber pulp is disclosed. The die has a porous molding layer having a porosity of at least 5% and an average pore diameter in a range of 60 to 1000 .mu.m, the porous molding layer having a molding surface shaped to the configuration of the article to be molded; and a porous support layer disposed adjacent the porous molding layer on the opposite side thereof from the molding surface, the porous support layer having a porosity of at least 20% and an average pore diameter in a range of 0.6 to 10 mm, the average pore diameter being larger than that of the porous molding layer. The porous molding layer and/or the porous support layer have a pore structure for holding water.
    Type: Grant
    Filed: December 21, 1994
    Date of Patent: July 2, 1996
    Assignee: NGK Insulators, Ltd.
    Inventors: Yasuhiro Miyamoto, Toshiaki Ishihara, Minoru Uda
  • Patent number: 5431784
    Abstract: A mold composed of bonded water-insoluble particles and having a molding layer and a support layer. The molding layer includes first water insoluble particles, having an average size of 0.2-1.0 mm bonded to form a layer having a thickness 1-20 times the average size of the first particles. The support layer positioned on the inner surface of the molding layer, on which the fiber bodies are not formed, includes of second water-insoluble particles, having an average size of 1.0-10.0 mm, bonded to form a layer having a thickness of at least the average size of the second particles. The pulp mold has advantages in that it hardly suffers from clogging, it produces fiber bodies each having a smooth surface, it is free from damage caused by repeated use, and it produces fiber bodies in a short period of time.
    Type: Grant
    Filed: March 2, 1993
    Date of Patent: July 11, 1995
    Assignee: NGK Insulators, Ltd.
    Inventors: Yasuhiro Miyamoto, Toshiaki Ishihara, Minoru Uda
  • Patent number: 5399243
    Abstract: A pulp molding die for molding shaped articles from fiber pulp is disclosed. The die has a porous molding layer having a porosity of at least 5% and an average pore diameter in a range of 60 to 1000 .mu.m, the porous molding layer having a molding surface shaped to the configuration of the article to be molded; and a porous support layer disposed adjacent the porous molding layer on the opposite side thereof from the molding surface, the porous support layer having a porosity of at least 20% and an average pore diameter in a range of 0.6 to 10 mm, the average pore diameter being larger than that of the porous molding layer. The porous molding layer and/or the porous support layer have a pore structure for holding water.
    Type: Grant
    Filed: March 3, 1993
    Date of Patent: March 21, 1995
    Assignee: NGK Insulators, Ltd.
    Inventors: Yasuhiro Miyamoto, Toshiaki Ishihara, Minoru Uda
  • Patent number: 4599119
    Abstract: An age-hardening copper titanium alloy containing 2 to 6% by weight of titanium, and composed of a substantially fully solution heat-treated structure having an average crystal grain size not exceeding 25 microns. When the alloy is cold-rolled after its solution heat treatment, its elongation in the rolling direction and that in a direction perpendicular thereto have a difference of within 20% therebetween, and its bend radius to thickness ratios in those two directions are substantially equal to each other.
    Type: Grant
    Filed: November 13, 1984
    Date of Patent: July 8, 1986
    Assignee: NGK Insulators, Ltd.
    Inventors: Kazuo Ikushima, Yoshio Itoh, Toshiaki Ishihara
  • Patent number: 4566915
    Abstract: A process for producing an age-hardened copper titanium alloy strip includes preparing a copper titanium alloy melt, casting it, hot-working the cast alloy, cold-working the hot-worked alloy as required, annealing the hot-worked or cold-worked alloy, solution heat-treating the annealed alloy, and then the solution heat-treated alloy is age-hardened. The alloy is annealed at a temperature of 500.degree. C. to 700.degree. C. for one to 20 hours. Its solution heat treatment is terminated before or approximately as soon as a precipitated secondary phase has formed a complete solid solution in a master phase, so that the master phase may have an average crystal grain size not exceeding 25 microns. It is preferably terminated within three minutes. The alloy has a titanium content of 2 to 6% by weight.
    Type: Grant
    Filed: November 13, 1984
    Date of Patent: January 28, 1986
    Assignee: NGK Insulators, Ltd.
    Inventors: Kazuo Ikushima, Yoshio Itoh, Toshiaki Ishihara
  • Patent number: 4183656
    Abstract: The operation of a slit exposure type copying apparatus is controlled to avoid overheating of a transparent cover for the original supporting station by controlling either, or both, of the excitation of the exposure lamp and the return movement of the movable scanning of the original. A detector switch is mounted in the path of movement of the scanning mechanism and is actuated thereby to deenergize the exposure lamp means when the scanning mechanism has travelled a distance substantially equal to that distance required to scan the original. A minimum distance of travel for the scanning means is defined and includes at least one second detector switch which is exposed in the path of movement of the scanning mechanism and is actuatable thereby to return the scanned mechanism to its initial position.
    Type: Grant
    Filed: May 4, 1978
    Date of Patent: January 15, 1980
    Assignee: Minolta Camera Kabushiki Kaisha
    Inventors: Toshiaki Ishihara, Fumitoshi Atsumi, Tetsuya Yamada
  • Patent number: D767515
    Type: Grant
    Filed: April 7, 2015
    Date of Patent: September 27, 2016
    Assignees: Citizen Electronics Co., Ltd., Citizen Holdings Co., Ltd.
    Inventors: Hiroaki Eguchi, Toshiaki Ishihara