Patents by Inventor Toshiaki Ishll

Toshiaki Ishll has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
    Publication number: 20020146565
    Abstract: The present invention provides a biphenyl based epoxy resin comprising a curing agent and an inorganic filler containing an alkali earth metal oxide wherein the epoxy resin has a variation rate of hardness at 25° C. and a relative humidity of 50% for 72 hours of less than 10% and a variation rate of flow at 25° C. and a relative humidity of 20% or below for 72 hours of less than 20%.
    Type: Application
    Filed: September 25, 2001
    Publication date: October 10, 2002
    Inventors: Toshiaki Ishll, Hiroyoshi Kokaku, Akira Nagai, Takao Miwa