Abstract: An object of the present invention is to solve problems in that aluminum electrodes, aluminum wires, and I/O terminals are corroded by corrosive gasses when a pressure of a pressure medium containing corrosive matters such as exhaust gas is measured with a semiconductor sensor; and improve not only the corrosion resistance of the sensor chip but also the corrosion resistance of the portion particularly functioning as the pressure receiver. Each of the aluminum electrodes that is likely to be corroded portions is prevented from being corroded by forming a titanium-tungsten layer and gold layer on the aluminum electrode. The connecting wires are prevented from being corroded by corrosive matters by using gold wires. The I/O terminals are also prevented from being corroded by applying gold plating.

Abstract: An object of the present invention is to solve problems in that aluminum electrodes, aluminum wires, and I/O terminals are corroded by corrosive gasses when a pressure of a pressure medium containing corrosive matters such as exhaust gas is measured with a semiconductor sensor; and improve not only the corrosion resistance of the sensor chip but also the corrosion resistance of the portion particularly functioning as the pressure receiver. Each of the aluminum electrodes that is likely to be corroded portions is prevented from being corroded by forming a titanium-tungsten layer and gold layer on the aluminum electrode. The connecting wires are prevented from being corroded by corrosive matters by using gold wires. The I/O terminals are also prevented from being corroded by applying gold plating.

Abstract: An electronic device has a wiring board mounted with an electronic circuit chip. A recess or through-hole is formed in a major surface of the wiring board on which the electronic circuit chip is mounted at a position corresponding to a central portion of the electronic circuit chip. Air trapped in a space between the electronic circuit chip and the wiring board is collected in the recess or through-hole to form a void separated from the electronic circuit chip.

Abstract: Durability and lifetime of a resin sealed electronic device is improved by reducing thermal stresses acting on the power element and the parts mounting on the board. A power element of which the protective film on the power element is coated with a polyimide group resin at manufacturing the element is used, and a metallic heat sink of which the reverse side surface (portion of mounting on a board) is not plated is used. Further, a linear expansion coefficient of the molding resin is within a range of 3×10−6/°C. to 17×10−6/°C. The durability and the lifetime of the resin sealed electronic device is improved, because the thermal stresses are reduced by balancing linear expansion coefficients of the parts.

Abstract: Durability and lifetime of a resin sealed electronic device is improved by reducing thermal stresses acting on the power element and the parts mounting on the board.

Abstract: Object: The present invention is intended to supply an internal combustion engine-use igniter that is compact, excellent in mountability, and can contribute to the simplification and automation of assembly and to cost reduction. Implementing means: An insulated gate bipolar transistor (IGBT) is used as the ignition coil switching device for the internal combustion engine. The IGBT and a current limiting circuit intended to protect it from an overcurrent are formed on single semiconductor chip 3, and this semiconductor chip 3 and radio noise reduction capacitor 5 are contained in single packaging unit 4 having external input and output terminals 41 to 44. Packaging unit 4 is transfer-molded using a material such as epoxy resin.

Abstract: In order to provide a resin sealed electronic device which is capable of securing high reliability by packaging with a transfer molding resin without using any under filler material, a resin sealed electronic device mounts a flip chip type monolithic IC on a hybrid circuit board through bumps and is packaged with a thermosetting resin through transfer molding. The transfer molding resin has a linear expansion coefficient of 3×10−6 to 17×10−6 and contains a filler having a particle size smaller than a height of the bump by more than 10 &mgr;m. The resin sealed electronic device is integrated in a unit including the hybrid circuit board mounting the flip chip type monolithic IC through transfer molding with the transfer molding resin, and the bump is restrained from moving by the transfer molding resin flowing around at transfer-molding.

Abstract: A less-deformable resin-sealed electronic apparatus of high reliability capable of increasing the robustness (long life-time) of soldered portions of a power semiconductor device for use in internal combustion engines while increasing the physical stiffness of an overall apparatus structure for achieving enhanced resistance to flexure or bending stresses is provided. A hybrid IC substrate 2 and power semiconductor device 3 are mounted on a metallic heat sink 1. The power semiconductor device 3 is coupled and contacted with the heat sink 1 by use of an Sn—Sb alloy-based solder material 4. The power semiconductor device 3 and hybrid IC substrate 2 plus heat sink 1 as well as input/output terminals 6-1 to 6-3 are embedded in a package 7 except for part of the input/output terminals, which package is made of epoxy at 70 to 90 weight percent (%) of an inorganic loading or filler material as machined by transfer mold techniques.

Abstract: A distributor for internal combustion engines which includes a connector for electrically coupling a rotation signal detector and an engine control unit and a connector for electrically coupling an ignition coil and the engine control unit, the distributor being constructed to be able to improve working efficiency and productivity during assembly and handling easiness during maintenance.

Abstract: A distributor for internal combustion engines which includes a connector for electrically coupling a rotation signal detector and an engine control unit and a connector for electrically coupling an ignition coil and the engine control unit, the distributor being constructed to be able to improve working efficiency and productivity during assembly and handling easiness during maintenance.

Abstract: The present invention relates to a device for optically monitoring or detecting information regarding a moving object by using optical fibers. The object of the invention is to prevent output characteristics from deteriorating with the passage of time. This deterioration is caused by the fact that a resin-made holder of a detecting section is deformed or a position in which the holder is installed shifts particularly because of heat and vibrations. An intermediate member is disposed between the holder and a fixing member. The holder is secured to the intermediate member which is used as a member for absorbing heat and vibrations.