Abstract: A light-emitting diode (LED) module is provided. The LED module includes a substrate, a metal layer disposed above the substrate, a resist layer disposed above the substrate and including a plurality of layers, an LED chip mounted above the substrate, and a wire connecting the metal layer and the LED chip. In a first region in which the LED chip is mounted, at least a portion of the resist layer is disposed directly on the substrate with the LED chip being mounted above the resist layer via an adhesive. In a second region which includes a connection at which the wire and the metal layer are connected and a periphery of the connection, the metal layer is disposed above the substrate with the resist layer being disposed above the metal layer.

Abstract: A light-emitting apparatus is provided. The light-emitting apparatus includes a first and second light-emitting elements disposed on a substrate. A sealing layer is above the first and second light-emitting elements for sealing the first and second light-emitting elements. A first phosphor layer is above a first portion of the sealing layer. The first phosphor layer includes at least one first phosphor. A second phosphor layer is above a second portion of the sealing layer. The second phosphor layer includes at least one second phosphor. The first phosphor layer is configured to emit light, which is emitted as a result of emission by the first light-emitting element, having a first color. The second phosphor layer is configured to emit light, which is emitted as a result of emission by the second light-emitting element, having a second color different from the first color.

Abstract: A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. A content percentage of at least one of a phenyl group, an ester bond, and a carbon double bond in a second layer that is an uppermost layer of the plurality of layers is lower than a content percentage of the at least one of the phenyl group, the ester bond, and the carbon double bond in a first layer that is an underlying layer of the plurality of layers, the underlying layer being located below the uppermost layer.

Abstract: A mount substrate includes: an insulation substrate containing resin and glass; connection conductors formed on a surface of the insulation substrate; a first white resist layer that covers the connection conductors; and a second white resist layer that covers the first white resist. Each of the connection conductors includes a copper foil and a plating layer partly formed on the copper foil. The plating layer is formed of metal having oxidation-resistant and corrosion-resistant characteristics higher than those of copper. The first white resist layer is formed with first openings that respectively expose the plating layers of the connection conductors. The second white resist layer covers a periphery of each plating layer of the connection conductors in planar view.

Abstract: A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. A content percentage of at least one of a phenyl group, an ester bond, and a carbon double bond in a second layer that is an uppermost layer of the plurality of layers is lower than a content percentage of the at least one of the phenyl group, the ester bond, and the carbon double bond in a first layer that is an underlying layer of the plurality of layers, the underlying layer being located below the uppermost layer.

Abstract: A light emitting diode (LED) module which includes: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. The plurality of layers includes a second layer that is an uppermost layer and a first layer that is an underlying layer. The second layer that is the uppermost layer includes fluorine as a component.

Abstract: A light-emitting apparatus includes: a substrate; an LED chip disposed on the substrate; and a sealing member that contains a yellow phosphor and a cerium oxide, and seals the LED chip. An amount of the cerium oxide contained in the sealing member depends on a peak wavelength of a light emission spectrum of the LED chip, and when the peak wavelength of the light emission, spectrum of the LED chip is 470 nm or less, the amount of the cerium oxide contained in the sealing member is 0.100 wt % or less.

Abstract: A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers, above the substrate; and an LED element mounted above the resist via an adhesive. The adhesive includes an addition-reaction type silicone resin. In the resist, a higher positioned layer of the plurality of layers is lower in at least one of sulfur content, phosphorus content, and nitrogen content than a lower positioned layer of the plurality of layers.

Abstract: A light-emitting device includes a substrate and a plurality of light-emitting elements disposed above the substrate. In the plurality of light-emitting elements, a first light-emitting element and a second light-emitting element different in a rate of decrease in light output along with a temperature increase are included. The plurality of light-emitting elements include: a first serial element group including some light-emitting elements connected in series among the plurality of light-emitting elements; and a second serial element group connected in parallel with the first serial element group and including some light-emitting elements connected in series among the plurality of light-emitting elements. A ratio between a total number of first light-emitting elements and a total number of second light-emitting elements is different between the first serial element group and the second serial element group.

Abstract: A mount substrate includes: an insulation substrate containing resin and glass; connection conductors formed on a surface of the insulation substrate; a first white resist layer that covers the connection conductors; and a second white resist layer that covers the first white resist. Each of the connection conductors includes a copper foil and a plating layer partly formed on the copper foil. The plating layer is formed of metal having oxidation-resistant and corrosion-resistant characteristics higher than those of copper. The first white resist layer is formed with first openings that respectively expose the plating layers of the connection conductors. The second white resist layer covers a periphery of each plating layer of the connection conductors in planar view.

Abstract: Light emitting apparatus including: substrate; LED chips on substrate; first sealing layer sealing LED chips; second sealing layer above first sealing layer; and phosphor layer containing yellow phosphor, disposed between first sealing layer and second sealing layer, wherein phosphor layer contains the yellow phosphor in higher density than first sealing layer and second sealing layer.

Abstract: Light emitting apparatus including: substrate; LED chips on substrate; first sealing layer sealing LED chips; second sealing layer above first sealing layer; and phosphor layer containing yellow phosphor, disposed between first sealing layer and second sealing layer, wherein phosphor layer contains the yellow phosphor in higher density than first sealing layer and second sealing layer.

Abstract: A light-emitting diode driver circuit and an LED light source which are capable of reliably turning OFF an LED even when an input voltage having a value smaller than a predetermined value is supplied. A light-emitting diode driver circuit for turning ON an LED includes: an inverter which outputs electric power for driving the LED; and an inverter control circuit which controls an operation of the inverter, and when a DC voltage applied to the inverter control circuit has a value smaller than the predetermined value, the inverter control circuit stops the operation of the inverter.

Abstract: A light emitting device that emits white light includes first and second light emitting elements which have different emission peak wavelengths within a range of 440 nm to 495 nm. The device also includes a wavelength conversion material which converts a wavelength of light emitted by at least one of the first and second light emitting elements. The white light has an emission spectrum peaked at a first peak wavelength and a second peak wavelength. The first peak wavelength corresponds to the emission peak wavelength of the first light emitting element, and the second peak wavelength corresponds to the emission peak wavelength of the second light emitting element. Where a light intensity at one of the first peak wavelength and the second peak wavelength is 1, a light intensity at a bottom of a valley between the first and second peak wavelengths is 0.5 or higher but lower than 1.0.

Abstract: A light-emitting device includes a mounting board, a light-emitting element mounted on a main face of the mounting board, and a sealing member covering the light-emitting element. The sealing member includes a first sealing layer covering a part of the main face of the mounting board and the light-emitting element, and a second sealing layer covering the first sealing layer. The first sealing layer includes particles containing at least one material selected from a group consisting of cerium oxide, titanium oxide, iron oxide, and carbon, and silicone resin. The second sealing layer includes phosphor particles for converting a part of light emitted from light-emitting element into a long wavelength light and radiating it, and silicone resin.

Abstract: A semiconductor light-emitting device according to the present invention is a semiconductor light-emitting device 10 including a solid-state light-emitting element 11 and a wavelength converter 12 that converts primary light emitted by the solid-state light-emitting element 11 into light having a longer wavelength, wherein the wavelength converter 12 includes a wavelength converting layer 12a made from a translucent inorganic formed body containing phosphors, and a binder layer 12b; the wavelength converter 12 is disposed on a main light extraction surface 11a of the solid-state light-emitting element 11; and the binder layer 12b is disposed along an emission direction of light emitted from the main light extraction surface 11a.

Abstract: A light-emitting diode driver circuit and an LED light source which are capable of reliably turning OFF an LED even when an input voltage having a value smaller than a predetermined value is supplied. A light-emitting diode driver circuit for turning ON an LED includes: an inverter which outputs electric power for driving the LED; and an inverter control circuit which controls an operation of the inverter, and when a DC voltage applied to the inverter control circuit has a value smaller than the predetermined value, the inverter control circuit stops the operation of the inverter.