Abstract: A wafer-scale semiconductor integrated circuit device includes a wafer, a plurality of chips formed on the wafer, each of the chips having an internal logic circuit, interconnection lines mutually connecting the chips, and clamping circuits which are coupled to chips from among the chips which are located at a periphery of an arrangement of the chips and which prevent the interconnection lines related to the chips located at the periphery from being in a floating state.

Abstract: A wafer-scale integrated circuit includes a plurality of functional blocks, a plurality of respectively corresponding connection terminals being provided in each of the functional blocks. Respectively corresponding pluralities of layered wirings and bonding wires interconnect predetermined, respective ones of said corresponding connection terminals in parallel for supplying power source and other voltages in common to the plurality of functional blocks. The parallel interconnections by the layered wirings and bonding wires, due to different, respective failure modes, affording increased reliability.

Abstract: An aluminum alloy composite material for brazing has a core member made of an aluminum alloy, Al-Si filler member and a cladding member made of an aluminum alloy. Mg contained in the aluminum alloy of the core member is restricted to within 0.2% or less by weight. The aluminum alloy of the cladding member essentially consists of 0.3% to 2.5% by weight of Mg. During brazing, the core member serves to restrain the diffusion of Si from the filler member clad on one surface of the core member and the diffusion of Mg from the cladding member clad on the opposite surface of the core member.

Abstract: A heat exchanger of this invention used as a radiator for an automotive vehicle has a core plate having a holding groove around its periphery for receiving a seal member as well as a flange of a tank member, wherein a concave-convex portion is formed in the outer surface of the outer or inner side wall forming the holding groove. According to this structure, an excess molten solder is gathered toward the concave-convex portion when the core plate is heated for soldering in a heat furnace. This prevents the excess solder from making a drop-shaped mass which has an adverse influence on a seal efficiency of the seal member.