Abstract: A conductive paste that can reduce an increase in electrical resistance caused by stretching of a wiring when the wiring of an electrical circuit and/or an electronic circuit is formed on a surface of a stretchable and/or bendable base material. The stretchable conductive paste includes (A) surface-treated silver particles and (B) a thermoplastic resin. The (A) surface-treated silver particles include a surface-treated layer.

Abstract: A conductive paste that can reduce an increase in electrical resistance caused by stretching of a wiring when the wiring of an electrical circuit and/or an electronic circuit is formed on a surface of a stretchable and/or bendable base material. The stretchable conductive paste includes (A) surface-treated silver particles and (B) a thermoplastic resin. The (A) surface-treated silver particles include a surface-treated layer.

Abstract: A vehicle bodyside structure to be applied to a vehicle includes a side sill, a first reinforce, a second reinforce, and a third reinforce. The side sill is disposed on a rear side of a front tire of the vehicle. The side sill extends along a vehicle fore-and-aft direction. The first reinforce is disposed in a front end side of the side sill. The first reinforce includes a front portion and a rear portion. The front portion extends from an inner side to an outer side in a vehicle width direction. The rear portion extends along the vehicle fore-and-aft direction. The second reinforce at least partly overlaps the rear portion of the first reinforce. The third reinforce is disposed on a rear side of the first reinforce. The second reinforce overlaps a vicinity of a rear end of the rear portion of the first reinforce.

Abstract: A vehicle bodyside structure to be applied to a vehicle includes a side sill, a first reinforce, a second reinforce, and a third reinforce. The side sill is disposed on a rear side of a front tire of the vehicle. The side sill extends along a vehicle fore-and-aft direction. The first reinforce is disposed in a front end side of the side sill. The first reinforce includes a front portion and a rear portion. The front portion extends from an inner side to an outer side in a vehicle width direction. The rear portion extends along the vehicle fore-and-aft direction. The second reinforce at least partly overlaps the rear portion of the first reinforce. The third reinforce is disposed on a rear side of the first reinforce. The second reinforce overlaps a vicinity of a rear end of the rear portion of the first reinforce.

Abstract: A method of manufacturing an electronic component comprising the steps of: preparing a bare chip; applying a conductive paste on the bare chip, wherein the conductive paste comprises, (i) 40 to 72 weight percent (wt. %) of a flaky silver powder having particle diameter (D50) of 6 to 30 ?m, (ii) 3 to 30 wt. % of a copper oxide powder, and (iii) 20 to 50 wt. % of an organic vehicle, wherein the wt. % is based on the weight of the conductive paste; and heating the applied conductive paste at 250 to 400° C.

Abstract: An electrically conductive paste composition for forming an electrical circuit comprising: (a) a flake-shaped silver powder, wherein the mean particle size (D50) of the silver powder is 2.0 to 8.0 ?m; and (b) a polyvinyl acetal resin, wherein the viscosity of a 10 wt % solution of the polyvinyl acetal resin in di-propylene glycol methyl ether is no less than 1 Pa·s as measured with a Brookfield viscometer (10 rpm, at 25° C.); and wherein the weight ratio of (a) to (b) is in the range from 87/13 to 95/5.

Abstract: An electrically conductive paste composition comprises: (a) silver powders comprising spherical silver powders having a mean particle size (D50) of over 0.1 ?m and no more than 5 ?m and flake-shaped silver powders having a mean particle size of no more than 10 ?m; and (b) binder resins comprise (b-1) aliphatic thermoplastic resin and (b-2) self-polymerizing thermosetting resin; wherein the content of the silver powders is no more than 60 wt % based on the total weight of the paste composition, wherein the weight ratio of the aliphatic thermoplastic resin for the self-polymerizing thermosetting resin ((b-1)/(b-2)) is 99/1-67/33 and wherein the weight ratio of the silver powders for the binder resins ((a)/(b)) is 94/6-85/15.

Abstract: An electrically conductive paste composition comprises: (a) silver powders comprising spherical silver powders having a mean particle size (D50) of over 0.1 ?m and no more than 5 ?m and flake-shaped silver powders having a mean particle size of no more than 10 ?m; and (b) binder resins comprise (b-1) aliphatic thermoplastic resin and (b-2) self-polymerizing thermosetting resin; wherein the content of the silver powders is no more than 60 wt % based on the total weight of the paste composition, wherein the weight ratio of the aliphatic thermoplastic resin for the self-polymerizing thermosetting resin ((b-1)/(b-2)) is 99/1-67/33 and wherein the weight ratio of the silver powders for the binder resins ((a)/(b)) is 94/6-85/15.

Abstract: A conductive paste for a solid electrolytic capacitor electrode contains an electroconductive powder having a mean particle size of no more than 1 ?m and at least 90% thereof having a particle size of at least 0.3 ?m; an organic binder; and a solvent.

Abstract: A thick film paste for membrane touch switch (MTS) uses includes: a) electrically conductive powder; b) phenoxy resin; c) urethane resin; and d) an organic solvent, in which the above a), b) and c) are dissolved or dispersed. MTS made from the paste shows excellent properties such as low resistivity and low resistivity change after creasing. In addition, the content of halogen is very low.

Abstract: A conductive paste for a solid electrolytic capacitor electrode contains an electroconductive powder having a mean particle size of no more than 1 ?m and at least 90% thereof having a particle size of at least 0.3 ?m; an organic binder; and a solvent.

Abstract: An electronic component includes a substrate and an electrically conductive sheet having an adhesive property and attached to the substrate. A plurality of the electronic component can be laminated. The electronic component can be used for capacitor.

Abstract: An electroconductive paste composition characterized in that an electroconductive powder with a mean grain size of 1 ?m or less and a copolymer binder composed of tetrafluoroethylene, hexafluoropropylene, and vinylidene fluoride are dispersed in a solvent. The present invention provides an electroconductive paste. composition that can be cured at low temperatures and can be endowed with low resistivity as a result of using a conventional mixing technique without the need for particularly expensive materials or techniques.

Abstract: A conductor composition comprising an electrically conductive powder, an organic solvent soluble, polyimide resin and solvent wherein the ratio of conductive powder to organic resin is from 80:20 to 99:1 and wherein polyimide resin comprises chemical units selected from and mixtures of these units and wherein in unit (2) the range of the mole ratio m to n is from 90:10 to 10:90 and A represents diamine compounds which bond the structures of unit (2) into units of the resin.

Abstract: An electroconductive paste composition characterized in that an electroconductive powder with a mean grain size of 1 ?m or less and a copolymer binder composed of tetrafluoroethylene, hexafluoropropylene, and vinylidene fluoride are dispersed in a solvent. The present invention provides an electroconductive paste. composition that can be cured at low temperatures and can be endowed with low resistivity as a result of using a conventional mixing technique without the need for particularly expensive materials or techniques.

Abstract: A conductor composition comprising an electrically conductive powder, an organic solvent soluble, polyimide resin and solvent wherein the ratio of conductive powder to organic resin is from 80:20 to 99:1 and wherein polyimide resin comprises chemical units selected from and mixtures of these units and wherein in unit (2) the range of the mole ratio m to n is from 90:10 to 10:90 and A represents diamine compounds which bond the structures of unit (2) into units of the resin.

Abstract: A conductor composition comprising an electrically conductive powder and a binder, wherein the ratio of conductive powder to binder is from 95:5 to 70:30, which binder is composed of (a) an epoxy compound that is semisolid at ordinary room temperature and has an average number of functional groups greater than 2, (b) a monofunctional reactive diluting agent which has substantially no volatility at ordinary room temperature, (c) a curing agent, and (d) a curing catalyst. The composition offers good hole filling properties without void and provides a good interlayer connection in multilayer printed wiring boards with through-holes that may be plated or non-plated.

Abstract: Disclosed is a denitrification reactor wherein each of catalyst cells is provided by packing a plurality of honeycomb catalyst blocks into a box-shaped frame with four corner posts; a plurality of vertical guide posts are erected in such a spaced apart relationship that four adjacent vertical guide posts may vertically guide the corner posts of each catalyst cell; and the catalyst cells with honeycomb catalyst blocks are charged along said vertical guide posts and are pressed thereagainst.