Abstract: A wire saw apparatus including: a plurality of wire guides; a wire row formed of a wire which is wound around the plurality of wire guides and configured to reciprocatively travel in an axial direction; a nozzle configured to supply a coolant or slurry to the wire; a workpiece-holding portion configured to suspend and hold a workpiece plate having a workpiece bonded thereto with a beam interposed therebetween; a workpiece-feeding mechanism configured to press the workpiece against the wire row; and a mechanism configured to adjust a parallelism of axes of the plurality of wire guides around which the wire row is formed. Thereby, a wire saw apparatus and a method for manufacturing a wafer are provided which enable manufacturing of a wafer having any warp shape by controlling a warp in a wire travelling direction of a sliced workpiece.

Abstract: A wire saw apparatus including: a plurality of wire guides; a wire row formed of a wire which is wound around the plurality of wire guides and configured to reciprocatively travel in an axial direction; a nozzle configured to supply a coolant or slurry to the wire; a workpiece-holding portion configured to suspend and hold a workpiece plate having a workpiece bonded thereto with a beam interposed therebetween; a workpiece-feeding mechanism configured to press the workpiece against the wire row; and a mechanism configured to adjust a parallelism of axes of the plurality of wire guides around which the wire row is formed. Thereby, a wire saw apparatus and a method for manufacturing a wafer are provided which enable manufacturing of a wafer having any warp shape by controlling a warp in a wire travelling direction of a sliced workpiece.

Abstract: The prompt responsiveness and operability of pointer display and pointer control is ensured. A display control device has: a first information processing terminal drawing a pointer corresponding to each of input operation devices on a pointer screen on the basis of an operation quantity input from each of the input operation devices; a second information processing terminal drawing a working state of an application on an application screen in accordance with the input instruction information input from each of the input operation devices; and an image synthesis unit that creates a synthesized image by superimposing each of the two screens on the other and that outputs the image to a display device.

Abstract: The degree of urgency of a displayed object is promptly recognized in a control display system including: an information acquisition unit that acquires a target serving as an object of monitoring and attribute information of the target; a control condition storage unit that stores the attribute information of the target and a viewpoint control condition serving as information about a display mode of the target, the attribute information and the condition being associated with each other in advance; a viewpoint control unit that detects attribute information matching the attribute information of the acquired target from the control condition storage unit and that extracts the viewpoint control condition associated with the detected attribute information; and a display unit that displays a result obtained by carrying out viewpoint control of the target on the basis of the extracted viewpoint control condition.

Abstract: The present invention provides a surface grinding method for a semiconductor wafer, which performs surface grinding with respect to a semiconductor wafer sliced into a thin plate shape, wherein at least a cleaning process for removing a heavy metal is performed before carrying out surface grinding of the semiconductor wafer, and a surface grinding process is carried out after performing the cleaning process. As a result, there are provided the surface grinding method and a manufacturing method for a semiconductor wafer, which can effectively reduce a contaminant, which has adhered to a surface of the semiconductor wafer, e.g., a heavy metal such as Cu.

Abstract: A silicon wafer is sand blasted using a sand blasting abrasive material containing a chelating agent which is selected from the group consisting of, for example, the following compounds (1) to (4) and salts thereof: (1) Nitrilotriacetic acid (NTA) (2) Ethylenediaminetetraacetic acid (EDTA) (3) Diethylenediamine-N,N,N″,N″-pentaacetic acid (DTPA) (4) Cyclohexanediaminetetraacetic acid (CyDTA).