Abstract: Disclosed is a CO2 concentration reducing device for separating and removing CO2 from a gas containing CO2 with a CO2 adsorbent, the CO2 concentration reducing device including: an adsorbent container which contains the CO2 adsorbent; and a heating unit which heats the CO2 adsorbent by an induction heating or a dielectric heating. Thus, a ventilation quantity can be reduced when CO2 accumulated in a room is removed, and an electric power required for the ventilation and the electric power required for air conditioning can be reduced.

Abstract: Disclosed is a curable resin composition that includes radical polymerizable monomers including a first monofunctional radical polymerizable monomer and a second monofunctional radical polymerizable monomer. The first monofunctional radical polymerizable monomer is a monomer that forms, when polymerized alone, a homopolymer having a glass transition temperature of 20° C. or lower. The second monofunctional radical polymerizable monomer is a monomer that forms, when polymerized alone, a homopolymer having a glass transition temperature of 50° C. or higher.

Abstract: Disclosed is a curable resin composition that includes radical polymerizable monomers including a monofunctional radical polymerizable monomer, a linear or branched polymer containing a polyoxyalkylene chain, and a radical polymerization initiator.

Abstract: Disclosed is a composite material including a metal material; and a protective material provided on the surface of the metal material, the protective material being a cured product of a curable resin composition. The curable resin composition includes radical polymerizable monomers including a first monofunctional radical polymerizable monomer and a second monofunctional radical polymerizable monomer. The first monofunctional radical polymerizable monomer is a monomer that forms, when polymerized alone, a homopolymer having a glass transition temperature of 20° C. or lower. The second monofunctional radical polymerizable monomer is a monomer that forms, when polymerized alone, a homopolymer having a glass transition temperature of 50° C. or higher.

Abstract: A CO2 removal device includes: a CO2 capturing material which captures H2O and CO2 in a gas; a reaction container which contains the CO2 capturing material; an H2O measuring unit for measuring the concentration of H2O in the gas; an H2O concentration adjustment device which adjusts the concentration of H2O on the basis of information obtained by the H2O measuring unit; a gas introduction path introducing the gas into the reaction container from the H2O concentration adjustment device and bringing the gas into contact with the CO2 capturing material; a first gas discharge path discharging the gas from the reaction container after the gas has been brought into contact with the CO2 capturing material; and a second gas discharge path discharging the gas that has been desorbed from the CO2 capturing material from the reaction container.

Abstract: Disclosed is a CO2 concentration reducing device for separating and removing CO2 from a gas containing CO2 with a CO2 adsorbent, the CO2 concentration reducing device including: an adsorbent container which contains the CO2 adsorbent; and a heating unit which heats the CO2 adsorbent by an induction heating or a dielectric heating. Thus, a ventilation quantity can be reduced when CO2 accumulated in a room is removed, and an electric power required for the ventilation and the electric power required for air conditioning can be reduced.

Abstract: A CO2 removal device includes: a CO2 capturing material which captures H2O and CO2 in a gas; a reaction container which contains the CO2 capturing material; an H2O measuring unit for measuring the concentration of H2O in the gas; an H2O concentration adjustment device which adjusts the concentration of H2O on the basis of information obtained by the H2O measuring unit; a gas introduction path introducing the gas into the reaction container from the H2O concentration adjustment device and bringing the gas into contact with the CO2 capturing material; a first gas discharge path discharging the gas from the reaction container after the gas has been brought into contact with the CO2 capturing material; and a second gas discharge path discharging the gas that has been desorbed from the CO2 capturing material from the reaction container. The CO2 removal device allows for the reduction of energy consumption in removing CO2.

Abstract: In regenerating carbon dioxide capturing material, the amount of regeneration gas supplied to a carbon dioxide recovery column is reduced for higher energy efficiency and shortened regeneration time. A carbon dioxide recovery apparatus includes a carbon dioxide sorbing column, a heating unit, and first, second, and third channels. The carbon dioxide sorbing column contains a carbon dioxide capturing material. The heating unit heats the carbon dioxide capturing material. A carbon-dioxide-containing gas is introduced via the first channel into the carbon dioxide sorbing column. The regeneration gas is introduced via the second channel into the carbon dioxide sorbing column. A gaseous mixture containing a gas desorbed from the carbon dioxide capturing material is recovered via the third channel. The heating unit preheats the carbon dioxide capturing material, and then the regeneration gas is introduced into the carbon dioxide sorbing column to recover carbon dioxide from the carbon dioxide capturing material.

Abstract: Provided is a carbon dioxide capturing material that captures a large amount of carbon dioxide, less suffers from decrease in an amount of the captured carbon dioxide even after firing, and has excellent heat resistance. The carbon dioxide capturing material separates and recovers carbon dioxide from a carbon-dioxide-containing gas. The capturing material includes an oxide containing Ce and Al. The oxide contains Ce in a highest content among metal elements in the oxide and contains Al in a content of 0.01% by mole to 40% by mole.

Abstract: The present invention provides a resin composition including an epoxy resin monomer, a novolac resin containing a compound having a structural unit represented by the following general Formula (I), and a filler, in which a particle size distribution of the filler, measured using laser diffractometry, has peaks in the respective ranges of from 0.01 ?m to less than 1 ?m, from 1 ?m to less than 10 ?m, and from 10 ?m to 100 ?m, and the filler contains boron nitride particles having particle sizes of from 10 ?m to 100 ?m. In the general Formula (I), R1 represents an alkyl group, an aryl group, or an aralkyl group. Each of R2 and R3 independently represents a hydrogen atom, an alkyl group, aryl group, or an aralkyl group. m represents a number from 0 to 2; and n represents a number from 1 to 7.

Abstract: The invention provides a multilayer resin sheet that includes: a resin composition layer that includes a thermosetting resin and a filler; and an adhesive layer that is disposed on at least one surface of the resin composition layer, the adhesive layer having an arithmetic average surface roughness Ra of 1.5 ?m or less at a surface that does not face the resin composition layer.

Abstract: The present invention provides a resin composition including an epoxy resin monomer, a novolac resin containing a compound having a structural unit represented by the following general Formula (I), and a filler, in which a particle size distribution of the filler, measured using laser diffractometry, has peaks in the respective ranges of from 0.01 ?m to less than 1 ?m, from 1 ?m to less than 10 ?m, and from 10 ?m to 100 ?m, and the filler contains boron nitride particles having particle sizes of from 10 ?m to 100 ?m. In the general Formula (I), R1 represents an alkyl group, an aryl group, or an aralkyl group. Each of R2 and R3 independently represents a hydrogen atom, an alkyl group, aryl group, or an aralkyl group. m represents a number from 0 to 2; and n represents a number from 1 to 7.

Abstract: The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.

Abstract: The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.

Abstract: The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.

Abstract: The adhesive composition of the invention contains (a) organic fine particles comprising at least one selected from the group consisting of alkyl (meth)acrylate ester-butadiene-styrene copolymer or complexes thereof, alkyl (meth)acrylate ester-silicone copolymer or complexes thereof and silicone-(meth)acrylic acid copolymer or complexes thereof.

Abstract: The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.