Abstract: A crystalline epoxy resin is modified to provide an epoxy resin composition capable of producing a cured product with excellent cured product properties. The modified epoxy resin composition comprises compound A having in its molecule a functional group represented by formula (1): (where each of R1 and R2 is an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, a heterocyclic group, or a halogenated, aminated or nitrated derivative thereof), and compound B having a glycidyl group in its molecule. The compound A is preferably a compound resulting from replacement of from at least one to at most n glycidyl groups among n glycidyl groups in a molecule (where n is an integer of from 2 to 16) with the functional group of the formula (1). The compound B is preferably a compound having n glycidyl groups (where n is an integer of from 2 to 16) in its molecule.

Abstract: There is provided colloidal silica particles comprising at least one polyvalent metal element M selected from a group consisting of iron, aluminum, zinc, zirconium, titanium, tin, and lead in an average content of 0.001 to 0.02 in terms of an M/Si molar ratio, and having an average primary particle diameter of 5 to 40 nm, wherein the content of the polyvalent metal element M present in an outermost layer of the colloidal particles is 0 to 0.003 atom per square nanometer (nm2) of a surface area of the colloidal particles; and a silica sol that the colloidal silica particles are dispersed in an organic solvent, a silica sol that the colloidal silica particles are dispersed in a polymerizable compound, and a silica sol that the colloidal silica particles are dispersed in a dicarboxylic anhydride.

Abstract: There is provided an epoxy resin composition having low viscosity and a high cationic curing property. An epoxy compound of Formula (1): (in Formula (1), A is an (n4)-valent C4-20 linear hydrocarbon group optionally containing an epoxy group, an (n4)-valent C4-20 cyclic hydrocarbon group optionally containing an epoxy group, or an (n4)-valent group of a combination of the linear hydrocarbon group and the cyclic hydrocarbon group; R1 and R2 are each independently a hydrogen atom or a C1-10 alkyl group; n1 is an integer of 2 to 6; n2 is an integer of 2; n3 is an integer of 1; and n4 is an integer of 3 to 8). For example, A is an (n4)-valent organic group formed by removing (n4) hydrogen atoms from butane, pentane, or hexane, or an (n4)-valent organic group formed by removing (n4) hydrogen atoms from cyclobutane, cyclopentane, cyclohexane, epoxycyclohexane, alkyl-substituted epoxycyclohexane, bicycloheptene, or bicyclooctene.

Abstract: There is provided colloidal silica particles comprising at least one polyvalent metal element M selected from a group consisting of iron, aluminum, zinc, zirconium, titanium, tin, and lead in an average content of 0.001 to 0.02 in terms of an M/Si molar ratio, and having an average primary particle diameter of 5 to 40 nm, wherein the content of the polyvalent metal element M present in an outermost layer of the colloidal particles is 0 to 0.003 atom per square nanometer (nm2) of a surface area of the colloidal particles; and a silica sol that the colloidal silica particles are dispersed in an organic solvent, a silica sol that the colloidal silica particles are dispersed in a polymerizable compound, and a silica sol that the colloidal silica particles are dispersed in a dicarboxylic anhydride.

Abstract: There is provided colloidal silica particles comprising at least one polyvalent metal element M selected from a group consisting of iron, aluminum, zinc, zirconium, titanium, tin, and lead in an average content of 0.001 to 0.02 in terms of an M/Si molar ratio, and having an average primary particle diameter of 5 to 40 nm, wherein the content of the polyvalent metal element M present in an outermost layer of the colloidal particles is 0 to 0.003 atom per square nanometer (nm2) of a surface area of the colloidal particles; and a silica sol that the colloidal silica particles are dispersed in an organic solvent, a silica sol that the colloidal silica particles are dispersed in a polymerizable compound, and a silica sol that the colloidal silica particles are dispersed in a dicarboxylic anhydride.

Abstract: There is provided colloidal silica particles comprising at least one polyvalent metal element M selected from a group consisting of iron, aluminum, zinc, zirconium, titanium, tin, and lead in an average content of 0.001 to 0.02 in terms of an M/Si molar ratio, and having an average primary particle diameter of 5 to 40 nm, wherein the content of the polyvalent metal element M present in an outermost layer of the colloidal particles is 0 to 0.003 atom per square nanometer (nm2) of a surface area of the colloidal particles; and a silica sol that the colloidal silica particles are dispersed in an organic solvent, a silica sol that the colloidal silica particles are dispersed in a polymerizable compound, and a silica sol that the colloidal silica particles are dispersed in a dicarboxylic anhydride.

Abstract: There is provided colloidal silica particles comprising at least one polyvalent metal element M selected from a group consisting of iron, aluminum, zinc, zirconium, titanium, tin, and lead in an average content of 0.001 to 0.02 in terms of an M/Si molar ratio, and having an average primary particle diameter of 5 to 40 nm, wherein the content of the polyvalent metal element M present in an outermost layer of the colloidal particles is 0 to 0.003 atom per square nanometer (nm2) of a surface area of the colloidal particles; and a silica sol that the colloidal silica particles are dispersed in an organic solvent, a silica sol that the colloidal silica particles are dispersed in a polymerizable compound, and a silica sol that the colloidal silica particles are dispersed in a dicarboxylic anhydride.

Abstract: There is provided an epoxy compound that provides properties of cured products combining high transparency with high flexural strength by being thermally cured while maintaining advantageous handling properties in a liquid state thereof; and a method for producing a composition by using the epoxy compound. A method for producing an epoxy compound of Formula (1): (in Formula (1), n1, n2, and n3 are individually any one of integers of 2 to 6; n4, n5, and n6 are individually an integer of 2; n7, n8, and n9 are individually an integer of 1; and R1, R2, R3, R4, R5, and R6 are independently a hydrogen atom or a C1-10 alkyl group), including: reacting cyanuric chloride with a C4-8 alkenol and reacting the obtained compound having an unsaturated bond with a peroxide.

Abstract: It is an object to provide a liquid thermosetting composition that yields an epoxy resin having physical properties of the cured product such as high flexural strength along with adequate handleability as liquid, to be used in transparent sealants for optical semiconductors, such as transparent sealants for LEDs (light-emitting devices) and the like. There is provided a thermosetting composition containing an epoxy compound that a side chain between a triazinetrione ring and an epoxy group substituted on the triazinetrione ring is long (elongated).

Abstract: There is provided a water-soluble flux composition for soldering which is excellent particularly in heat resistance and flux residues after soldering of which can be easily removed by washing with water or warm water. The flux composition for soldering contains a compound of formula (1): wherein R1, R2, R3, R4, R5 and R6 independently of one another are a hydrocarbon group or hydrogen atom, and A1, A2 and A3 independently of one another are hydroxy group or an organic group of formula (2): and at least one of A1, A2 and A3 is an organic group of formula (2).

Abstract: A curable composition that maintains good handleability in the liquid form and that can be photo- or heat-cured to form a cured product having physical properties including both high transparency and high flexural strength. A curable composition includes, an epoxy compound of (1): [where each of E1, E2, and E3 is independently an organic group of Formula (2) or Formula (3); and each of R1, R2, and R3 is independently an optionally branched alkylene group or oxyalkylene group: (where R4 is a hydrogen atom or a methyl group)]; and an acid generator.

Abstract: There is provided a curable composition having a low viscosity and high cationic curability. A curable composition including an epoxy compound of Formula (1): [in Formula (1), A is a monocyclic aliphatic hydrocarbon group optionally containing an epoxy group; R1, R2, R3 and R4 are independently a hydrogen atom or a C1-10 alkyl group; n1 and n2 are independently an integer of 2 to 6; n3 and n4 are individually an integer of 2; and n5 and n6 are individually an integer of 1], and an acid generator.

Abstract: There is provided a resist composition suitable for forming a microlens which is excellent in transparency, heat resistance, and sensitivity characteristics, excellent in solubility in a developer, and as the result thereof has high resolution. A positive resist composition comprising; a component (A): an alkali-soluble polymer; a component (B): a compound having an organic group to be photolyzed to generate an alkali-soluble group; a component (C): a crosslinkable compound of Formula (1): [where R1, R2, and, R3 are independently a C1-6 alkylene group or oxyalkylene group which are optionally branched; and E1, E2, and E3 are independently a group containing a structure of Formula (2) or Formula (3): (where R4 is a hydrogen atom or a methyl group)]; and a component (D): a solvent.

Abstract: There is provided an epoxy resin composition having low viscosity and a high cationic curing property. An epoxy compound of Formula (1): (in Formula (1), A is an (n4)-valent C4-20 linear hydrocarbon group optionally containing an epoxy group, an (n4)-valent C4-20 cyclic hydrocarbon group optionally containing an epoxy group, or an (n4)-valent group of a combination of the linear hydrocarbon group and the cyclic hydrocarbon group; R1 and R2 are each independently a hydrogen atom or a C1-10 alkyl group; n1 is an integer of 2 to 6; n2 is an integer of 2; n3 is an integer of 1; and n4 is an integer of 3 to 8). For example, A is an (n4)-valent organic group formed by removing (n4) hydrogen atoms from butane, pentane, or hexane, or an (n4)-valent organic group formed by removing (n4) hydrogen atoms from cyclobutane, cyclopentane, cyclohexane, epoxycyclohexane, alkyl-substituted epoxycyclohexane, bicycloheptene, or bicyclooctene.

Abstract: There is provided a curable composition having a low viscosity and high cationic curability. A curable composition including an epoxy compound of Formula (1): [in Formula (1), A is a monocyclic aliphatic hydrocarbon group optionally containing an epoxy group; R1, R2, R3 and R4 are independently a hydrogen atom or a C1-10 alkyl group; n1 and n2 are independently an integer of 2 to 6; n3 and n4 are individually an integer of 2; and n5 and n6 are individually an integer of 1], and an acid generator.

Abstract: There is provided an epoxy compound that provides properties of cured products combining high transparency with high flexural strength by being thermally cured while maintaining advantageous handling properties in a liquid state thereof; and a method for producing a composition by using the epoxy compound. A method for producing an epoxy compound of Formula (1): (in Formula (1), n1, n2, and n3 are individually any one of integers of 2 to 6; n4, n5, and n6 are individually an integer of 2; n7, n8, and n9 are individually an integer of 1; and R1, R2, R3, R4, R5, and R6 are independently a hydrogen atom or a C1-10 alkyl group), including: reacting cyanuric chloride with a C4-8 alkenol and reacting the obtained compound having an unsaturated bond with a peroxide.

Abstract: There is provided an epoxy compound that provides properties of cured products combining high transparency with high flexural strength by being thermally cured while maintaining advantageous handling properties in a liquid state thereof. An epoxy compound of Formula (1): (where n1 and n2 are independently an integer of 2 to 6; n3 and n4 are individually an integer of 2; n5 and n6 are individually an integer of 1; R4-R7 are independently a hydrogen atom or a C1-10 alkyl group; and X1 is a group of Formula (2)-(4): (where R1-R3 are independently a hydrogen atom, a C1-10 alkyl group, or the like)); and a curable composition comprising the epoxy compound and a curing agent.

Abstract: There is provided a liquid preparation for forming an epoxy resin having curing properties combining high transparency and high bending strength while maintaining advantageous handling properties as in a liquid state. A liquid preparation for forming an epoxy resin comprising: an A agent; and a B agent; wherein the A agent contains a modified epoxy resin (I) formed from at least one type of compound (i) having in a molecule thereof, at least one functional group of Formula (1): (where R1 and R2 individually represent an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, a heterocyclic group or a halogenated, aminated or nitrated derivative of any of the groups) and a compound (ii) having a glycidyl group in a molecule thereof, and an inorganic particle (II); and the B agent contains a curing agent (III).

Abstract: There is provided a resist composition suitable for forming a microlens which is excellent in transparency, heat resistance, and sensitivity characteristics, excellent in solubility in a developer, and as the result thereof has high resolution. A positive resist composition comprising; a component (A): an alkali-soluble polymer; a component (B): a compound having an organic group to be photolyzed to generate an alkali-soluble group; a component (C): a crosslinkable compound of Formula (1): [where R1, R2, and, R3 are independently a C1-6 alkylene group or oxyalkylene group which are optionally branched; and E1, E2, and E3 are independently a group containing a structure of Formula (2) or Formula (3): (where R4 is a hydrogen atom or a methyl group)]; and a component (D): a solvent.

Abstract: A curable composition that maintains good handleability in the liquid form and that can be photo- or heat-cured to form a cured product having physical properties including both high transparency and high flexural strength. A curable composition includes, an epoxy compound of (1): [where each of E1, E2, and E3 is independently an organic group of Formula (2) or Formula (3); and each of R1, R2, and R3 is independently an optionally branched alkylene group or oxyalkylene group: (where R4 is a hydrogen atom or a methyl group)]; and an acid generator.