Abstract: A method of manufacturing a honeycomb structure and a through hole forming device used in the manufacture of the honeycomb structure are provided, in which the step of closing a part of the cell ends at an end surface of the honeycomb structure is rationalized. In closing a part of the cell ends (82) at the end surface (861) of a honeycomb structure body (86), a film (2) is attached to the end surface (861) of the honeycomb structure body (86) in such a manner as to cover the cell ends (82). The portion of the film (2) located at the cell ends (82) to be closed is thermally melted or burnt off thereby to form through holes (20). The end surface (861) is dipped in a slurry containing an end surface closing material, so that the slurry is caused to enter the cell ends (82) by way of the through holes (20). After that, the slurry is hardened while at the same time removing the resin film (2).

Abstract: A ceramic electronic component includes electrodes each having a four layer structure including a first electrode layer made of an Ni—Ti alloy and constructed so as to adhere closely to the surface of a ceramic material defining a ceramic element, a second electrode layer made of at least one selected from the group consisting of Cu, Ag, and Au, disposed on the first electrode layer, a third electrode layer made of an Ni—Ti alloy, disposed on the second electrode layer, and a fourth electrode layer made of at least one selected from the group consisting of Cu, Ag, and Au, disposed on the third electrode layer. Lead terminals are bonded to the electrodes having the four layer structures via solder members, respectively.

Abstract: A method of manufacturing a honeycomb structure and a through hole forming device used in the manufacture of the honeycomb structure are disclosed, in which the step of closing a part of the cell ends at an end surface of the honeycomb structure is rationalized. In closing a part of the cell ends (82) at the end surface (861) of a honeycomb structure body (86), a film (2) is attached to the end surface (861) of the honeycomb structure body (86) in such a manner as to cover the cell ends (82). The portion of the film (2) located at the cell ends (82) to be closed is thermally melted or burnt off thereby to form through holes (20). The end surface (861) is dipped in a slurry containing an end surface closing material, so that the slurry is caused to enter the cell ends (82) by way of the through holes (20). After that, the slurry is hardened while at the same time removing the resin film (2).

Abstract: A ceramic electronic component includes electrodes each having a four layer structure including a first electrode layer made of an Ni—Ti alloy and constructed so as to adhere closely to the surface of a ceramic material defining a ceramic element, a second electrode layer made of at least one selected from the group consisting of Cu, Ag, and Au, disposed on the first electrode layer, a third electrode layer made of an Ni—Ti alloy, disposed on the second electrode layer, and a fourth electrode layer made of at least one selected from the group consisting of Cu, Ag, and Au, disposed on the third electrode layer. Lead terminals are bonded to the electrodes having the four layer structures via solder members, respectively.

Abstract: Apparatus for forming a honeycomb structure capable of adjusting a shaping speed of an outer skin of the honeycomb structure, thereby preventing a defect in the skin. The shaping device is constructed by a die (10) having slits (11) for formation of a honeycomb structure and a guide ring (2) arranged downstream of the die (11). The guide ring includes an opening with an inner edge (21) and includes at a location upstream from the edge a pool portion (22) for the formation of a skin of the honeycomb structure. A temperature controller (3) is arranged in the guide ring for controlling a heating on a cooling of a ceramic material held in the pool portion (22).