Abstract: An electronic device includes a circuit board, a flexible printed wiring board, and an electric connector. The circuit board includes an electronic circuit. The flexible printed wiring board is electrically connected to the electronic circuit. The electric connector includes a plurality of leads and a connector body. Each lead has a substantially straight end and a bent end. A surface of the connector body is substantially parallel to a surface of the flexible printed wiring board. Each bent end of the leads is located on the surface of the connector body to be substantially parallel to the surface of the flexible printed wiring board. The connector is electrically connected to the flexible printed wiring board using the leads. With the structure of the connector, the circuit board and the electric connector is relatively readily connected by the flexible printed wiring board in the manufacturing process of the electronic device.

Abstract: A semiconductor electronic part, having a lot of bumps allocated in a checkered pattern, is solder-mounted on a multilayer circuit board. In the multilayer circuit board, a first wiring pattern linked with a first land is finer than a second wiring pattern linked with a second land. Only one first wiring pattern is passable between lands. The second lands are allocated in the outmost line on the uppermost layer of the multilayer circuit board. In the semiconductor electronic part, bumps connectable with the second lands are allocated in the outermost line.

Abstract: A semiconductor electronic part, having a lot of bumps allocated in a checkered pattern, is solder-mounted on a multilayer circuit board. In the multilayer circuit board, a first wiring pattern linked with a first land is finer than a second wiring pattern linked with a second land. Only one first wiring pattern is passable between lands. The second lands are allocated in the outmost line on the uppermost layer of the multilayer circuit board. In the semiconductor electronic part, bumps connectable with the second lands are allocated in the outermost line.

Abstract: An electronic device includes a circuit board, a flexible printed wiring board, and an electric connector. The circuit board includes an electronic circuit. The flexible printed wiring board is electrically connected to the electronic circuit. The electric connector includes a plurality of leads and a connector body. Each lead has a substantially straight end and a bent end. A surface of the connector body is substantially parallel to a surface of the flexible printed wiring board. Each bent end of the leads is located on the surface of the connector body to be substantially parallel to the surface of the flexible printed wiring board. The connector is electrically connected to the flexible printed wiring board using the leads. With the structure of the connector, the circuit board and the electric connector is relatively readily connected by the flexible printed wiring board in the manufacturing process of the electronic device.

Abstract: In an electronic control unit for controlling operation of various devices, a circuit board carrying electronic components thereon and a connector for connecting the control unit to outside devices are electrically connected through a flexible printed-circuit sheet. A casing of the control unit is designed to contain therein a circuit board selected from variously sized circuit boards. The circuit board may be functionally divided into a certain number of circuit boards. Some varieties of each functionally divided circuit board are prepared, and circuit boards meeting a particular requirement are selected from the varieties and used in a control unit. Thus, the electronic control units meeting various requirements are efficiently and economically manufactured.

Abstract: In an electronic control unit for controlling operation of various devices, a circuit board carrying electronic components thereon and a connector for connecting the control unit to outside devices are electrically connected through a flexible printed-circuit sheet. A casing of the control unit is designed to contain therein a circuit board selected from variously sized circuit boards. The circuit board may be functionally divided into a certain number of circuit boards. Some varieties of each functionally divided circuit board are prepared, and circuit boards meeting a particular requirement are selected from the varieties and used in a control unit. Thus, the electronic control units meeting various requirements are efficiently and economically manufactured.

Abstract: The electronic control unit controls operation of actuators connected thereto based on sensor signals fed thereto and processed therein. The unit includes a control circuit substrate carrying control elements such as a microcomputer and a driving circuit substrate carrying driving elements such as power transistors. The driving circuit substrate handling power and the control circuit substrate handling only signals are separately positioned in a metal casing with a separating space therebetween to suppress heat transfer from the driving circuit substrate to the control circuit substrate. A connector electrically connecting the unit to outside sensors and actuators is positioned in the separating space to utilize the separating space also as a space for containing the connector.

Abstract: A plurality of ceramic circuit boards mounted with heat-generative driving transistors and other electronic parts are bonded to a heat radiating fin, and the heat radiating fin is connected to a motherboard. Heat generated by the driving transistors can efficiently be absorbed and dissipated by the heat radiating fin, and assembling work necessary for combining the components to the motherboard can be reduced. The electronic parts, wiring patterns and the like on the circuit boards can simultaneously be encapsulated in a resin or the like after bonding the circuit boards to the heat radiating fin, packaging work can be reduced.

Abstract: In an electronic control unit, a drive element liable to generate heat and a control processing element liable to be affected by heat are respectively mounted on a drive circuit board and a control circuit board different from each other, and the two boards are connected to each other by a flexible printed circuit board. The bonding portion of the flexible printed circuit board to the control circuit board is a back side portion of a connector mounted on the control circuit board at the same side as the control processing element. Therefore, heat generated by the drive element is suppressed from being transferred to the control processing element without causing layout hindrances.

Abstract: In an electronic control unit for controlling operation of various devices, a circuit board carrying electronic components thereon and a connector for connecting the control unit to outside devices are electrically connected through a flexible printed-circuit sheet. A casing of the control unit is designed to contain therein a circuit board selected from variously sized circuit boards. The circuit board may be functionally divided into a certain number of circuit boards. Some varieties of each functionally divided circuit board are prepared, and circuit boards meeting a particular requirement are selected from the varieties and used in a control unit. Thus, the electronic control units meeting various requirements are efficiently and economically manufactured.

Abstract: A connector body has leg portions and lead terminals protruding therefrom. The lead terminals are fixed to a flexible member to be electrically connected to conductive paths on the flexible member. The flexible member has a free end portion, and the free end portion is soldered to the printed circuit board so that the conductive paths thereon are electrically connected to a wiring pattern on the printed circuit board. The free end portion has through holes and the leg portions of the connector body are inserted into the through holes. Accordingly, the positioning of the flexible member is performed readily and accurately, and reliability of soldered portion is improved.

Abstract: The electronic control unit controls operation of actuators connected thereto based on sensor signals fed thereto and processed therein. The unit includes a control circuit substrate carrying control elements such as a microcomputer and a driving circuit substrate carrying driving elements such as power transistors. The driving circuit substrate handling power and the control circuit substrate handling only signals are separately positioned in a metal casing with a separating space therebetween to suppress heat transfer from the driving circuit substrate to the control circuit substrate. A connector electrically connecting the unit to outside sensors and actuators is positioned in the separating space to utilize the separating space also as a space for containing the connector.

Abstract: A plurality of ceramic circuit boards mounted with heat-generative driving transistors and other electronic parts are bonded to a heat radiating fin, and the heat radiating fin is connected to a motherboard. Heat generated by the driving transistors can efficiently be absorbed and dissipated by the heat radiating fin, and assembling work necessary for combining the components to the motherboard can be reduced. The electronic parts, wiring patterns and the like on the circuit boards can simultaneously be encapsulated in a resin or the like after bonding the circuit boards to the heat radiating fin, packaging work can be reduced.

Abstract: A process of joining metal members, comprising the steps of: providing a first group of a plurality of metal members, each member having a solder bead formed thereon; providing a second group of a plurality of metal members, each member having a solder bead formed thereon; abutting the first group of metal members against the second group of metal members by direct contact between the solder beads; applying an ultrasonic vibration through the metal members to the solder beads in contact; and subsequently heating the beads to cause the solder beads to be bonded together.

Abstract: A pedestal 11 is attached to a circuit substrate 1 having a component placement area 4 when clamping portions 12 and 12 of the pedestal 11 clamp both side portions 5 and 5 of the component placement area 4. It is possible to stand the hybrid integrated circuit device on a parent circuit substrate a by itself before the hybrid integrated circuit device is soldered to the parent circuit substrate a. Since the bottom surfaces of the clamping portions 12 and 12 are flat. The circuit substrates 1, 1, . . . do not overlap one another when the hybrid integrated circuit devices are accommodated in and arranged vertically in a stick since the thickness of the clamping portions 12 and 12 of the pedestal 11 is thicker than the circuit substrate 1. Accordingly, the hybrid integrated circuit device is liable to vertically stand on the parent circuit substrate a by itself and it is easily accommodated in and taken out from the stick.

Abstract: A control circuit comprises a switching element connected in series with the coil of an actuator for generating a drive current when rendered conductive. A drive current sensing resistor is coupled in a circuit with the switching element and the coil to develop a first voltage in response to the switching element being rendered conductive. A surge current sensing resistor is coupled in a circuit with the coil through a unidirectionally conducting element to develop a second voltage in response to the switching element being rendered nonconductive. The first and second voltage are amplified and fed to a differential integrator to which an actuator control signal is also applied. The output of the differential integrator is compared with the instantaneous value of a ramp voltage to generate gating pulses applied to the switching element.