Abstract: Provided are a biosensor chip measurement machine that can obtain accurate measurement results within a short period of time by employing only a tiny amount as a sample, and a measurement method therefor. A biosensor measurement machine 20 includes a power source 21, which is connected to a voltage regulator 22, a measurement instrument 23, and a controller 24 for supplying power. When a biosensor chip 1 is connected to the biosensor measurement machine 20 and a voltage is applied, the measurement instrument begins the measurement of a current value for a biosensor. When a measured current value or a measured charge value is greater than a reference value, the measurement is ended in accordance with an instruction issued by the controller 24, and when the value is smaller than the reference value, the measurement is continued in accordance with a controller instruction.

Abstract: The present invention relates to a low-cost attachable/detachable optical fiber connector, and the like. The optical fiber connector comprises first and second fiber connecting members. The first fiber connecting members has a ferrule that holds a first optical fiber in its inserting hole in a slidable state, a housing that covers the first optical fiber, and a fixing member that fixes the inserted first optical fiber to the housing behind the ferrule so as not to protrude out from the ferrule. The second fiber connecting members has a housing that has a ferrule engaging portion having a recess therein and an optical fiber holding portion that holds a second optical fiber in its inserting hole in a slidable state, and a fixing member that fixes the inserted second optical fiber to the housing behind the optical fiber holding portion so as to protrude into the recess from the optical fiber holding portion.

Abstract: It is intended to provide a sensor chip that enables detection of a deterioration state of a reagent applied on a reaction portion when measuring a concentration of a measurement object substance and a sensor system that enables a correct measurement by using the sensor chip for detecting the reagent deterioration state. A sensor chip including two substrates opposed to each other, a spacer layer sandwiched between the substrates, a multiple reaction portions provided in the spacer layer, and detection electrode units disposed on surfaces of the substrates facing to the spacer layer and exposed to the reaction portions, wherein an identical reagent A is applied on two or more of the reaction portions, and another reagent B that reacts with the reagent A is applied on at least one of the two reaction portions and a sensor system including the sensor chip and a measurement unit for comparing current values from the two or more reaction portions on which the identical reagent A is applied.

Abstract: An optical connector ferrule molding die 1 for molding an optical connector ferrule having a plurality of optical fiber holes comprises an upper die 10, a lower die 11, and an intermediate die 12, whereas the intermediate die 12 comprises a plurality of optical fiber hole forming pins 126 for forming optical fiber holes. The lower die 11 is provided with a protrusion 114 for forming a window hole of the optical connector ferrule, whereas the optical fiber hole forming pins 126 projecting from the intermediate die 12 are secured by through holes 115 penetrating through the protrusion 114 and V-grooves 113.

Abstract: There is provided a sensor chip including: a base plate; a cover layer; a hollow reaction portion provided between the base plate and the cover layer, in which a reaction is performed between a sample and a reagent applied thereinto; a sensing member constructed of an electrode which is exposed to the hollow reaction portion; and a sample inlet for conducting the sample to the hollow reaction portion, wherein entire portions of the base plate and the cover layer, which are located opposite to the sensing member provided with the hollow reaction portion, are made transparent.

Abstract: A method for fabricating a sensor chip having a substrate, a cover layer, a spacer layer interposed between the substrate and the cover layer, and a hollow reaction section provided in the spacer layer, the method comprising the steps of: affixing two or more adhesive or bonding tapes onto a sheet where a plurality of substrates are to be formed or onto a plurality of substrates, to thus form a spacer layer; and forming a hollow reaction section from one or a plurality of gaps between the tapes, whereby volumetric variations or positional displacements of the hollow reaction section can be reduced. A sensor chip which can be fabricated by this method.

Abstract: It is intended to provide a biosensor chip capable of rapid and correct measurement, including a reaction chamber that enables a measurement of a very small amount of a measurement sample and has a small capacity and potassium ferricyanide having a very small crystal particle size disposed in the reaction chamber. In a biosensor chip 1, electrodes 3 and 4 are disposed on the lower substrate 2, and lower spacer 5 (7 and 8) is adhered on the electrodes 3 and 4. An upper spacer 11 (12 and 13) is adhered to an upper substrate 15, and a lower spacer 5 is attached to the upper spacer 11 by and adhesive agent 10. A lower groove 9 is formed between long and short lower spacers 7 and 8, and an upper groove 14 is formed between long and short spacers 12 and 13, so that a reaction chamber 17 is formed by the upper and lower grooves 9 and 14. A capacity of the reaction chamber is 0.

Abstract: Provided are a sensor chip and a manufacturing method of this sensor chip, that includes a substrate, a cover layer, a spacer layer sandwiched between the substrate and the cover layer, and a hollow reaction section between the substrate and the cover layer, wherein warping due to changes in the environmental temperature and humidity does not occur. A sensor chip is provided including: a substrate; a cover layer; a spacer layer sandwiched between the substrate and the cover layer; a hollow reaction section provided between the substrate and the cover layer; and a detection section provided in the hollow reaction section, wherein the substrate and the cover layer are made of the same material and have the same thickness, and a material and a shape of the spacer layer are symmetrical with respect to a plane which is parallel to the substrate and located at equal distances from the substrate and from the cover layer, and a manufacturing method of the sensor chip is provided.

Abstract: An optical connector ferrule molding die 1 for molding an optical connector ferrule having a plurality of optical fiber holes comprises an upper die 10, a lower die 11, and an intermediate die 12, whereas the intermediate die 12 comprises a plurality of optical fiber hole forming pins 126 for forming optical fiber holes. The lower die 11 is provided with a protrusion 114 for forming a window hole of the optical connector ferrule, whereas the optical fiber hole forming pins 126 projecting from the intermediate die 12 are secured by through holes 115 penetrating through the protrusion 114 and V-grooves 113.

Abstract: A coupled member made of a plurality of sensor chips is featured by that adjacent sensor chips are coupled to each other under cuttable condition; the respective sensor chips can be cut and piece-separated from the coupled member in a higher efficiency; and even after the sensor chips are piece-separated, these sensor chips can be readily and quickly stored in containers thereof; and furthermore, the sensor chips can be easily checked and failure chips can be readily removed.

Abstract: The present invention relates to a low-cost attachable/detachable optical fiber connector, and the like. The optical fiber connector comprises first and second fiber connecting members. The first fiber connecting members has a ferrule that holds a first optical fiber in its inserting hole in a slidable state, a housing that covers the first optical fiber, and a fixing member that fixes the inserted first optical fiber to the housing behind the ferrule so as not to protrude out from the ferrule. The second fiber connecting members has a housing that has a ferrule engaging portion having a recess therein and an optical fiber holding portion that holds a second optical fiber in its inserting hole in a slidable state, and a fixing member that fixes the inserted second optical fiber to the housing behind the optical fiber holding portion so as to protrude into the recess from the optical fiber holding portion.

Abstract: The present invention is to provide an optical module in which factors influencing the optical coupling between the semiconductor optical device and the optical fiber may be reduced. The optical module of the present invention includes a ferrule having first and second regions arranged in this order, and an optical fiber secured in the center of the ferrule. The second region of the ferrule provides an end surface of the ferrule, where the tip of the core is exposed thereto, and a mounting surface where the semiconductor optical device is mounted thereon to optically couple with the core of the optical fiber.

Abstract: An optical connector ferrule molding die 1 for molding an optical connector ferrule having a plurality of optical fiber holes comprises an upper die 10, a lower die 11, and an intermediate die 12, whereas the intermediate die 12 comprises a plurality of optical fiber hole forming pins 126 for forming optical fiber holes. The lower die 11 is provided with a protrusion 114 for forming a window hole of the optical connector ferrule, whereas the optical fiber hole forming pins 126 projecting from the intermediate die 12 are secured by through holes 115 penetrating through the protrusion 114 and V-grooves 113.

Abstract: An optical fiber suitable for use in a single fiber or multifiber optical connector or array is structured with a core region and a cladding region surrounding the core region, and exhibits a bending loss of a fundamental mode of the fiber at a wavelength ? is lower than 0.1 dB/m at a diameter of 15 mm, a mode-field diameter of the fundamental mode at an end of the fiber at the wavelength ? is between 8.0 ?m and 50 ?, and a bending loss of a first higher-order mode at the wavelength ? is higher than 1 dB/m at a diameter of 30 mm. The fiber may be multistructured, wherein the cladding region comprises a main medium and a plurality of sub medium regions therein to form a spatially uniform average refractive index.

Abstract: Tensile strength of a tape layer in the lengthwise direction is selected to be higher than adhesive force of the tape layer to optical fiber cores. Further, position limiting portions 111 by which the positions of a plurality of optical fibers 120 can be limited are formed in a flexible film 110 for tape core assembly which film is used for integrating the plurality of optical fibers 120 as a tape. Further, a ribbon-like optical fiber core assembly 301 according to the invention including a plurality of optical fiber cores 302 arranged planarly at designated intervals, an adhesive layer 305 disposed so as to surround the optical fiber cores 302, and films 304a and 304b integrated with the optical fiber cores 302 by the adhesive layer 305.

Abstract: An optical fiber suitable for use in a single fiber or multifiber optical connector or array is structured with a core region and a cladding region surrounding the core region, and exhibits a bending loss of a fundamental mode of the fiber at a wavelength ? is lower than 0.1 dB/m at a diameter of 15 mm, a mode-field diameter of the fundamental mode at an end of the fiber at the wavelength ? is between 8.0 ?m and 50 ?, and a bending loss of a first higher-order mode at the wavelength ? is higher than 1 dB/m at a diameter of 30 mm. The fiber may be multistructured, wherein the cladding region comprises a main medium and a plurality of sub medium regions therein to form a spatially uniform average refractive index.

Abstract: The present invention provides a coated optical fiber in which a silica type optical fiber is coated with n layers (n being an integer of 2 or greater) of UV-curable resin, wherein the sum of respective contraction stress indices FI defined in the n layers of UV-curable resin by the following expression: FI [N]=(Young's modulus [MPa] of the UV-curable resin layer at ?40° C.)×(cross-sectional area [mm2] of the UV-curable resin layer)×(effective linear expansion coefficient [10?6/° C.]/106)×(temperature difference 190[° C.]) is 3 [N] or less. The present invention can sufficiently prevent transmission characteristics from deteriorating in a low temperature environment.

Abstract: An optical connector ferrule molding die 1 for molding an optical connector ferrule having a plurality of optical fiber holes comprises an upper die 10, a lower die 11, and an intermediate die 12, whereas the intermediate die 12 comprises a plurality of optical fiber hole forming pins 126 for forming optical fiber holes. The lower die 11 is provided with a protrusion 114 for forming a window hole of the optical connector ferrule, whereas the optical fiber hole forming pins 126 projecting from the intermediate die 12 are secured by through holes 115 penetrating through the protrusion 114 and V-grooves 113.

Abstract: An optical fiber suitable for use in a single fiber or multifiber optical connector or array is structured with a core region and a cladding region surrounding the core region, and exhibits a bending loss of a fundamental mode of the fiber at a wavelength ? is lower than 0.1 dB/m at a diameter of 15 mm, a mode-field diameter of the fundamental mode at an end of the fiber at the wavelength ? is between 8.0 ?m and 50 ?, and a bending loss of a first higher-order mode at the wavelength ? is higher than 1 dB/m at a diameter of 30 mm. The fiber may be multistructured, wherein the cladding region comprises a main medium and a plurality of sub medium regions therein to form a spatially uniform average refractive index.