Abstract: A light emitting device includes light emitting elements, light-transmissive members, a covering member, at least one first protrusion, and two second protrusions. The light emitting elements are aligned in a first direction. The light-transmissive members are respectively disposed on upper surfaces of the light emitting elements. The covering member includes at least one first covering portion and two second covering portions. The at least one first covering portion is arranged between adjacent ones of the light-transmissive members, and the second covering portions are arranged at distal ends of the light emitting device in the first direction with the light-transmissive members being arranged between the second covering portions. The at least one first protrusion is arranged on an upper surface of the at least one first covering portion and being spaced apart from the light-transmissive members. The second protrusions respectively arranged on upper surfaces of the second covering portions.

Abstract: A light-emitting device includes: a light-emitting element including a first surface provided as a light extraction surface, a second surface opposite to the first surface, a plurality of third surfaces between the first surface and the second surface, and a positive electrode and a negative electrode at the second surface; a light-transmissive member disposed at the first surface; and a bonding member disposed between the light-emitting element and the light-transmissive member and covering from the first surface to the plurality of third surfaces of the light-emitting element to bond the light-emitting element and the light-transmissive member. The bonding member is made of a resin that contains nanoparticles. The nanoparticles have a particle diameter of 1 nm or more and 30 nm or less and a content of 10 mass % or more and 20 mass % or less.

Abstract: The present invention provides a die bonding material containing the following component (A) and a solvent and having a refractive index (nD) at 25° C. of 1.41 to 1.43 and a thixotropic index of 2 or more, a light-emitting device including an adhesive member derived from the die bonding material, and a method for producing the light-emitting device. The die bonding material of the present invention is preferably used for fixing a light emitting element at a predetermined position. Component (A): a curable polysilsesquioxane compound having a repeating unit represented by the following formula (a-1) and satisfying predetermined requirements related to 29Si-NMR and mass average molecular weight (Mw) R1-D-SiO3/2??(a-1) [wherein R1 represents a fluoroalkyl group represented by a compositional formula: CmH(2m?n+1)Fn; m represents an integer of 1 to 10, and n represents an integer of 2 to (2m+1); and D represents a linking group (excluding an alkylene group) for connecting R1 and Si, or a single bond].

Abstract: A light emitting device includes light emitting elements, light-transmissive members, a covering member, at least one first protrusion, and two second protrusions. The light emitting elements are aligned in a first direction. The light-transmissive members are respectively disposed on upper surfaces of the light emitting elements. The covering member includes at least one first covering portion and two second covering portions. The at least one first covering portion is arranged between adjacent ones of the light-transmissive members, and the second covering portions are arranged at distal ends of the light emitting device in the first direction with the light-transmissive members being arranged between the second covering portions. The at least one first protrusion is arranged on an upper surface of the at least one first covering portion and being spaced apart from the light-transmissive members. The second protrusions respectively arranged on upper surfaces of the second covering portions.

Abstract: A semiconductor device includes a semiconductor element, a base body, a conductive adhesive member, and a sealing member. The semiconductor element includes a substrate, a semiconductor element structure provided on the substrate, and p-electrode and n-electrode provided on the semiconductor element structure. The semiconductor element is disposed on the base body. The conductive adhesive member electrically connects the p-electrode and the n-electrode to the base body. The sealing member is provided to cover the semiconductor element on an upper surface of the base body. The conductive adhesive member contains particles selected from a group of (i) surface-treated particles having a particle diameter of 1 nm or more and 100 ?m or less and (ii) particles that coexist with a dispersing agent.

Abstract: A light-emitting device includes: a light-emitting element including a first surface provided as a light extraction surface, a second surface opposite to the first surface, a plurality of third surfaces between the first surface and the second surface, and a positive electrode and a negative electrode at the second surface; a light-transmissive member disposed at the first surface; and a bonding member disposed between the light-emitting element and the light-transmissive member and covering from the first surface to the plurality of third surfaces of the light-emitting element to bond the light-emitting element and the light-transmissive member. The bonding member is made of a resin that contains nanoparticles. The nanoparticles have a particle diameter of 1 nm or more and 30 nm or less and a content of 10 mass % or more and 20 mass % or less.

Abstract: The present invention provides a die bonding material containing the following component (A) and a solvent and having a refractive index (nD) at 25° C. of 1.41 to 1.43 and a thixotropic index of 2 or more, a light-emitting device including an adhesive member derived from the die bonding material, and a method for producing the light-emitting device. The die bonding material of the present invention is preferably used for fixing a light emitting element at a predetermined position. Component (A): a curable polysilsesquioxane compound having a repeating unit represented by the following formula (a-1) and satisfying predetermined requirements related to 29Si-NMR and mass average molecular weight (Mw) R1-D-SiO3/2 ??(a-1) [wherein R1 represents a fluoroalkyl group represented by a compositional formula: CmH(2m-n+1)Fn; m represents an integer of 1 to 10, and n represents an integer of 2 to (2m+1); and D represents a linking group (excluding an alkylene group) for connecting R1 and Si, or a single bond].

Abstract: A semiconductor device includes a semiconductor element, a base body, a conductive adhesive member, and a sealing member. The semiconductor element includes a substrate, a semiconductor element structure provided on the substrate, and p-electrode and n-electrode provided on the semiconductor element structure. The semiconductor element is disposed on the base body. The conductive adhesive member electrically connects the p-electrode and the n-electrode to the base body. The sealing member is provided to cover the semiconductor element on an upper surface of the base body. The conductive adhesive member contains particles selected from a group of (i) surface-treated particles having a particle diameter of 1 nm or more and 100 ?m or less and (ii) particles that coexist with a dispersing agent.

Abstract: A semiconductor device in which wet-spreading of an adhesive member for bonding the semiconductor element on a base body is suppressed. The semiconductor device includes a base body, and a semiconductor element bonded on the base body via an adhesive member. The adhesive member contains surface-treated particles, or particles that coexist with a dispersing agent. At least a part of the marginal portion of the adhesive member is a region where the particles are unevenly distributed.

Abstract: The present invention provides a semiconductor device in which wet-spreading of an adhesive member for bonding the semiconductor element on a base body is suppressed. The semiconductor device (100) of the present invention is a semiconductor device including a base body (10), and a semiconductor element (20) bonded on the base body via an adhesive member (30), wherein the adhesive member (30) contains surface-treated particles (40), or particles (40) that coexist with a dispersing agent, and at least a part of the marginal portion (301) of the adhesive member is a region where the particles (40) are unevenly distributed.