Abstract: An electrolytic capacitor includes a capacitor element that includes an anode part and a cathode part, an exterior body that seals the capacitor element, a first external electrode that is electrically connected to the anode part, and a second external electrode that is electrically connected to the cathode part. At least one of an end face of the anode part or an end face of the cathode part is exposed from the exterior body to be electrically connected to a corresponding one of the first external electrode or the second external electrode. The end face exposed from the exterior body is covered with an electroless Ni plating layer, and the electroless Ni plating layer is covered with an electroless Ag plating layer. The electroless Ag plating layer is covered with the corresponding one of the first external electrode or the second external electrode.

Abstract: Provided is an electrosilver plating bath yielding a semiglossy to glossy appearance across a wide current density range without the use of a cyan compound, and a plating method using the electrosilver plating bath. An electrosilver plating fluid that is an aqueous solution containing (A) at least one soluble silver compound, (B) at least one benzoic acid derivative or a salt of the derivative, and (C) at least one acid and/or complexing agent, wherein the benzoic acid derivative is expressed by the following general formula (m is 1, 2, 3, 4 or 5; Ra is a carboxyl group; individual instances of Rb are selected independently from an aldehyde group, a carboxyl group, an amino group, a hydroxyl group, or a sulfonic acid group; individual instances of Rc are independently oxygen or any substituent; and one or more oxygen or CH2 may be introduced into the bond between Ra or Rb and a benzene ring.

Abstract: The aim of the present invention is to provide a method for silver plating that does not comprise the step of forming the nickel-underlayer and that can form a silver-plated layer having sufficient adherence directly on the difficult-to-plate substrates with the use of a halide-free plating bath under a good working environment. The present invention provides a silver plating method onto a substrate on which an oxide layer inhibiting adherence of a plated layer is prone to form, comprising at least the following steps of; (A) degreasing the substrate, (B) removing the oxide layer with a strongly acidic solution from the substrate, and (C) silver plating onto the substrate, without a step of nickel or nickel alloy strike plating in advance, utilizing a phosphines-containing acidic silver plating bath which essentially does not contain halide ion or cyanide ion.

Abstract: The invention provides a method for silver plating using a non-cyanide acid silver plating bath to form a silver plating film exhibiting good adhesiveness while suppressing dissolution of resist in pattern plating. The method includes conducting strike plating using a non-cyanide acid strike plating bath prior to the silver plating.