Abstract: A multilayer inductor having a uniformly improved direct current superposition property and an increased inductance value is disclosed. The multilayer inductor contains a laminate of a plurality of first insulating layers and a plurality of conductive layers, and the conductive layers and through hole conductors are connected to form a helical coil in the laminate. A second insulating layer which has a magnetic permeability lower than those of the first insulating layers is disposed such that it crosses an inner magnetic path of the helical coil, and a margin of the second insulating layer overlaps with the conductive layer in the stacking direction and is in contact with the conductive layer in the overlap portion. The magnetic flux density in the laminate is likely to be highest in the overlap portion, and thus, the highest-density magnetic flux passes through the second insulating layer inevitably, whereby the direct current superposition property can be uniformly improved.

Abstract: A multilayer inductor having a uniformly improved direct current superposition property and an increased inductance value is disclosed. The multilayer inductor contains a laminate of a plurality of first insulating layers and a plurality of conductive layers, and the conductive layers and through hole conductors are connected to form a helical coil in the laminate. A second insulating layer which has a magnetic permeability lower than those of the first insulating layers is disposed such that it crosses an inner magnetic path of the helical coil, and a margin of the second insulating layer overlaps with the conductive layer in the stacking direction and is in contact with the conductive layer in the overlap portion. The magnetic flux density in the laminate is likely to be highest in the overlap portion, and thus, the highest-density magnetic flux passes through the second insulating layer inevitably, whereby the direct current superposition property can be uniformly improved.

Abstract: A multilayer type electronic part includes a laminated structure formed by stacking a plurality of first and second ceramic layers, the first ceramic layers being provided with internal electrode patterns on top thereof, the second ceramic layers having no internal electrode pattern and being located at a top and a bottom portions of the laminated structure, respectively, the internal electrode patterns being connected to each other to form a coil inside the laminated structure, a pair of external electrodes provided at two opposing sides of the laminated structure and connected to the coil. The multilayer type electronic part further includes one or more third ceramic layers, each of the third ceramic layers not including internal electrode pattern and being interposed between the first ceramic layers, and means for connecting the internal electrode patterns formed on the first ceramic layers to form the coil.