Abstract: An optical film-thickness measuring apparatus capable of eliminating an influence of a fluid flow on optical fiber cables when the fluid, such as pure water, is flowing through a through-hole of a polishing pad, and capable of achieving highly accurate measuring of a film thickness is disclosed. The optical film-thickness measuring apparatus includes: a light-emitting optical fiber cable coupled to a light source; a light-receiving optical fiber cable arranged to receive light reflected from the workpiece; a cable housing surrounding the light-emitting optical fiber cable and the light-receiving optical fiber cable; and a flow-passage structure defining a fluid passage adjacent to the light-emitting optical fiber cable and the light-receiving optical fiber cable. The light-emitting optical fiber cable and the light-receiving optical fiber cable are supported by at least one of the cable housing and the flow-passage structure.

Abstract: The present invention relates to a surface property measuring apparatus for a polishing pad used for polishing a substrate, such as a semiconductor wafer, a surface property measuring method for a polishing pad, and a surface property judging mehod for a polishing pad. The surface property measuring apparatus (30) includes: a light-emitting structure (32) configured to irradiate the polishing pad (2) with light from a plurality of directions as viewed from a polishing surface (2a) of the polishing pad (2); and a light-receiving structure (32) configured to receive reflected light traveling in a plurality of directions from the surface of the polishing pad (2).

Abstract: A surface property measuring system capable of accurately measuring a surface property of a polishing pad without damaging the polishing pad and without reducing throughput of the entire polishing process is disclosed. The surface property measuring system includes: an optical measuring device configured to direct light to a polishing surface of a polishing pad when the polishing pad is rotating, and measure a surface property of the polishing pad based on reflected light from the polishing surface; a cover member disposed between the optical measuring device and the polishing pad; and a transparent-liquid supply line coupled to an inlet port provided in the cover member and configured to supply a transparent liquid onto the polishing pad through the inlet port. The cover member has a light transmissive portion on an optical path of the light and the reflected light.

Abstract: A polishing apparatus which can measure a film thickness with high accuracy without affecting a polishing rate of a wafer is disclosed. The polishing apparatus includes: a polishing head configured to press a wafer against a polishing pad; an illuminating fiber having a distal end disposed in a flow passage formed in the polishing table; a spectrometer configured to resolve reflected light from the wafer in accordance with wavelength and measure an intensity of the reflected light at each of the wavelengths; a light-receiving fiber having a distal end disposed in the flow passage; a liquid supply line communicating with the flow passage; a gas supply line communicating with the flow passage; a liquid supply valve attached to the liquid supply line; a gas supply valve attached to the gas supply line; and an operation controller configured to control operations of the liquid supply valve and the gas supply valve.

Abstract: A surface property judging method and a surface property judging system for a polishing pad capable of appropriately judging a surface property of the polishing pad are disclosed. The surface property judging method includes: rotating a polishing table together with a polishing pad which is supported by the polishing table; generating surface data by a surface data generator, the surface data containing a plurality of shape index values representing a surface property of the polishing pad; producing a histogram indicating a distribution of the plurality of shape index values based on the surface data; and judging the surface property of the polishing pad based on the histogram.

Abstract: A polishing method that can reduce influence of polishing liquid (e.g., slurry) on measuring of a film thickness of a workpiece and can achieve accurate measuring of the film thickness is disclosed. The polishing method includes pressing the workpiece against a polishing pad by a polishing head while polishing liquid is present on the polishing pad to polish the workpiece; during polishing of the workpiece, directing light from an optical sensor head onto the workpiece and receiving reflected light from the workpiece by the optical sensor head, the optical sensor head being disposed in the polishing table; determining a film thickness of the workpiece based on a spectrum of the reflected light; and during polishing of the workpiece, supplying cleaning liquid from a cleaning nozzle to a target position which is located just above the optical sensor head.

Abstract: A polishing method capable of accurately measuring a film thickness of a substrate, such as a wafer, by enhancing light intensity of a flash-light source, such as a xenon flash lamp is disclosed. The polishing method includes: while an optical sensor head is moving across a substrate, causing a flash-light source to emit light plural times in a first exposure time of a light detector to direct the light to the substrate via the optical sensor head, capturing reflected light from the substrate by the light detector via the optical sensor head, further causing the flash-light source to emit light plural times in a second exposure time of the light detector to direct the light to the substrate via the optical sensor head, and capturing reflected light from the substrate by the light detector via the optical sensor head; generating a spectrum of the reflected light; and detecting a surface state of the substrate from the spectrum.

Abstract: There is disclosed a polishing apparatus which allows for easy replacement of a light source with another type of light source. The light-source assembly includes: a base fixed to a polishing table and coupled to a light-emitting transmission line; and a light-source module having a lamp for emitting light. The light-source module is removably attached to the base. The base is a common base which is adapted to any of a plurality of light-source modules of different types including the light-source module. The base includes a positioning structure which achieves positioning of the light-source module relative to the base.

Abstract: An optical film-thickness measuring apparatus capable of eliminating an influence of a fluid flow on optical fiber cables when the fluid, such as pure water, is flowing through a through-hole of a polishing pad, and capable of achieving highly accurate measuring of a film thickness is disclosed. The optical film-thickness measuring apparatus includes: a light-emitting optical fiber cable coupled to a light source; a light-receiving optical fiber cable arranged to receive light reflected from the workpiece; a cable housing surrounding the light-emitting optical fiber cable and the light-receiving optical fiber cable; and a flow-passage structure defining a fluid passage adjacent to the light-emitting optical fiber cable and the light-receiving optical fiber cable. The light-emitting optical fiber cable and the light-receiving optical fiber cable are supported by at least one of the cable housing and the flow-passage structure.

Abstract: Provided is a technique capable of suppressing a shortage of a light amount of a reflected light from wiring patterns even when a film thickness of a film is thick. A film thickness measurement apparatus 30 is applicable to a polishing apparatus 10 for polishing a film 202 of a substrate 200. The film 202 includes a plurality of wiring patterns. The film thickness measurement apparatus 30 includes a light emitter 43 configured to project an emitted light L1 during polishing of the film by the polishing apparatus, an optical condenser 44 configured to condense the emitted light projected from the light emitter to provide a predetermined spot size D and project the light onto the film, and a light receiver 45 configured to receive a reflected light L2 reflected from the film. The predetermined spot size is smaller than a minimum width of respective wiring patterns constituting the plurality of wiring patterns.

Abstract: A polishing apparatus capable of accurately determining a service life of a light source, and further capable of accurately measuring a film thickness of a substrate, such as a wafer, without calibrating an optical film-thickness measuring device, is disclosed. The polishing apparatus includes a spectrometer configured to decompose reflected light from a substrate in accordance with wavelength and measure an intensity of the reflected light at each of wavelengths a film thickness of the substrate is determined based on a spectral waveform indicating a relationship between the intensity of the reflected light and wavelength. An optical-path selecting mechanism is configured to selectively couple either a light-receiving fiber or an internal optical fiber to the spectrometer.

Abstract: A film-thickness measuring apparatus includes: a light source; an illuminating fiber coupled to the light source and having a distal end disposed at a predetermined position in a wafer supporting structure; a spectrometer configured to decompose reflected light from a wafer in accordance with wavelength and measure an intensity of the reflected light at each of wavelengths; a first light-receiving fiber having a distal end disposed at the predetermined position; a second light-receiving fiber having a distal end which is disposed at the predetermined position and is adjacent to the distal end of the first light-receiving fiber; a processor configured to determine a film thickness of the wafer based on a spectral waveform indicating a relationship between the intensity of the reflected light and the wavelength; and an optical-path selecting mechanism configured to optically connect and disconnect the second light-receiving fiber and the spectrometer.

Abstract: A polishing method capable of accurately measuring a film thickness of a substrate, such as a wafer, by enhancing light intensity of a flash-light source, such as a xenon flash lamp is disclosed. The polishing method includes: while an optical sensor head is moving across a substrate, causing a flash-light source to emit light plural times in a first exposure time of a light detector to direct the light to the substrate via the optical sensor head, capturing reflected light from the substrate by the light detector via the optical sensor head, further causing the flash-light source to emit light plural times in a second exposure time of the light detector to direct the light to the substrate via the optical sensor head, and capturing reflected light from the substrate by the light detector via the optical sensor head; generating a spectrum of the reflected light; and detecting a surface state of the substrate from the spectrum.

Abstract: A polishing apparatus capable of accurately measuring a film thickness by regulating a quantity of light illuminating a wafer is disclosed. The polishing apparatus includes: a light source; an illuminating fiber having distal ends arranged at different locations in the polishing table; and a light-receiving fiber having distal ends arranged at the different locations in the polishing table. The illuminating fiber includes a first illuminating fiber and a second illuminating fiber. A first dimmer is attached to the first illuminating fiber and the second illuminating fiber, and a second dimmer is attached to at least one of the first illuminating fiber and the second illuminating fiber.

Abstract: A polishing pad of a typical substrate polishing apparatus is a consumable item. In the substrate polishing apparatus of the prior art, it is determined that the service life of the polishing pad has expired when the polishing pad is used by a predetermined number of times or for a predetermined period of time. In a case where the serviceable life of the polishing pad still remains in practice even when the service life has expired, the still usable polishing pad is to be replaced. Disclosed is a substrate polishing apparatus including a polishing table for installing a polishing pad having a transparent window and an indicator provided in the polishing table to check deterioration of the transparent window and provided in a location visually observable through the transparent window.

Abstract: A polishing apparatus capable of accurately measuring a film thickness by regulating a quantity of light illuminating a wafer is disclosed. The polishing apparatus includes: a light source; an illuminating fiber having distal ends arranged at different locations in the polishing table; and a light-receiving fiber having distal ends arranged at the different locations in the polishing table. The illuminating fiber includes a first illuminating fiber and a second illuminating fiber. A first dimmer is attached to the first illuminating fiber and the second illuminating fiber, and a second dimmer is attached to at least one of the first illuminating fiber and the second illuminating fiber.

Abstract: A polishing apparatus for polishing a substrate is provided. The polishing apparatus includes: a polishing table holding a polishing pad; a top ring configured to press the substrate against the polishing pad; first and second optical heads each configured to apply the light to the substrate and to receive reflected light from the substrate; spectroscopes each configured to measure at each wavelength an intensity of the reflected light received; and a processor configured to produce a spectrum indicating a relationship between intensity and wavelength of the reflected light. The first optical head is arranged so as to face a center of the substrate, and the second optical head is arranged so as to face a peripheral portion of the substrate.

Abstract: There is disclosed a polishing apparatus which allows for easy replacement of a light source with another type of light source. The light-source assembly includes: a base fixed to a polishing table and coupled to a light-emitting transmission line; and a light-source module having a lamp for emitting light. The light-source module is removably attached to the base. The base is a common base which is adapted to any of a plurality of light-source modules of different types including the light-source module. The base includes a positioning structure which achieves positioning of the light-source module relative to the base.

Abstract: The present invention relates to a film-thickness measuring method for detecting a film thickness by analyzing optical information contained in a reflected light from a substrate. The film-thickness measuring method includes producing a spectral waveform indicating a relationship between intensity and wavelength of reflected light from a substrate; performing Fourier transform processing on the spectral waveform to determine strengths of frequency components and corresponding film thicknesses; determining local maximum values (M1, M2) of the strengths of the frequency components; and selecting, according to a preset selection rule, one film thickness from film thicknesses (t1, t2) corresponding respectively to the local maximum values (M1, M2). The selection rule is either to select an N-th largest film thickness or to select an N-th smallest film thickness, and N is a predetermined natural number.

Abstract: A polishing apparatus which can measure a film thickness with high accuracy without affecting a polishing rate of a wafer is disclosed. The polishing apparatus includes: a polishing head configured to press a wafer against a polishing pad; an illuminating fiber having a distal end disposed in a flow passage formed in the polishing table; a spectrometer configured to resolve reflected light from the wafer in accordance with wavelength and measure an intensity of the reflected light at each of wavelengths; a light-receiving fiber having a distal end disposed in the flow passage; a liquid supply line communicating with the flow passage; a gas supply line communicating with the flow passage; a liquid supply valve attached to the liquid supply line; a gas supply valve attached to the gas supply line; and an operation controller configured to control operations of the liquid supply valve and the gas supply valve.