Patents by Inventor Toshifumi Maeda

Toshifumi Maeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11929352
    Abstract: A semiconductor memory device includes a memory chip. The memory chip includes a first region including a plurality of first memory cells and second memory cells, a second region different from the first region, a plurality of first word lines stacked apart from each other in a first direction in the first and second regions, a first pillar including a first semiconductor layer extending through the first word lines, and a first insulator layer provided between the first semiconductor layer and the first word lines, in the first region, the first memory cells being located at intersections of the first pillar with the first word lines, a first bonding pad in the second region, and a first transistor between the first word lines and the first bonding pad, and connected between one of the first word lines and the first bonding pad, in the second region.
    Type: Grant
    Filed: November 10, 2022
    Date of Patent: March 12, 2024
    Assignee: Kioxia Corporation
    Inventors: Hiroshi Maejima, Toshifumi Hashimoto, Takashi Maeda, Masumi Saitoh, Tetsuaki Utsumi
  • Patent number: 6522322
    Abstract: A transparent insulative liquid is sealed between two transparent plates that are coated with transparent conductor layers on their mutually facing surfaces of a touch panel input device. The facing surface of at least one of the transparent plates is roughened. Because the conductor layer is applied directly over the roughened surface of the transparent plate, the conductor layer is also roughened. When the entire device is tilted, the insulative liquid settles downward allowing the upper conductor layers to come into contact with each other, but because the surface is roughened only the protrusions of the conductor layer make contact. The overall contact resistance does not decrease sufficiently to be interpreted as a pressing operation. When a pressing operation is made, the insulative liquid flows into the depressions created by the roughened surface of the conductor layer.
    Type: Grant
    Filed: October 14, 1999
    Date of Patent: February 18, 2003
    Assignee: SMK Corporation
    Inventors: Toshifumi Maeda, Hiroshi Tanaka, Hidemasa Sakurada
  • Patent number: 6356259
    Abstract: Two transparent conductive panels are separated by a perimeter of elastic adhesive that forms a sealed gap in which transparent insulative fluid is interposed. The fluid has a refraction index close to that of the panels to improve light transmittance through the device. The small width of the gap improves response time and prevents formation of a vacuum in the gap. The panels are connected to a position detection circuit that determines coordinate position of an applied pressure point. Spacers in the gap reduce the chance of accidental large-area contact which would result in an erroneous position command. The elasticity of the adhesive and the small gap width provide better temperature variation tolerance in addition to improved consistency and reliability of operation.
    Type: Grant
    Filed: July 13, 1999
    Date of Patent: March 12, 2002
    Assignee: SMK Corporation
    Inventors: Toshifumi Maeda, Hiroshi Tanaka
  • Patent number: 6310614
    Abstract: Two transparent conductive panels are separated by a perimeter of elastic adhesive that forms a sealed gap in which transparent insulative fluid is interposed. The fluid has suspended conductive particles and a refraction index close to that of the panels to improve light transmittance through the device. The conductive particles and small gap width improves response time and prevents formation of a vacuum in the gap. The panels are connected to a position detection circuit that determines coordinate position of an applied pressure point. Spacers in the gap reduce the chance of response to accidental large-area contact which would result in an erroneous position command. The elasticity of the adhesive and the small gap width provide better temperature variation tolerance in addition to improved consistency and reliability of operation.
    Type: Grant
    Filed: July 14, 1999
    Date of Patent: October 30, 2001
    Assignee: SMK Corporation
    Inventors: Toshifumi Maeda, Hiroshi Tanaka