Abstract: There is provided a copper-clad laminate in which transmission characteristics exhibited by a resin layer can be further improved while sufficient peel strength between a copper foil and the resin layer is ensured. The laminate includes a copper foil; an adhesive layer including a polyphenylene ether resin, a polyimide resin, an olefin-based resin, a liquid crystal polymer, a polyester resin, a polystyrene resin, a hydrocarbon elastomer, a benzoxazine resin, an active ester resin, a cyanate ester resin, a bismaleimide resin, a butadiene resin, a hydrogenated or non-hydrogenated styrene butadiene resin, an epoxy resin, a fluororesin, a vinyl-group-containing resin, or the like; and a resin layer. The maximum height Sz at a copper foil surface on the adhesive layer side is 6.8 ?m or less. The dielectric loss tangent value of the adhesive layer at 1 GHz, ?a, is equal to or less than that of the resin layer, ?r.

Abstract: An object of the present invention is to provide a resin composition which enables formation of a resin layer having excellent electrical performance including high frequency performance and appropriate solubility with desmear solution required on a material used in manufacturing of a printed wiring board. To achieve the object, the resin composition used for constituting a resin layer on a metal layer surface of a laminate includes a polyphenylene ether compound and 10 parts by mass to 100 parts by mass of a styrene-butadiene block copolymer and 0.1 parts by mass to 100 parts by mass of a component promoting solubility with desmear solution against 100 parts by mass of the polyphenylene ether compound.

Abstract: A resin composition for use in a dielectric layer of a capacitor device or a capacitor-embedded printed circuit board is provided in which the resin composition can improve stability in capacitance and insulation properties of the capacitor device under high temperature and high humidity and ensures high adhesion of the dielectric layer to the device. The resin composition comprises a resin component and a dielectric filler. The resin component comprises an epoxy resin, an active ester resin, and an aromatic polyamide resin.

Abstract: There is provided a resin-coated copper foil including a resin layer having excellent dielectric characteristics suitable for high frequency applications, exhibiting high interlayer adhesion and heat resistance in the case where the resin layer is used in a copper-clad laminate or printed circuit board. The resin-coated copper foil of the present invention includes a copper foil and a resin layer on at least one side of the copper foil. The resin layer comprises a resin mixture containing an epoxy resin, a polyimide resin, and an aromatic polyamide resin; and an imidazole curing catalyst.

Abstract: There is provided a copper-clad laminate in which transmission characteristics exhibited by a resin layer can be further improved while sufficient peel strength between a copper foil and the resin layer is ensured. The laminate includes a copper foil; an adhesive layer including a polyphenylene ether resin, a polyimide resin, an olefin-based resin, a liquid crystal polymer, a polyester resin, a polystyrene resin, a hydrocarbon elastomer, a benzoxazine resin, an active ester resin, a cyanate ester resin, a bismaleimide resin, a butadiene resin, a hydrogenated or non-hydrogenated styrene butadiene resin, an epoxy resin, a fluororesin, a vinyl-group-containing resin, or the like; and a resin layer. The maximum height Sz at a copper foil surface on the adhesive layer side is 6.8 ?m or less. The dielectric loss tangent value of the adhesive layer at 1 GHz, ?a, is equal to or less than that of the resin layer, ?r.

Abstract: There is provided with a metal foil-releasable resin layer composite comprising a metal foil and a releasable resin layer on at least one surface of the metal foil, wherein the releasable resin layer includes 100 parts by mass, in total, of (A) 50 to 95 parts by mass of a nonpolar resin, (B) 4 to 40 parts by mass of a thermosetting resin, and (C) 1 to 25 parts by mass of a release agent, wherein the mass ratio (A/B) of the nonpolar resin (A) to the thermosetting resin (B) is 55/45 to 96/4. The metal foil-releasable resin layer composite can achieve release with significantly low release strength between the metal foil and the releasable resin layer without damage of the releasable resin layer and can withstand hot pressing.

Abstract: A resin composition for use in a dielectric layer of a capacitor is provided that can control a decrease in capacitance or dielectric constant at high temperature and ensure high dielectric characteristics and high adhesion of the composition to a circuit. The resin composition contains a resin component containing an epoxy resin, a diamine compound, and a polyimide resin; and a dielectric filler composed of a metal oxide containing at least two elements selected from the group consisting of Ba, Ti, Sr, Pb, Zr, La, Ta, and Bi. The content of the dielectric filler is 60 to 85 parts by weight on the basis of 100 parts by weight of solid content in the resin composition.

Abstract: A resin composition for use in a dielectric layer of a capacitor device or a capacitor-embedded printed circuit board is provided in which the resin composition can improve stability in capacitance and insulation properties of the capacitor device under high temperature and high humidity and ensures high adhesion of the dielectric layer to the device. The resin composition comprises a resin component and a dielectric filler. The resin component comprises an epoxy resin, an active ester resin, and an aromatic polyamide resin.

Abstract: A material for forming of the capacitor layer which generates no crack in drilling on the dielectric layer of the capacitor in manufacturing of a highly multilayered printed wiring board embedded a capacitor circuit. Copper clad laminate for forming of an embedded capacitor layer of a multilayered printed wiring board including an embedded capacitor circuit having a layer structure of copper layer/dielectric layer of the capacitor/copper layer in an inner layer characterized in that the composite elastic modulus Er of the resin film constituting the dielectric layer of the capacitor along the thickness direction is less than 6.1 GPa is employed.

Abstract: A production method includes: preparing a metal clad laminate including a dielectric layer?30 ?m thick, a first metal foil on a first surface of the dielectric layer, a second metal foil on a second surface of the dielectric layer, first and second carriers on the metal foil via a releasable layer; arranging the pair of metal clad laminates on a resin substrate so the first carrier of each metal clad laminate faces the resin substrate on each surface of the resin substrate; releasing the second carrier from a laminated member to expose the second metal foil; forming a pattern on the second metal foil; arranging an insulating layer on the pattern and arranging a metal layer on the insulating layer; and separating the first carrier and the first metal foil from each other. The dielectric layer has a strain energy at break of 1.8 MJ or less.

Abstract: An object of the present invention is to provide a multilayered printed wiring board provided with split through holes excellent in through-hole formability and co-planarity in inner layer wirings around through holes for providing of a conduction isolation portion. To achieve the object, “a copper clad laminate provided with a protective layer for manufacturing of a printed wiring board having a conduction isolation portion electrically isolating a through hole, the copper clad laminate is characterized in that the copper clad laminate is provided with a protective layer on the surface that can be released after forming of the through holes for providing of a conduction isolation portion and filling of the through holes for providing of a conduction isolation portion by a plating resist” is employed.

Abstract: A production method includes: preparing a metal clad laminate including a dielectric layer ?30 ?m thick, a first metal foil on a first surface of the dielectric layer, a second metal foil on a second surface of the dielectric layer, first and second carriers on the metal foil via a releasable layer; arranging the pair of metal clad laminates on a resin substrate so the first carrier of each metal clad laminate faces the resin substrate on each surface of the resin substrate; releasing the second carrier from a laminated member to expose the second metal foil; forming a pattern on the second metal foil; arranging an insulating layer on the pattern and arranging a metal layer on the insulating layer; and separating the first carrier and the first metal foil from each other. The dielectric layer has a strain energy at break of 1.8 MJ or less.

Abstract: There is provided a resin-coated copper foil including a resin layer having excellent dielectric characteristics suitable for high frequency applications, exhibiting high interlayer adhesion and heat resistance in the case where the resin layer is used in a copper-clad laminate or printed circuit board. The resin-coated copper foil of the present invention includes a copper foil and a resin layer on at least one side of the copper foil. The resin layer comprises a resin mixture containing an epoxy resin, a polyimide resin, and an aromatic polyamide resin; and an imidazole curing catalyst.

Abstract: A material for forming of the capacitor layer which generates no crack in drilling on the dielectric layer of the capacitor in manufacturing of a highly multilayered printed wiring board embedded a capacitor circuit. Copper clad laminate for forming of an embedded capacitor layer of a multilayered printed wiring board including an embedded capacitor circuit having a layer structure of copper layer/dielectric layer of the capacitor/copper layer in an inner layer characterized in that the composite elastic modulus Er of the resin film constituting the dielectric layer of the capacitor along the thickness direction is less than 6.1 GPa is employed.

Abstract: A material for forming of the capacitor layer which generates no crack in drilling on the dielectric layer of the capacitor in manufacturing of a highly multilayered printed wiring board embedded a capacitor circuit. Copper clad laminate for forming of an embedded capacitor layer of a multilayered printed wiring board including an embedded capacitor circuit having a layer structure of copper layer/dielectric layer of the capacitor/copper layer in an inner layer characterized in that the composite elastic modulus Er of the resin film constituting the dielectric layer of the capacitor along the thickness direction is less than 6.1 GPa is employed.

Abstract: There is provided with a metal foil-releasable resin layer composite comprising a metal foil and a releasable resin layer on at least one surface of the metal foil, wherein the releasable resin layer includes 100 parts by mass, in total, of (A) 50 to 95 parts by mass of a nonpolar resin, (B) 4 to 40 parts by mass of a thermosetting resin, and (C) 1 to 25 parts by mass of a release agent, wherein the mass ratio (A/B) of the nonpolar resin (A) to the thermosetting resin (B) is 55/45 to 96/4. The metal foil-releasable resin layer composite can achieve release with significantly low release strength between the metal foil and the releasable resin layer without damage of the releasable resin layer and can withstand hot pressing.

Abstract: An object of the present invention is to provide a multilayered printed wiring board provided with split through holes excellent in through-hole formability and co-planarity in inner layer wirings around through holes for providing of a conduction isolation portion. To achieve the object, “a copper clad laminate provided with a protective layer for manufacturing of a printed wiring board having a conduction isolation portion electrically isolating a through hole, the copper clad laminate is characterized in that the copper clad laminate is provided with a protective layer on the surface that can be released after forming of the through holes for providing of a conduction isolation portion and filling of the through holes for providing of a conduction isolation portion by a plating resist” is employed.

Abstract: Object is to provide a material for forming of the capacitor layer which generates no crack in drilling on the dielectric layer of the capacitor in manufacturing of a highly multilayered printed wiring board embedded a capacitor circuit. To achieve the object, copper clad laminate for forming of an embedded capacitor layer of a multilayered printed wiring board including an embedded capacitor circuit having a layer structure of copper layer/dielectric layer of the capacitor/copper layer in an inner layer characterized in that the Young's modulus Er of the resin film constituting the dielectric layer of the capacitor along the thickness direction is less than 6.1 GPa is employed.

Abstract: An object of the present invention is to provide a resin composition which enables formation of a resin layer having excellent electrical performance including high frequency performance and appropriate solubility with desmear solution required on a material used in manufacturing of a printed wiring board. To achieve the object, the resin composition used for constituting a resin layer on a metal layer surface of a laminate includes a polyphenylene ether compound and 10 parts by mass to 100 parts by mass of a styrene-butadiene block copolymer and 0.1 parts by mass to 100 parts by mass of a component promoting solubility with desmear solution against 100 parts by mass of the polyphenylene ether compound.

Abstract: The object of the present invention is to provide a copper foil with an ultra thin resin layer for a printed wiring board without roughening treatment. In order to achieve the object, there is adopted a copper foil with an ultra thin adhesive layer for a printed wiring board 1 or the like, which is a copper foil provided with an ultra thin primer resin layer for securing good laminating adhesiveness with a resin base material on one side of a copper foil 3 without roughening treatment, characterized in that a silane coupling agent layer 2 is formed on a surface of the copper foil without the roughening treatment having a surface roughness (Rz) of 2 ?m or below, and an ultra thin primer resin layer 4 having a converted thickness of 1 to 5 ?m is formed on the silane coupling agent layer 2.