Patents by Inventor Toshifumi Mizokami

Toshifumi Mizokami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SHUNT RESISTOR
    Publication number: 20250132075
    Abstract: The shunt resistor includes: the resistance body; and the electrode joined to the resistance body and made of aluminum as a main component. In addition, the shunt resistor includes the plated portion configured to cover at least the joined portions between the resistance body and the electrode the plated portion being configured of a plating having higher specific resistance than the resistance body.
    Type: Application
    Filed: August 3, 2022
    Publication date: April 24, 2025
    Inventors: Yoichi Sakai, Keishi Nakamura, Toshifumi Mizokami
  • Mounting structure of electronic component
    Patent number: 8895869
    Abstract: Electrode protective films 13a and 13b are formed on the surface of the metal layer using imidazole preflux, as terminal electrodes 35a and 35b of an electronic component. The terminal electrodes of an electronic component on which the protective films are formed are fixed by electroconductive adhesives 33a and 33b supplied to mounting lands 40a and 40b. Thereby an electronic component mounting structure without change in resistance caused by electroconductive adhesives is provided.
    Type: Grant
    Filed: November 9, 2010
    Date of Patent: November 25, 2014
    Assignee: Koa Corporation
    Inventor: Toshifumi Mizokami
  • MOUNTING STRUCTURE OF ELECTRONIC COMPONENT
    Publication number: 20120305302
    Abstract: Electrode protective films 13a and 13b are formed on the surface of the metal layer using imidazole preflux, as terminal electrodes 35a and 35b of an electronic component. The terminal electrodes of an electronic component on which the protective films are formed are fixed by electroconductive adhesives 33a and 33b supplied to mounting lands 40a and 40b. Thereby an electronic component mounting structure without change in resistance caused by electroconductive adhesives is provided.
    Type: Application
    Filed: November 9, 2010
    Publication date: December 6, 2012
    Inventor: Toshifumi Mizokami