Patents by Inventor Toshifumi Nonaka

Toshifumi Nonaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyarylene sulfide resin composition
    Patent number: 5252679
    Abstract: A polyarylene sulfide composition comprises (A) 99 to 20 parts by weight of polyarylene sulfide, (B) 1 to 80 parts by weight of a polyamide and (C) 0.01 to 5 parts by weight, based on 100 parts by weight of (A) and (B) in total, of an alkoxysilane. It may further comprise (D) up to 400 parts by weight of a filler in the form of fiber, particles or plates. It can be produced by blending (A), (B), (C) and (D) with one another and melt-kneading the blend for at least 30 seconds while heated.
    Type: Grant
    Filed: December 6, 1990
    Date of Patent: October 12, 1993
    Assignee: Polyplastics Co., Ltd.
    Inventors: Hajime Serizawa, Hiroyuki Sano, Masaru Kubota, Katsumi Uota, Toshifumi Nonaka
  • Polyarylene sulfide resin molding composition
    Patent number: 5252656
    Abstract: A polyarlene sulfide resin molding composition suitable for molding and providing a molded article having excellent surface appearance and improved mechanical properties comprises(A) 100 parts by weight of a polyarylene sulfide resin and(B) 5 to 150 parts by weight of "white" mica (muscovite mica).
    Type: Grant
    Filed: July 10, 1991
    Date of Patent: October 12, 1993
    Assignee: Polyplastics Co., Ltd.
    Inventors: Toshifumi Nonaka, Katsutoshi Suzuki
  • Polyarylene sulfide resin composition
    Patent number: 5185392
    Abstract: A polyarylene sulfide resin composition useful for molded parts comprises (A) 100 parts by weight of a polyarylene sulfide, (B) 0.01 to 10 parts by weight of an organic bisphosphite of the formula: ##STR1## in which R.sub.1 and R.sub.2 are each an alkyl, an alkyl having at least one substituent, an aryl, an aryl having at least one substituent or an alkoxy, (C) 0 to 400 parts by weight of an inorganic filler and (D) 0.01 to 5 parts by weight of at least one alkoxy silane.
    Type: Grant
    Filed: December 26, 1990
    Date of Patent: February 9, 1993
    Assignee: Polyplastics Co., Inc.
    Inventors: Toshifumi Nonaka, Toshikatsu Nitoh, Andrew Auerbach
  • Weld-containing polyarylene sulfide resin molded article
    Patent number: 4917957
    Abstract: A molded article useful for electrical parts, such as connectors, has at least one weld portion and is obtained by injection molding of a polyarylene sulfide composition comprising a polyarylene sulfide and an alkoxysilane such as aminoalkoxysilanes, epoxyalkoxysilanes, mercaptoalkoxysilanes and vinylalkoxysilanes, and optionally an inorganic filler.
    Type: Grant
    Filed: July 29, 1988
    Date of Patent: April 17, 1990
    Assignee: Polyplastics Co., Ltd.
    Inventors: Toshikatsu Nitoh, Toshifumi Nonaka