Patents by Inventor Toshifumi Oida

Toshifumi Oida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7245884
    Abstract: An RF module includes a multi-layered substrate. A base-band IC, a memory IC, a quartz oscillator and surface-mount components are mounted on the upper surface of the multi-layered substrate. A metallic cap also is attached to the upper surface of the multi-layered substrate. A cavity is formed in the lower surface of the multi-layered substrate substantially at the center thereof. A first RF-IC and a second RF-IC are embedded in the cavity. Wiring patterns for providing connections between the base-band IC and the memory IC, through-holes, RF passive components, and the shield ground electrode pattern are disposed inside of the multi-layered substrate.
    Type: Grant
    Filed: June 19, 2001
    Date of Patent: July 17, 2007
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Toshifumi Oida, Takahiro Watanabe, Eigoro Ina, Norio Nakajima
  • Patent number: 6693243
    Abstract: On a mounting surface of a multilayered component as a surface mounting component, an isolated electrode is arranged so as to be isolated from other terminal electrodes on the mounting surface. For solder applied to the isolated electrode, the application range can be securely limited to an area within the isolated electrode.
    Type: Grant
    Filed: November 13, 2000
    Date of Patent: February 17, 2004
    Assignee: Murata Manufacturing Co, Ltd.
    Inventors: Toshifumi Oida, Akihiro Ochii, Nobuyoshi Okuda, Yoshirou Satou, Katsuhiko Fujikawa
  • Patent number: 6603960
    Abstract: A transmission output control device comprising: a directional coupler which branches a part of an amplified transmission signal from a high output amplifier; and a detector which detects a part of said branched transmission signal; wherein the directional coupler and the detector are integrated in a laminated body in which a plurality of dielectric layers are laminated.
    Type: Grant
    Filed: March 24, 2000
    Date of Patent: August 5, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Toshifumi Oida, Masaki Kimura, Satoshi Ishino, Norio Nakajima
  • Patent number: 6480708
    Abstract: A compact variable attenuator, composite variable attenuator, and mobile communication apparatus capable of variably controlling attenuation continuously. The variable attenuator includes a first comb line comprising first and second lines which are electromagnetically coupled with a coupling coefficient M, a second comb line comprising third and fourth lines which are electromagnetically coupled with a coupling coefficient M, and first and second diodes connected to the third and fourth lines of the second comb line. A first terminal is connected to one end of the first line and a second terminal is connected to one end of the second line. The first and second diodes are connected between one end of each of the third and fourth lines and a ground with their anodes connected to one end of each of the third and fourth lines, respectively.
    Type: Grant
    Filed: March 9, 2000
    Date of Patent: November 12, 2002
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Koji Tanaka, Toshifumi Oida
  • Patent number: 6414565
    Abstract: A variable attenuator is provided with a comb line formed of first and second lines electromagnetically coupled at a coupling degree of M, and diodes connected to the first and second lines constituting the comb line. One end of the first line is grounded through a capacitor and also connected to an input terminal through a capacitor. A diode is connected between the ground and the other end of the first line such that its anode is connected to the other end of the first line. The node connecting the other end of the first line and the anode of the diode is connected to a control terminal through a resistor. One end of the second line is grounded through a capacitor and also connected to an output terminal through a capacitor. Another diode is connected between the ground and the other end of the second line such that its anode is connected to the other end of the second line. The node connecting the other end of the second line and the anode of the diode is connected to a control terminal through a resistor.
    Type: Grant
    Filed: August 17, 1999
    Date of Patent: July 2, 2002
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Koji Tanaka, Toshifumi Oida, Norio Nakajima
  • Publication number: 20020049042
    Abstract: An RF module includes a multi-layered substrate. A base-band IC, a memory IC, a quartz oscillator and surface-mount components are mounted on the upper surface of the multi-layered substrate. A metallic cap also is attached to the upper surface of the multi-layered substrate. A cavity is formed in the lower surface of the multi-layered substrate substantially at the center thereof. A first RF-IC and a second RF-IC are embedded in the cavity. Wiring patterns for providing connections between the base-band IC and the memory IC, through-holes, RF passive components, and the shield ground electrode pattern are disposed inside of the multi-layered substrate.
    Type: Application
    Filed: June 19, 2001
    Publication date: April 25, 2002
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Toshifumi Oida, Takahiro Watanabe, Eigoro Ina, Norio Nakajima
  • Patent number: 6288680
    Abstract: An antenna apparatus 10 includes a chip antenna 14 provided with a conductor 11, a power-supply electrode 12 to which one end of the conductor 11 is connected, and a terminal electrode 13 to which the other end of the conductor is connected; and a mounting substrate 18 provided with a line-shaped radiative conductor 15 formed by printing an electrically conductive material on a surface, a line-shaped conductive pattern 16, and a substantially rectangular ground electrode 17. The chip antenna 14 is mounted on the mounting substrate 18. The power-supply electrode 12 of the chip antenna 14 is connected through the conductive pattern 16 on the mounting substrate 18 to a power-supply source V. The terminal electrode 13 of the chip antenna 14 is connected to one end of the radiative conductor 15 on the mounting substrate 18.
    Type: Grant
    Filed: March 18, 1998
    Date of Patent: September 11, 2001
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Teruhisa Tsuru, Seiji Kanba, Toshifumi Oida, Harufumi Mandai
  • Patent number: 6034640
    Abstract: The invention provides an antenna device, comprising: an antenna body including a conductor, an equivalent circuit of said conductor comprising an inductive component and a resistive component in a series connection, wherein a frequency adjusting circuit including at least a parallel circuit of a switching element and a passive element is connected to said conductor of said antenna body. The antenna body is connected in series with said frequency adjusting circuit.The invention enable to provide a compact antenna device for use in a mobile communication apparatus that performs transmission and reception on frequencies in a wide range.
    Type: Grant
    Filed: April 1, 1998
    Date of Patent: March 7, 2000
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Toshifumi Oida, Teruhisa Tsuru, Yoshihiro Yoshimoto, Harufumi Mandai
  • Patent number: 6028554
    Abstract: The invention provides a mobile image apparatus (10), comprising: a case unit (11); at least one antenna (12) disposed at least one of within said case unit (11) and outside said case unit (11); wherein said chip antenna (12) comprises; a substrate (1) made of at least one of a dielectric material and a magnetic material; at least one conductor (2) disposed at least one of within said substrate (1) and on a surface of said substrate (1); at least one power feeding terminal (3) disposed on a surface of said substrate (1) and connected to one end of said conductor (2) for applying a voltage to said conductor (2).
    Type: Grant
    Filed: March 5, 1998
    Date of Patent: February 22, 2000
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Harufumi Mandai, Teruhisa Tsuru, Toshifumi Oida
  • Patent number: 6028568
    Abstract: The invention provides a chip-antenna, comprising: a base member including a mounting surface and made of at least one of dielectric ceramic and magnetic ceramic; at least two conductors disposed within said base member or on a surface of said base member, at least a portion of said conductors being substantially perpendicular to the mounting surface of said base member; a feeding electrode for applying a voltage to said conductors and disposed on the surface of said base member; a ground electrode disposed at least one on the surface of and within said base member; one of said conductors being served as a first conductor, one end of which is connected to said feeding electrode; the rest of said conductor being served as a second conductor, one end of which are connected to said ground electrode; and the other end of said first conductor and the other end of said second conductor being connected.
    Type: Grant
    Filed: December 9, 1998
    Date of Patent: February 22, 2000
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kenji Asakura, Toshifumi Oida, Harufumi Mandai
  • Patent number: 5912647
    Abstract: An antenna unit having a substrate and a radiator, including a metal plate, which is mounted on the substrate, the radiator being provided with a feed terminal, a ground terminal and an electrostatic capacitance connecting terminal extending toward the substrate, so that the radiator is fixed to the substrate through the feed terminal, the ground terminal and the electrostatic capacitance connecting terminal, and further a capacitance being connected between the capacitance connecting terminal and a ground potential.
    Type: Grant
    Filed: May 7, 1997
    Date of Patent: June 15, 1999
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Teruhisa Tsuru, Harufumi Mandai, Toshifumi Oida
  • Patent number: 5894252
    Abstract: A resonator 20 as an example of a laminated ceramic electronic component includes a first dielectric layer 22a. Two long and narrow holes (grooves) 24a and 24b are formed in the first dielectric layer 22a. A quadrangular cylindrical inner conductor 26 as a pattern electrode is formed in the vicinity of the holes 24a and 24b of the first dielectric layer 22a and inside the holes 24a and 24b. A second dielectric layer 22b and a first earth electrode 32a are formed on the first dielectric layer 22a. A third dielectric layer 22c, a second earth electrode 32b and a fourth dielectric layer 22d are formed under the first dielectric layer 22a.
    Type: Grant
    Filed: November 3, 1997
    Date of Patent: April 13, 1999
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Toshifumi Oida
  • Patent number: 5874926
    Abstract: A matching circuit and an antenna apparatus which, though small-sized, can be used in a radio apparatus which transmits and receives radio waves having a wide range of frequencies. A matching circuit includes an inductance element formed of a chip inductor connected in series with an antenna body, a first capacitance element formed of a trimmer capacitor, and a second capacitance element formed of a chip capacitor, which capacitance elements are connected between respective ends of the inductance element and a ground terminal, and thus in parallel to the antenna body. One end of the inductance element is connected to the power supply terminal of the antenna body, and the other end is connected to a power source for applying a voltage to the antenna body. The first capacitance element is connected between a ground and the connection point of the power supply terminal of the antenna body and the inductance element.
    Type: Grant
    Filed: March 10, 1997
    Date of Patent: February 23, 1999
    Assignee: Murata Mfg Co. Ltd
    Inventors: Teruhisa Tsuru, Harufumi Mandai, Toshifumi Oida, Yoichiro Suga
  • Patent number: 5627551
    Abstract: An antenna adapted for surface mounting has a dielectric substrate on which are attached at least one primary grounding electrode and a connector electrode which together serve as a capacitor, at least one secondary grounding electrode formed adjacent to but insulated from the connector electrode, and a radiative member disposed thereover for emitting electromagnetic radiation. The resonant frequency of this antenna can be adjusted by trimming either its connector electrode or one of the secondary grounding electrode.
    Type: Grant
    Filed: July 12, 1995
    Date of Patent: May 6, 1997
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Teruhisa Tsuru, Toshifumi Oida