Patents by Inventor Toshifumi Sagawa

Toshifumi Sagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive sheet, method for manufacturing semiconductor device using same, method for manufacturing thermal airflow sensor using same, and thermal airflow sensor
    Patent number: 9779976
    Abstract: Provided is a thermal type airflow volume meter improving measurement accuracy, a method for manufacturing the same, and an adhesive sheet for use therein, the adhesive sheet divided into at least two or more per adherend and having a thickness of approximately 0.1 mm or less is divided to correspond to a shape of the adherend and generates or increases adhesion or stickiness by external energy.
    Type: Grant
    Filed: April 18, 2014
    Date of Patent: October 3, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Satoshi Ikeo, Toshifumi Sagawa, Ryosuke Doi, Hiroshi Kikuchi, Hideki Mukuno
  • Power semiconductor module
    Patent number: 9474191
    Abstract: Each of a plurality of power semiconductor module includes a can-type cooling case that is formed with a plate spring portion that generates compressive stress in the semiconductor circuit unit, an adjustment portion that is deformed to adjust elastic deformation of the plate spring portion, and a sidewall portion to which the plate spring portion and the adjustment portion are joined.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: October 18, 2016
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Masato Higuma, Toshifumi Sagawa, Takahiro Shimura, Hideto Yoshinari
  • Adhesive Sheet, Method for Manufacturing Semiconductor Device Using Same, Method for Manufacturing Thermal Airflow Sensor Using Same, and Thermal Airflow Sensor
    Publication number: 20160126127
    Abstract: Provided is a thermal type airflow volume meter improving measurement accuracy, a method for manufacturing the same, and an adhesive sheet for use therein, the adhesive sheet divided into at least two or more per adherend and having a thickness of approximately 0.1 mm or less is divided to correspond to a shape of the adherend and generates or increases adhesion or stickiness by external energy.
    Type: Application
    Filed: April 18, 2014
    Publication date: May 5, 2016
    Inventors: Satoshi IKEO, Toshifumi SAGAWA, Ryosuke DOI, Hiroshi KIKUCHI, Hideki MUKUNO
  • Power Semiconductor Module
    Publication number: 20150016063
    Abstract: Reliability of power semiconductor modules that excel in cooling performance is to be improved. To achieve the above object, each power semiconductor module includes a can-type cooling case that is formed with a plate spring portion that generates compressive stress in the semiconductor circuit unit, an adjustment portion that is deformed to adjust elastic deformation of the plate spring portion, and a sidewall portion to which the plate spring portion and the adjustment portion are joined.
    Type: Application
    Filed: February 8, 2013
    Publication date: January 15, 2015
    Inventors: Masato Higuma, Toshifumi Sagawa, Takahiro Shimura, Hideto Yoshinari