Abstract: A semiconductor device includes a first pad, a second pad, a first output driver provided for the first pad and configured to output a first transmission signal to the first pad, a second output driver provided for the second pad and configured to output a second transmission signal to the second pad, a register that stores first and second calibration values, a first reference resistor for the first pad and having a resistance value that is set according to the first calibration value, a second reference resistor for the second pad and having a resistance value that is set according to the second calibration value, a first setting circuit configured to calibrate a resistance value of the first output driver using the first reference resistor, and a second setting circuit configured to calibrate a resistance value of the second output driver using the second reference resistor.

Abstract: A semiconductor memory device includes an output pin configured for connection with a memory controller, an output circuit configured to output through the output pin a voltage signal that changes over time in accordance with one or more bits of data to be output to the memory controller, and a control circuit configured to temporarily change a drive capability of the output circuit each time a voltage signal corresponding to one bit of the data is output through the output pin.

Abstract: In manufacturing a link plate for a roller chain, a band of sheet steel is intermittently forwarded along a path past series of dies, including rough punching dies and shaving dies. The punching dies and corresponding shaving dies are located symmetrically on opposite sides of an intermediate location along the path. The intermediate location coincides with a location at which the lateral deviation of the band reverses. Consequently, the outer peripheral surfaces of the plate and the inner peripheral surfaces of the connecting pin holes, both being formed by rough punching, are brought into very close alignment with the shaving dies.

Abstract: In manufacturing a link plate for a roller chain, a band of sheet steel is intermittently forwarded along a path past series of dies, including rough punching dies and shaving dies. The punching dies and corresponding shaving dies are located symmetrically on opposite sides of an intermediate location along the path. The intermediate location coincides with a location at which the lateral deviation of the band reverses. Consequently, the outer peripheral surfaces of the plate and the inner peripheral surfaces of the connecting pin holes, both being formed by rough punching, are brought into very close alignment with the shaving dies.