Abstract: This invention is to save using additional area of self-emission panel substrate, thereby ensuring effective number of multi-faced unit panels; to reduce an area occupied by self-emission panel with respect to display area, thereby producing electronic device mounting self-emission panel which is compact in size and light in weight; to prevent a trouble such as cracking or the like when cutting/dividing a mother support substrate, thereby ensuring a high productivity irrespective of a shape of a self-emission panel substrate. A plurality of sealed self-emission sections are formed on a mother support substrate, connecting sections formed with lead-out wiring portions led out from the self-emission sections are formed outside the self-emission sections on the mother support substrate.

Abstract: It is an object of the present invention to provide an improved structure having an adequate strength to satisfy a requirement of making a thin electro-optical panel. The electro-optical panel forms a sealing area having an electro-optical functional section between the support substrate and the sealing member. The support substrate has a lead-out area containing an area for forming lead-out wiring extending from the sealing area and for connecting or mounting the driving means (IC chip, flexible substrate and the like) to the lead-out wiring. The sealing member has protruding reinforcement sections protruding from the sealing area S on to the lead-out area. The support substrate and the sealing member are bonded together through an adhesive layer, thereby forming an adhesive area surrounding the sealing member.