Abstract: A thermoelectric module is constituted by a pair of substrates having electrodes, which are arranged opposite to each other with a prescribed space therebetween, in which a prescribed number of thermoelectric elements are arranged in such a way that a p-type and an n-type are alternately arranged, so that the thermoelectric elements are connected in series or in parallel together with the electrodes. Herein, one substrate is a heat absorption side, and other substrate is a heat radiation side. In addition, a current density in a current transmission area of the heat-absorption-side electrode is set to 50 A/mm2 or less, and a height of the thermoelectric element is set to 0.7 mm or less. Furthermore, a temperature-controlled semiconductor module can be realized by combining a thermoelectric module with a semiconductor component such as a semiconductor laser.

Abstract: An optical fiber coupler reinforcing member comprises an approximately rectangular member formed by a hard material, and has a flat surface along the longitudinal direction thereof. In addition, the shape thereof in cross-section is a hexagonal shape which inscribes a cylindrical member. Furthermore, a recess having a U-shaped cross-section is formed in the longitudinal direction of the above-mentioned approximately rectangular member and houses coupling section. The coupling section housed within the recess is fixed at both ends of the recess by an adhesive or the like. In addition, both ends of the inner wall surface of the recess have been given bevel sections. As a result, the optical fiber coupler reinforcing member having high reliability at low cost, with which the strength with respect to external force is improved and with which processability and the assembly operations of the optical fiber coupler are easy, are provided.

Abstract: A heat radiator for dissipating heat from an electronic device, which is mounted on a board or which is installed in a casing, to the outside thereof is basically composed of a substrate having plenty of through holes, which are produced by press molding and sintering. The substrate having a low thermal expansion coefficient is made of a copper-tungsten alloy or a copper-molybdenum alloy in which the copper content is smaller than the tungsten content or molybdenum content. The through holes each having a circular shape or a rectangular shape are infiltrated with the compound having a high thermal conductivity and composed of a copper-tungsten alloy or a copper-molybdenum alloy in which the copper content is greater than the tungsten content or molybdenum content. Thus, the heat radiator allows thermal conduction along axial directions of the through holes while substantially avoiding unwanted thermal expansion thereof.

Abstract: A thermoelectric generator (e.g., a waste heat recovery apparatus) comprises a heat absorption member made of touch pitch copper and a thermoelectric module in which a plurality of thermoelectric elements are arranged to join electrodes between a pair of insulating substrates, thus utilizing waste heat emitted from a lamp having an exterior wall. One surface of the heat absorption member is formed to match the exterior wall of the lamp, and the other surface is formed to match the thermoelectric module, which is accompanied with a heat dissipating fin, which is further cooled by a cooling fan. At least a part of the heat absorption member can be arranged close to a light emitting tube of the lamp. The thermoelectric module generates electricity based on the heat transferred thereto from the lamp via the heat absorption member.

Abstract: Thermoelectric material of (Bi, Sb)(Te, Se) system is produced through a liquid quenching method and an extrusion from a die unit having an inlet portion and an outlet portion crossing each other at 30-150 degrees so that the crystal grains have an average grain size equal to or less than 30 microns and (001) planes mostly oriented in parallel to a direction in which electric current to flow, thereby achieving the figure of merit equal to or greater than 3.0×10−3/K.

Abstract: An optical fiber coupler reinforcing member comprises an approximately rectangular member formed by a hard material, and has a flat surface along the longitudinal direction thereof. In addition, the shape thereof in cross-section is a hexagonal shape which inscribes a cylindrical member. Furthermore, a recess having a U-shaped cross-section is formed in the longitudinal direction of the above-mentioned approximately rectangular member and houses coupling section. The coupling section housed within the recess is fixed at both ends of the recess by an adhesive or the like. In addition, both ends of the inner wall surface of the recess have been given bevel sections. As a result, the optical fiber coupler reinforcing member having high reliability at low cost, with which the strength with respect to external force is improved and with which processability and the assembly operations of the optical fiber coupler are easy, are provided.

Abstract: An electron gun that can provide a desired electron beam modulation effect without preventing a modulation magnetic field from passing from an exterior of the vacuum portion is provided. A part of a tubular G3 electrode in an electron gun is formed into a coiled portion to allow the modulation magnetic field to pass through the clearances between parts of a wire composing the coiled portion.

Abstract: A thermoelectric module is constituted by a pair of substrates having electrodes, which are arranged opposite to each other with a prescribed space therebetween, in which a prescribed number of thermoelectric elements are arranged in such a way that a p-type and an n-type are alternately arranged, so that the thermoelectric elements are connected in series or in parallel together with the electrodes. Herein, one substrate is a heat absorption side, and other substrate is a heat radiation side. In addition, a current density in a current transmission area of the heat-absorption-side electrode is set to 50 A/mm2 or less, and a height of the thermoelectric element is set to 0.7 mm or less. Furthermore, a temperature-controlled semiconductor module can be realized by combining a thermoelectric module with a semiconductor component such as a semiconductor laser.

Abstract: A low-carbon steel sheet for a mask for use in a tension type cathode ray tube with bridge, characterized in that it has a chemical composition, in mass %:C:0.001 to 0.015%, Si:0.020% or less, Mn:0.2 to 1.8%, P:0.02% or less, S:0.010% or less, ON: more than 0.010% and not more than 0.025%, Al:0.02% or less, O:0.010% or less and balance:Fe and inevitable impurities, with the proviso that (N mass %—0.52 Al mass %) is 0.005% or more. The low-carbon steel sheet can prevent the lowering of shielding capacity due to terrestrial magnetism.

Abstract: A thermoelectric module includes n-type semiconductor columns and p-type semiconductor columns connected in series through metal electrodes formed on inner surfaces of a pair of electrically insulating substrates, and the semiconductor columns are arranged so dense that the total cross sections of the semiconductor columns occupy at least 42 percent of one of the inner surfaces, whereby the converting efficiency is improved by virtue of restriction of the convective heat transfer between the electrically insulating substrates.

Abstract: Thermoelectric material of (Bi, Sb)(Te, Se) system is produced through a liquid quenching method and an extrusion from a die unit having an inlet portion and an outlet portion crossing each other at 30-150 degrees so that the crystal grains have an average grain size equal to or less than 30 microns and (001) planes mostly oriented in parallel to a direction in which electric current to flow, thereby achieving the figure of merit equal to or greater than 3.0×10−3/K.

Abstract: A heat radiator for dissipating heat from an electronic device, which is mounted on a board or which is installed in a casing, to the outside thereof is basically composed of a substrate having plenty of through holes, which are produced by press molding and sintering. The substrate having a low thermal expansion coefficient is made of a copper-tungsten alloy or a copper-molybdenum alloy in which the copper content is smaller than the tungsten content or molybdenum content. The through holes each having a circular shape or a rectangular shape are infiltrated with the compound having a high thermal conductivity and composed of a copper-tungsten alloy or a copper-molybdenum alloy in which the copper content is greater than the tungsten content or molybdenum content.

Abstract: Thermoelectric materials having a high performance index and thermoelectric elements are provided. The present thermoelectric materials are constituted by at least one element selected from the group consisting of Bi and Sb, at least one element selected from the group consisting of Te and Se, and, if necessary, at least one element selected from the group consisting of I, Cl, Hg, Br, Ag, and Cu. The long axis of each crystal grain of the thermoelectric material grows in the direction parallel to the pressing direction at the time of press formation, and the aspect ratio D/d of each crystal grain, which represents a ratio between the average crystal grain size along the long axis D to the average crystal grain size along the short axis d, is more than 1.5. The C-plane is oriented parallel to the pressing direction.

Abstract: A wood or iron golf club head comprising a ball-striking part and a hosel which are formed separately and joined together into an integral unit, the hosel containing microscopic pores, thus having a lower material density compared to that of the ball-striking part.

Abstract: Oxide is undesirably grown on the surface of grains of thermoelectric alloy, and the resistivity of the thermoelectric alloy is decreased due to the oxide; however, the oxide is reduced with hydrogen gas before the powder is solidified, and the pieces of thermoelectric alloy produced from the oxygen-free powder achieve a large figure of merit.

Abstract: Molten thermoelectric alloy expressed as (Bi, Sb).sub.2 (Te, Se).sub.3 is rapidly cooled at 10.sup.4 to 10.sup.6 .degree. K/second so as to crystallize the thermoelectric alloy, and powder of the thermoelectric alloy is hot pressed under the pressure equal to or greater than 400 kgf/cm.sup.2 at 200 degrees to 400 degrees in centigrade for a time period between {(-T/5)+90} minutes and 150 minutes or at 400 degrees to 500 degrees in centigrade for a time period between 5 minutes and 150 minutes so as to increase the figure of merit by virtue of the strain left in the crystal and/or micro crystal grain.

Abstract: Thermo-electric material has a composition containing at least one first element selected from the group consisting of Bi and Sb and at least one second element selected from the group consisting of Te and Se, and the crystal grains of the thermo-electric material have a mean crystal grain diameter equal to or less than 50 microns and a mean aspect ratio between 1 and 3 so as to achieve a large figure of merit equal to or greater than 3.4.times.10.sup.-3 /.degree.K.

Abstract: A process wherein powder of p/n-type semiconductor thermoelectric materials expressed as (Bi, Sb).sub.2 (Te, Se).sub.3 is hot pressed under the pressure equal to or greater than 400 kgf/cm.sup.2 at 200 degrees to 400 degrees in centigrade for a time period between {(-T/5)+90} minutes and 150 minutes or at 400 degrees to 500 degrees in centigrade for a time period between 5 minutes and 150 minutes so as to increase the figure of merit by virtue of the strain left in the crystal and/or micro crystal grain, and pieces of p/n-type semiconductor thermoelectric material are assembled with electrodes so as to obtain a thermoelectric module for a high thermoelectric conversion efficiency.

Abstract: Thermoelectric material contains one or more than one element selected from the transition metals and the rare earth metals, and the element promotes the amorphous phase in the thermoelectric material so as to increase the figure of merit.

Abstract: In construction of a composite golf club head made up of several shell components united together along their mating edges, a face shell component is made of titanium alloy and a rear shell component is made of pure titanium. The titanium alloy well withstands hard impact at shooting balls by a face whereas use of cheep pure titanium allows plastic shaping of the intricate rear shell component even at a low temperature to significantly lower the total production cost of the golf club head.