Patents by Inventor Toshiharu KOMORI

Toshiharu KOMORI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEAT DISSIPATION BOARD AND ELECTRONIC APPARATUS
    Publication number: 20210066159
    Abstract: A heat dissipation board includes a substrate, first, second, and third portions, and a bond. The substrate has a through-hole and includes a metal material. The first portion is located in the through-hole. The first portion has a higher thermal conductivity than the substrate and includes a metal material. The second portion is located on an upper surface of the substrate. The second portion has a higher thermal conductivity than the substrate and includes a metal material. The third portion is located on a lower surface of the substrate. The third portion has a higher thermal conductivity than the substrate and includes a metal material. The bond is between the substrate and the second portion, and between the substrate and the third portion. The first portion is at least partially continuous with the second portion and with the third portion through the bond or the bonding layer.
    Type: Application
    Filed: April 23, 2019
    Publication date: March 4, 2021
    Applicant: KYOCERA Corporation
    Inventors: Shinya TOMIDA, Hisaki MASUDA, Toshiharu KOMORI, Norimasa UEDA