Patents by Inventor Toshiharu Niitsu

Toshiharu Niitsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing method of semiconductor device and semiconductor device
    Patent number: 7223636
    Abstract: In a dividing method according to the present invention, a wiring board formed of ceramic is forced up (upper swing) by a lower clamp claw of a clamper, and some of a protruded wiring board portion protruding from a conveying chute is pressed against a support body to perform a first division under bending stress. Thereafter, the upward-located clamper is rotatably swung (lower swing) downward to allow an upper clamp claw to press down the protruded wiring board portion, thereby performing a reverse division at the first division section again as a second division. Since the second division allows a tensile force to act on a remaining and thin non-divided resin portion, the non-divided resin portion is torn off. Thus, the perfect division is enabled. Fractionalizing is done by a one-row division and an individual division so that each semiconductor device is formed.
    Type: Grant
    Filed: October 12, 2004
    Date of Patent: May 29, 2007
    Assignee: Renesas Technology Corp.
    Inventors: Yoshihiko Kobayashi, Susumu Sato, Koki Tanimoto, Tomio Yamada, Hirokazu Nakajima, Tomoaki Kudaishi, Yoshinori Shiokawa, Toshiharu Niitsu, Tsutomu Ida
  • Manufacturing method of semiconductor device and semiconductor device
    Publication number: 20070105283
    Abstract: In a dividing method according to the present invention, a wiring board formed of ceramic is forced up (upper swing) by a lower clamp claw of a clamper, and some of a protruded wiring board portion protruding from a conveying chute is pressed against a support body to perform a first division under bending stress. Thereafter, the upward-located clamper is rotatably swung (lower swing) downward to allow an upper clamp claw to press down the protruded wiring board portion, thereby performing a reverse division at the first division section again as a second division. Since the second division allows a tensile force to act on a remaining and thin non-divided resin portion, the non-divided resin portion is torn off. Thus, the perfect division is enabled. Fractionalizing is done by a one-row division and an individual division so that each semiconductor device is formed.
    Type: Application
    Filed: December 29, 2006
    Publication date: May 10, 2007
    Inventors: Yoshihiko Kobayashi, Susumu Sato, Koki Tanimoto, Tomio Yamada, Hirokazu Nakajima, Tomoaki Kudaishi, Yoshinori Shiokawa, Toshiharu Niitsu, Tsutomu Ida
  • Manufacturing method of semiconductor device and semiconductor device
    Publication number: 20050101052
    Abstract: In a dividing method according to the present invention, a wiring board formed of ceramic is forced up (upper swing) by a lower clamp claw of a clamper, and some of a protruded wiring board portion protruding from a conveying chute is pressed against a support body to perform a first division under bending stress. Thereafter, the upward-located clamper is rotatably swung (lower swing) downward to allow an upper clamp claw to press down the protruded wiring board portion, thereby performing a reverse division at the first division section again as a second division. Since the second division allows a tensile force to act on a remaining and thin non-divided resin portion, the non-divided resin portion is torn off. Thus, the perfect division is enabled. Fractionalizing is done by a one-row division and an individual division so that each semiconductor device is formed.
    Type: Application
    Filed: October 12, 2004
    Publication date: May 12, 2005
    Inventors: Yoshihiko Kobayashi, Susumu Sato, Koki Tanimoto, Tomio Yamada, Hirokazu Nakajima, Tomoaki Kudaishi, Yoshinori Shiokawa, Toshiharu Niitsu, Tsutomu Ida