Abstract: There is provided an ink jet head to transmit a shock wave propagated by an oscillator plate to the ink discharge orifice without significant power-loss for ink ejection. An ink jet head has a body (10) having an oscillator plate with an outer surface (11) and an inner surface (12), the inner surface being parallel to the outer surface. The ink jet head also has an ink pressuring chamber formed in the body between the inner surface and an opposed lower wall (13), the lower wall being angled relative to the inner surface. The ink jet head also has an ink feed chamber formed in the body. The ink jet head also has an ink feed passage formed in the body communicating between the ink feed chamber and the ink pressuring chamber, the ink feed passage having an ink feed orifice opening into the ink pressuring chambers.

Abstract: A curing device for drying bonding material used for bonding, for example, chips to a lead frame for semiconductor devices including a workpiece heating chamber casing having heating blocks for heat-drying the bonding material and a gas supply chamber casing provided above the workpiece heating chamber casing so as to cover the heating chamber casing and to supply a high-temperature gas to the surfaces of the heating blocks, and the gas supply chamber casing is constructed so that it can be opened and closed with respect to the workpiece heating chamber casing, assuring easy access to the inside of the heating chamber casing for various works such as cleaning of the heating blocks, etc.

Abstract: A curing device for drying bonding material used for bonding, for example, chips to a lead frame for semiconductor devices including reciprocatory motion drive pulleys provided on the drive shafts of a conveyor. A plurality of wire ropes are installed on the pulleys, and end fittings are attached to the ropes so as to be fitted to the reciprocatory motion drive pulleys. Thus, the positional relationship between the wire ropes and the reciprocatory motion drive pulleys are not changed, and the workpieces are correctly carried by the wire ropes onto heating blocks of the curing device.