Patents by Inventor Toshiharu Takata

Toshiharu Takata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6933050
    Abstract: The present invention features phosphorus containing epoxy resin compositions useful for imparting flame retardant properties to prepregs, resin-clad metal foils, and laminate boards constructed therefrom. The phosphorus containing epoxy resin composition (a) comprises a phosphorus containing epoxy resin (A) and a hardener. The phosphorus containing epoxy resin (A) has an epoxy equivalent of 300-500 g/eq. and comprises the reaction product of a phosphorus containing organic compound (B) and at least one epoxy resin (C). Phosphorus containing compound (B) is the reaction product of organic phosphorus compounds (b) having one active hydrogen atom bonded to a phosphorus atom and a quinone compound, wherein the molar ratio of (b) to quinone is from 1.25:1 to 2:1. This molar excess of (b) yields a phosphorus containing compound (B) that comprises both the reaction product of (b) and quinone, as well as un-reacted (b).
    Type: Grant
    Filed: February 6, 2003
    Date of Patent: August 23, 2005
    Assignees: Matsushita Electric Works, Ltd., Tohto Kasei Co., Ltd.
    Inventors: Takashi Sagara, Toshiharu Takata, Kiyoaki Ihara, Hidetaka Kakiuchi, Kazuo Ishihara, Chiaki Asano, Masao Gunji, Hiroshi Sato
  • Publication number: 20030162935
    Abstract: The present invention is to provide a phosphorus containing epoxy resin compositions, comprising an epoxy resin composition (a) in which a phosphorus containing epoxy resin (A) and a hardener are contained, wherein said phosphorus containing epoxy resin (A) is a phosphorus containing resin composition prepared by reacting phosphorus containing organic compounds (B) obtained by the reaction in the range of molar ratio of 1.01 to 2 moles of organic phosphorus compounds (b) having one active hydrogen atom bonded to phosphorus atom and 1 mole of quinone compound with at least one kind of epoxy resins (C) selected from the groups composed of general formula 1, general formula 2 or general formula 3 so as the content of said epoxy resins (C) to be from 20 to 45 wt.
    Type: Application
    Filed: February 6, 2003
    Publication date: August 28, 2003
    Inventors: Takashi Sagara, Toshiharu Takata, Kiyoaki Ihara, Hidetaka Kakiuchi, Kazuo Ishihara, Chiaki Asano, Masao Gunji, Hiroshi Sato
  • Patent number: 6524709
    Abstract: The present invention is to provide a phosphorus containing epoxy resin compositions, comprising an epoxy resin composition (a) in which a phosphorus containing epoxy resin (A) and a hardener are contained, wherein said phosphorus containing epoxy resin (A) is a phosphorus containing resin composition prepared by reacting phosphorus containing organic compounds (B) obtained by the reaction in the range of molar ratio of 1.01 to 2 moles of organic phosphorus compounds (b) having one active hydrogen atom bonded to phosphorus atom and 1 mole of quinone compound with at least one kind of epoxy resins (C) selected from the groups composed of general formula 1, general formula 2 or general formula 3 so as the content of said epoxy resins (C) to be from 20 to 45 wt.
    Type: Grant
    Filed: October 12, 2000
    Date of Patent: February 25, 2003
    Assignees: Matsushita Electric Works LTD, Tohto Kasei Co LTD
    Inventors: Takashi Sagara, Toshiharu Takata, Kiyoaki Ihara, Hidetaka Kakiuchi, Kazuo Ishihara, Chiaki Asano, Masao Gunji, Hiroshi Sato