Abstract: A coloring composition includes colorants, polymerizable compounds, and a resin, in which a ratio P/M of a mass P of the colorants to a mass M of the polymerizable compounds is 0.05 to 0.35, a content of the polymerizable compounds is 25 to 65 mass % with respect to a total solid content of the coloring composition, a ratio A/B of a minimum value A of an absorbance in a wavelength range of 400 nm or longer and shorter than 580 nm to a minimum value B of an absorbance in a wavelength range of 580 nm to 770 nm is 0.3 to 3, and a ratio C/D of a minimum value C of an absorbance in a wavelength range of 400 nm to 750 nm to a maximum value D of an absorbance in a wavelength range of 850 nm to 1300 nm is 5 or higher.

Abstract: An infrared ray absorbing composition kit comprises: a composition containing a copper compound or pigment having a maximum absorption wavelength in the wavelength range of 700 nm to 1000 nm; and a composition containing a metal oxide having a maximum absorption wavelength in the wavelength range of 800 nm to 2000 nm.

Abstract: An infrared ray cutoff filter including two or more high refractive index layers with a refractive index ranging from 1.65 to 2.00 and two or more low refractive index layers with a refractive index ranging from 1.20 to 1.45. At least one layer of the two or more high refractive index layers and the two or more low refractive index layers contains a dye having a maximum absorption wavelength in a range of 600 nm to 820 nm, and the two or more low refractive index layers are a plurality of kinds of layers which have different film thickness within a range of 50 nm to 250 nm.

Abstract: A near-infrared-absorbing composition includes a copper compound and a compound having a partial structure represented by Formula (1) described below and the content of the copper compound is in a range of 3×10?3 mol to 1 mol in relation to 1 g of the compound having the partial structure represented by Formula (1) described below, in Formula (1), R1 represents a hydrogen atom or an organic group.

Abstract: There is provided a curable resin composition which is capable of being coated so as to have a film thickness of 20 ?m or more and contains a dye having a maximum absorption wavelength in a wavelength range from 600 to 850 nm, and the infrared ray cut filter having a dye-containing layer having a film thickness of 20 ?m or more formed from the curable resin composition, and a production method of image sensor chip comprising a step of coating the curable resin composition on a glass substrate to form a dye-containing layer, and a step of adhering the glass plate having the dye-containing layer formed on a solid-state imaging device substrate.

Abstract: There is provided a curable resin composition which is capable of being coated on a solid-state imaging device substrate and contains a dye having a maximum absorption wavelength in a wavelength range from 600 to 850 nm, a production method of image sensor chip comprising a step of coating the curable resin composition on a solid-state imaging device substrate to form a dye-containing layer, and a step of adhering a glass substrate having an infrared ray reflecting film onto the dye-containing layer, and an image sensor chip comprising a solid-state imaging device substrate and a dye-containing layer composed of the curable resin composition.

Abstract: A coloring composition includes colorants, polymerizable compounds, and a resin, in which a ratio P/M of a mass P of the colorants to a mass M of the polymerizable compounds is 0.05 to 0.35, a content of the polymerizable compounds is 25 to 65 mass % with respect to a total solid content of the coloring composition, a ratio A/B of a minimum value A of an absorbance in a wavelength range of 400 nm or longer and shorter than 580 nm to a minimum value B of an absorbance in a wavelength range of 580 nm to 770 nm is 0.3 to 3, and a ratio C/D of a minimum value C of an absorbance in a wavelength range of 400 nm to 750 nm to a maximum value D of an absorbance in a wavelength range of 850 nm to 1300 nm is 5 or higher.

Abstract: Provided are infrared absorbing compositions that allow for preparing infrared absorption patterns having good adhesiveness to substrates on which the infrared absorbing composition is applied. The infrared absorbing composition contains an infrared absorbing material, and a polymerizable compound containing a partial structure represented by formula (1) below: wherein R1 represents a hydrogen atom or an organic group; the asterisk (*) indicates a point of attachment to another atom.

Abstract: An infrared ray absorbing composition kit comprises: a composition containing a copper compound or pigment having a maximum absorption wavelength in the wavelength range of 700 nm to 1000 nm; and a composition containing a metal oxide having a maximum absorption wavelength in the wavelength range of 800 nm to 2000 nm.

Abstract: A near-infrared-absorbing composition includes a copper compound and a compound having a partial structure represented by Formula (1) described below and the content of the copper compound is in a range of 3×10?3 mol to 1 mol in relation to 1 g of the compound having the partial structure represented by Formula (1) described below, in Formula (1), R1 represents a hydrogen atom or an organic group.

Abstract: According to an exemplary embodiment of the present invention, there is provided a curable resin composition for forming an infrared reflective film with a refractive index ranging from 1.65 to 2.00, which is coatable with a film thickness of 50 nm to 250 nm.

Abstract: A near-infrared blocking filter includes a near-infrared absorbing substance, has a film thickness of 300 ?m or less, and has a visible light transmissivity in a wavelength range of 450 nm to 550 nm of 85% or more, a light transmissivity at a wavelength of 800 nm is 20% or less, and a light transmissivity at a wavelength of 850 nm is 20% or less.

Abstract: There is provided a curable resin composition which is capable of being coated on a solid-state imaging device substrate and contains a dye having a maximum absorption wavelength in a wavelength range from 600 to 850 nm, a production method of image sensor chip comprising a step of coating the curable resin composition on a solid-state imaging device substrate to form a dye-containing layer, and a step of adhering a glass substrate having an infrared ray reflecting film onto the dye-containing layer, and an image sensor chip comprising a solid-state imaging device substrate and a dye-containing layer composed of the curable resin composition.

Abstract: According to an exemplary embodiment of the present invention, there is provided a curable resin composition comprising a dye having a maximum absorption wavelength in a range of 600 nm to 820 nm, and being capable of forming a high refractive index layer with a refractive index ranging from 1.65 to 2.00.

Abstract: There is provided a curable resin composition which is capable of being coated so as to have a film thickness of 20 ?m or more and contains a dye having a maximum absorption wavelength in a wavelength range from 600 to 850 nm, and the infrared ray cut filter having a dye-containing layer having a film thickness of 20 ?m or more formed from the curable resin composition, and a production method of image sensor chip comprising a step of coating the curable resin composition on a glass substrate to form a dye-containing layer, and a step of adhering the glass plate having the dye-containing layer formed on a solid-state imaging device substrate.

Abstract: An object of the present invention is to provide a biosensor comprising a hydrogel capable of immobilizing a physiologically active substance thereon, which can be produced conveniently by use of a safe material, and a method for producing the same. The present invention provides a method for producing a biosensor, which comprises bringing a polymer containing an activated carboxyl group into contact with a substrate surface coated with an organic layer having an amino group to thereby bind the polymer to the organic layer.

Abstract: An object of the present invention is to provide a biosensor comprising a hydrogel capable of immobilizing a physiologically active substance thereon, which can be produced conveniently by use of a safe material, and a method for producing the same. The present invention provides a method for producing a biosensor, which comprises bringing a polymer containing an activated carboxyl group into contact with a substrate surface coated with an organic layer having an amino group to thereby bind the polymer to the organic layer.

Abstract: One object of the present invention is to provide a biosensor and a production method therefor, by which hydrogel that enables immobilization of a physiologically active substance can be conveniently produced using safe raw materials. The present invention provides a biosensor which comprises a substrate having a metal layer on its surface, wherein a hydrophilic polymer having a reactive functional group capable of reacting with a hydroxyl group or an amino group of a physiologically active substance is bound to the metal layer directly or indirectly via an intermediate layer.

Abstract: An object of the present invention is to provide a biosensor and a method for immobilizing a physiologically active substance, by which preconcentration effects can be obtained at a pH that is equivalent to or higher than the isoelectric point of the physiologically active substance and the physiologically active substance can be covalently bound to the surface. The present invention provides a biosensor comprising a solid substrate to which a polymer having a primary or secondary amino group is bound, by which a physiologically active substance can be chemically immobilized following preconcentration of the substance at a pH that is equivalent to or higher than the isoelectric point of the substance.

Abstract: An object of the present invention is to provide a biosensor that can detect binding of a compound with a functional protein and then assay a reaction product derived from the activity of the functional protein again.