Abstract: An antenna according to the present disclosure at least includes: a semiconductor substrate; a first wiring layer; an insulating layer; a second wiring layer; a first ground pattern formed in the first wiring layer to cover a part of a first region of a main surface of the semiconductor substrate; and a second ground pattern formed in the second wiring layer in such a way that a part of an outer peripheral side of the first ground pattern overlaps a part of an outer peripheral side of the second ground pattern, and a part of the second ground pattern overlapping the first ground pattern is connected to first signal wiring. The first ground pattern and the second ground pattern, are formed to gradually deviate from each other from a region where the first ground pattern overlaps the second ground pattern toward an end region of the semiconductor substrate.

Abstract: A radio apparatus that has a high heat dissipation performance and can be manufactured at a low cost is provided. A radio apparatus includes a heat dissipation part that dissipates heat generated by a heat generation source to the outside. The heat dissipation part is composed of a solid material, and includes a heat dissipation plate and a plurality of heat dissipation fins provided in the heat dissipation plate, the plurality of heat dissipation fins being disposed on a side of the heat dissipation plate where a radiating element or a reflective element is disposed. The heat dissipation fins form a periodic structure along at least one direction on the heat dissipation plate. Tips of the plurality of heat dissipation fins form a virtual reflective surface that reflects incident waves to the plurality of heat dissipation fins.

Abstract: An object of the present disclosure is to provide a radio communication device, a method for a radio communication device, and a program with which it is possible to perform calibration of an antenna easily. A radio communication device according to the present disclosure comprises: a calibration control unit that performs DL control to transmit a calibration downlink (DL) signal from an antenna other than one of a plurality of antennas DA and to receive a calibration DL signal by the one antenna, and UL control to transmit a calibration uplink (UL) signal from the one antenna and to receive a calibration UL signal by the antenna other than the one antenna; and a calibration coefficient calculating unit that calculates a calibration coefficient on the basis of a DL channel coefficient of a transmitter and a UL channel coefficient of a receiver.

Abstract: A waveguide branch circuit includes a waveguide, and branches a signal input from an external port into two or more signals. A microstrip line branch circuit includes a microstrip line, and further branches the signal branched by the waveguide branch circuit into two or more signals. A converter converts a signal between the waveguide and the microstrip line. The signals branched by the microstrip line are respectively input to a plurality of antenna elements.

Abstract: An antenna apparatus includes a plurality of circuit boards, an antenna element, and an electronic component. A plurality of the antenna elements are arranged along the surfaces of the plurality of circuit boards. The electronic component is arranged along the surfaces of the circuit boards, configured to be larger in size in the thickness direction of the circuit boards than a gap between the antenna elements, and connected to the arranged antenna elements via a high-frequency transmission circuit. The plurality of circuit boards are arranged with component mounting surfaces arranged oppositely to each other and, for each pair, the positions corresponding to the electronic component are misaligned in the surface direction of the circuit boards.

Abstract: A waveguide branch circuit includes a waveguide, and branches a signal input from an external port into two or more signals. A microstrip line branch circuit includes a microstrip line, and further branches the signal branched by the waveguide branch circuit into two or more signals. A converter converts a signal between the waveguide and the microstrip line. The signals branched by the microstrip line are respectively input to a plurality of antenna elements.

Abstract: A phase shifter (60) is provided corresponding to an antenna element constituting an array antenna and is configured to change a phase of a radio frequency signal to be transmitted or received by a corresponding antenna element. The phase shifter (60) includes a first distributor (61) configured to distribute the radio frequency signal input thereto into a plurality of first distributed signals having mutually different phases; second distributors (62) provided corresponding to the first distributed signals, the second distributors each being configured to distribute a corresponding one of the first distributed signals into a plurality of second distributed signals having mutually different amplitudes; a controller (63) configured to control on/off of the second distributed signals; and a combiner (64) configured to combine the second distributed signals that are controlled on by the controller (63).

Abstract: A millimeter wave semiconductor apparatus includes: a module substrate including the millimeter wave semiconductor chip mounted thereon; and a waveguide tube member constituting a package of the chip and the waveguide tube by including the waveguide tube and supporting the module substrate, the module substrate includes: a base member; a line pattern including a microstrip line portion, a fin line portion, and an interface portion formed on one of surfaces of the base member; a ground pattern formed on the other surface of the base member; and a cavity defined by a hole formed through the base member at a center portion thereof and a surface of the ground pattern on a side where the line pattern is formed as a bottom surface for mounting the chip on the bottom surface thereof, and the microstrip line portion and the chip are wire-bonded at the substantially same level.

Abstract: An antenna apparatus includes a plurality of circuit boards, an antenna element, and an electronic component. A plurality of the antenna elements are arranged along the surfaces of the plurality of circuit boards. The electronic component is arranged along the surfaces of the circuit boards, configured to be larger in size in the thickness direction of the circuit boards than a gap between the antenna elements, and connected to the arranged antenna elements via a high-frequency transmission circuit. The plurality of circuit boards are arranged with component mounting surfaces arranged oppositely to each other and, for each pair, the positions corresponding to the electronic component are misaligned in the surface direction of the circuit boards.

Abstract: A phase shifter (60) is provided corresponding to an antenna element constituting an array antenna and is configured to change a phase of a radio frequency signal to be transmitted or received by a corresponding antenna element. The phase shifter (60) includes a first distributor (61) configured to distribute the radio frequency signal input thereto into a plurality of first distributed signals having mutually different phases; second distributors (62) provided corresponding to the first distributed signals, the second distributors each being configured to distribute a corresponding one of the first distributed signals into a plurality of second distributed signals having mutually different amplitudes; a controller (63) configured to control on/off of the second distributed signals; and a combiner (64) configured to combine the second distributed signals that are controlled on by the controller (63).

Abstract: A millimeter wave semiconductor apparatus includes: a module substrate including the millimeter wave semiconductor chip mounted thereon; and a waveguide tube member constituting a package of the chip and the waveguide tube by including the waveguide tube and supporting the module substrate, the module substrate includes: a base member; a line pattern including a microstrip line portion, a fin line portion, and an interface portion formed on one of surfaces of the base member; a ground pattern formed on the other surface of the base member; and a cavity defined by a hole formed through the base member at a center portion thereof and a surface of the ground pattern on a side where the line pattern is formed as a bottom surface for mounting the chip on the bottom surface thereof, and the microstrip line portion and the chip are wire-bonded at the substantially same level.

Abstract: A semiconductor package mounting structure includes a substrate (200) and a semiconductor package (100). The substrate (200) includes an opening (210) connected to a cavity of a waveguide (310). The semiconductor package (100) is mounted on the substrate (200). The semiconductor package (100) includes a semiconductor device (110) and a probe (152) connected to the semiconductor device (110). The opening (210) includes a part that overlaps the probe (152) and a part that does not overlap the semiconductor package (100).

Abstract: A semiconductor package mounting structure includes a substrate (200) and a semiconductor package (100). The substrate (200) includes an opening (210) connected to a cavity of a waveguide (310). The semiconductor package (100) is mounted on the substrate (200). The semiconductor package (100) includes a semiconductor device (110) and a probe (152) connected to the semiconductor device (110). The opening (210) includes a part that overlaps the probe (152) and a part that does not overlap the semiconductor package (100).

Abstract: A synchronization device has a normal-signal generator, a reference-signal generator, and a phase difference detector. The normal-signal generator generates a normal signal whose timing is synchronized with a time signal from a satellite. The reference-signal generator generates a reference signal whose timing is synchronized with a received signal. The phase difference detector detects the phase difference between the reference signal and the normal signal. The normal-signal generator then controls the normal signal on the basis of the phase difference when the time signal cannot be obtained.

Abstract: A synchronization device has a normal-signal generator, a reference-signal generator, and a phase difference detector. The normal-signal generator generates a normal signal whose timing is synchronized with a time signal from a satellite. The reference-signal generator generates a reference signal whose timing is synchronized with a received signal. The phase difference detector detects the phase difference between the reference signal and the normal signal. The normal-signal generator then controls the normal signal on the basis of the phase difference when the time signal cannot be obtained.

Abstract: Peak power is reduced without causing degradation of EVM. A multi-carrier transmission apparatus comprises: a first amplitude suppression unit suppressing amplitude of an oversampled multi-carrier signal; a first Fourier transform unit transforming an output signal of the first amplitude suppression unit into a frequency domain; a first signal suppression unit suppressing a signal outside a band of the output signal from the first Fourier transform unit under a predetermined condition; and a first inverse Fourier transform unit receiving a multi-carrier signal with respect to a signal within the band, receiving the output signal of the first signal suppression unit with respect to a signal outside the band, and inverse Fourier transforming these received signals.

Abstract: A peak suppression device includes: a peak determination unit which determines a peak value of a waveform of an input signal; an impulse signal generation unit which generates an impulse signal corresponding to a difference between the peak value and a predetermined value if an absolute value of the peak value is greater than the predetermined value; a multiplication unit which multiplies the generated impulse signal by a predetermined impulse response waveform so as to generate a peak suppression signal; and a subtraction unit which subtracts the peak suppression signal from the input signal.

Abstract: Peak power is reduced without causing degradation of EVM. A multi-carrier transmission apparatus comprises: a first amplitude suppression unit suppressing amplitude of an oversampled multi-carrier signal; a first Fourier transform unit transforming an output signal of the first amplitude suppression unit into a frequency domain; a first signal suppression unit suppressing a signal outside a band of the output signal from the first Fourier transform unit under a predetermined condition; and a first inverse Fourier transform unit receiving a multi-carrier signal with respect to a signal within the band, receiving the output signal of the first signal suppression unit with respect to a signal outside the band, and inverse Fourier transforming these received signals.