Patents by Inventor Toshihide TAKASHIMA

Toshihide TAKASHIMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for substrate processing
    Patent number: 10381233
    Abstract: A substrate processing method according to exemplary embodiments includes bringing removal solution obtained by mixing a nitric acid, a strong acid stronger than the nitric acid, and water into contact with a substrate in which a boron monofilm is formed on a film including a silicon-based film so as to remove the boron monofilm from the substrate.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: August 13, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Koji Kagawa, Syuhei Yonezawa, Kazuya Dobashi, Toshihide Takashima, Masaru Amai
  • METHOD AND APPARATUS FOR SUBSTRATE PROCESSING
    Publication number: 20180182638
    Abstract: A substrate processing method according to exemplary embodiments includes bringing removal solution obtained by mixing a nitric acid, a strong acid stronger than the nitric acid, and water into contact with a substrate in which a boron monofilm is formed on a film including a silicon-based film so as to remove the boron monofilm from the substrate.
    Type: Application
    Filed: December 22, 2017
    Publication date: June 28, 2018
    Inventors: Koji Kagawa, Syuhei Yonezawa, Kazuya Dobashi, Toshihide Takashima, Masaru Amai
  • Substrate processing apparatus, substrate processing method and storage medium
    Patent number: 8685169
    Abstract: Disclosed are a substrate processing apparatus, a substrate processing method and a storage medium, capable of removing contaminant materials from a substrate by using SPM liquid (sulfuric acid and hydrogen peroxide mixture) while preventing degradation of the function of the SPM liquid for removing the contaminant materials. The SPM liquid is filled in a processing bath and the substrate is immersed in the SPM liquid. A heating unit is provided in the circulation path to heat the SPM liquid. A hydrogen peroxide supply line supplements hydrogen peroxide to the SPM liquid in the circulation path. A control unit adjusts the temperature of the SPM liquid to the predetermined temperature in the range of 135° C. to 170° C. based on a temperature detection value and outputs a control signal to supplement the sulfuric acid to compensate for the SPM liquid as the SPM liquid is evaporated by heating.
    Type: Grant
    Filed: November 23, 2010
    Date of Patent: April 1, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Hironobu Hyakutake, Toshihide Takashima
  • SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND STORAGE MEDIUM
    Publication number: 20110126860
    Abstract: Disclosed are a substrate processing apparatus, a substrate processing method and a storage medium, capable of removing contaminant materials from a substrate by using SPM liquid (sulfuric acid and hydrogen peroxide mixture) while preventing degradation of the function of the SPM liquid for removing the contaminant materials. The SPM liquid is filled in a processing bath and the substrate is immersed in the SPM liquid. A heating unit is provided in the circulation path to heat the SPM liquid. A hydrogen peroxide supply line supplements hydrogen peroxide to the SPM liquid in the circulation path. A control unit adjusts the temperature of the SPM liquid to the predetermined temperature in the range of 135° C. to 170° C. based on a temperature detection value and outputs a control signal to supplement the sulfuric acid to compensate for the SPM liquid as the SPM liquid is evaporated by heating.
    Type: Application
    Filed: November 23, 2010
    Publication date: June 2, 2011
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Hironobu HYAKUTAKE, Toshihide TAKASHIMA