Patents by Inventor Toshihide TSUJITA

Toshihide TSUJITA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component mounting board, electronic device, and electronic module
    Patent number: 10573591
    Abstract: An electronic component mounting board reduces short-circuiting between a plurality of thick wiring conductors to improve reliability and electrical characteristics. An electronic component mounting board (1) includes a substrate (2) including a mount area (4) in which an electronic component (10) is mountable, a first insulating layer (2a) overlapping the mount area (4), a second insulating layer (2b) on a lower surface of the first insulating layer (2a), and a first metal layer (5) between the first insulating layer (2a) and the second insulating layer (2b).
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: February 25, 2020
    Assignee: KYOCERA CORPORATION
    Inventors: Toshihide Tsujita, Naoki Hijikuro
  • ELECTRONIC COMPONENT MOUNTING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
    Publication number: 20180240746
    Abstract: An electronic component mounting board reduces short-circuiting between a plurality of thick wiring conductors to improve reliability and electrical characteristics. An electronic component mounting board (1) includes a substrate (2) including a mount area (4) in which an electronic component (10) is mountable, a first insulating layer (2a) overlapping the mount area (4), a second insulating layer (2b) on a lower surface of the first insulating layer (2a), and a first metal layer (5) between the first insulating layer (2a) and the second insulating layer (2b).
    Type: Application
    Filed: February 14, 2018
    Publication date: August 23, 2018
    Applicant: KYOCERA Corporation
    Inventors: Toshihide TSUJITA, Naoki HIJIKURO