Patents by Inventor Toshihiko Aya

Toshihiko Aya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermoplastic aromatic polyamideimide copolymer from polyamide diamine
    Patent number: 4831104
    Abstract: The thermoplastic aromatic polyamideimide compolymers comprising the structural units (1), (2) and (3) represented by formulae, ##STR1## respectively, (2) and (3) being at ratio of 1 mole to 1 mole of (1), (3) being at a ratio of 0.95-0.05 mole to 0.05-0.95 mole of (2), (1) and (2) or (3) being alternatively interconnected and Ar and Ar' being composed of 5 to 70 mole % of ##STR2## and 95 to 30 mole % of ##STR3## provide the moldings being superior in heat stability and fluidity at the temperatures of 300.degree. to 400.degree. C. and injection moldable and having desired characteristics.
    Type: Grant
    Filed: July 31, 1987
    Date of Patent: May 16, 1989
    Assignee: Toray Industries, Inc.
    Inventors: Toshihiko Aya, Sho Kadoi
  • Method of preparing polyimide prepolymer from ethylenically unsaturated dicarboxylic acid compound
    Patent number: 4539392
    Abstract: Polyimide prepolymers having excellent heat resistance can be prepared in one stage by the reaction of polyamines and aromatic double bond-containing dicarboxylic acids or derivatives thereof in the presence of oxide compounds of phosphorus without isolating any intermediate in the course of said reaction.
    Type: Grant
    Filed: July 3, 1984
    Date of Patent: September 3, 1985
    Assignee: Toray Industries, Inc.
    Inventors: Sho Kadoi, Toshihiko Aya
  • Heat resistant molding resin composition
    Patent number: 4340697
    Abstract: The present invention relates to a heat resistant molding resin composition comprising 60-99.9% by weight of an aromatic polyamideimide resin, and 40-0.1% by weight of a thermoplastic resin which comprises at least one member selected from the group consisting of a polyphenylene sulfide resin, a polyamide resin, a polysulfone resin, an aromatic polyester resin, a polyphenylene-ether resin and a phenoxy resin. The thermoplastic resin must have a melt viscosity at 350.degree. C. of not more than 1.times.10.sup.5 poise and a decomposition temperature of not lower than 350.degree. C. The aromatic polyamideimide resin is improved in melt viscosity characteristics by being blended with the thermoplastic resin. Therefore, a resin composition is obtained which is excellent in moldability characteristics. This composition may optionally comprise various kinds of fillers.
    Type: Grant
    Filed: April 1, 1980
    Date of Patent: July 20, 1982
    Assignee: Toray Industries, Inc.
    Inventors: Toshihiko Aya, Yasushi Kubo
  • Thermoplastic polyamide imide copolymers and method of preparation
    Patent number: 4299945
    Abstract: Thermoplastic polyamide imide copolymers are provided which are excellent in both heat stability and melt viscosity characteristics at a temperature of from about 300.degree. C. to about 400.degree. C., and method of preparation.
    Type: Grant
    Filed: March 25, 1980
    Date of Patent: November 10, 1981
    Assignee: Toray Industries, Inc.
    Inventors: Toshihiko Aya, Takashi Sasagawa, Sho Kadoi
  • Multi-component fiber, the method for making said and polyurethane matrix sheets formed from said
    Patent number: 4008344
    Abstract: A multi-component thermoplastic fiber comprising a specified component of a copolymer of the vinyl series, and having very excellent drawability at a low temperature and excellent dimensional stability and a method of obtaining said product.
    Type: Grant
    Filed: November 28, 1975
    Date of Patent: February 15, 1977
    Assignee: Toray Industries, Inc.
    Inventors: Miyoshi Okamoto, Koji Watanabe, Zenji Izumi, Toshihiko Aya, Hideaki Kitagawa