Abstract: There is provided a liquid crystal display device, as well as a manufacturing method therefor, capable of preventing characteristic deterioration of TFTs by reducing the amount of return light incident on the TFTs. A light interception thin film 2 is composed of a silicide film formed on a transparent substrate 1 and a polysilicon film formed so as to cover a top of the silicide film, and a polysilicon film 3 is formed so as to cover a top of the light interception thin film 2. Then, by making up a light interception film from the light interception thin film 2 and the polysilicon film 3, the light interception effect on a TFT-use polysilicon layer 5 formed over the light interception film with interposition of the transparent insulation film 4, and enough thermal resistance and adhesion can be obtained in the TFT manufacturing process.

Abstract: A semiconductor device, which is characterized in that a trench (12) is formed in a silicon substrate (11), an element isolation film (1) is formed on an inner surface of said trench (12), and a drain region (7), a channel region (8) and a source region (9) are arranged vertically in a region encircled by said element isolation film (1); and that a gate insulating film (2) is formed inside of these regions (7, 8 and 9) and a gate electrode (4) is formed on an inner side portion of said gate insulating film (2), while a drain electrode (5) or source electrode (13) is formed on an outer side portion of said gate insulating film (2).

Abstract: The production of a solid-state imaging device includes the steps of: smoothing the surface of a semiconductor substrate by embedding a polymeric or polymerizable material into recessed portions in the surface of the substrate on which a plurality of solid-state imaging devices are formed, forming optical component parts on the substrate, and cutting the substrate along scribe lines that constitute part of the recessed portions.