Patents by Inventor Toshihiko Higashino
Toshihiko Higashino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20120106026Abstract: A electrical storage device has: a cell module including a plurality of cells arranged juxtaposed and each having a pair of current collector terminals protruding from electrodes, the current collector terminals of adjacent ones of the cells being connected to each other; and an electronic circuit board disposed near the cell module and electrically connected to the current collector terminals of each of the cells via a plurality of connecting wires, for controlling charging and discharging of each of the cells. A cable having flexibility or a flexible wire is used as each of the connecting wires. One end of each of the connecting wires has a connecting terminal portion for clamping the current collector terminals of the adjacent ones of the cells to each other.Type: ApplicationFiled: March 1, 2011Publication date: May 3, 2012Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Toshihiko HIGASHINO, Fumito UEMURA, Nobuhiro KIHARA, Yuichi MURAMOTO, Takayuki UBUKATA
-
Patent number: 7093744Abstract: The present invention solves a problem that in a wire bonding process, an inert gas used for prevention of oxidation of a substrate gave rise to shimmer due to the temperature difference during bonding, thereby degrading the precision of pattern recognition. With this invention's bonding device 21, shielding lids 31, 32, and 33 are disposed at upper and lower parts of a ring illumination 25 and at a lower part of lens barrel 29. Shimmer 37 of nitrogen gas that blows out from a working hole 24 can thus be prevented from entering inside ring illumination 25, especially by shielding lid 31 at the lower part of ring illumination 25. As a result, the recognition precision of a recognition camera can be improved and the wire bonding precision of the ?m order can be improved.Type: GrantFiled: February 2, 2004Date of Patent: August 22, 2006Assignee: Sanyo Electric Co., Ltd.Inventors: Kouji Seki, Noriyasu Sakai, Toshihiko Higashino
-
Patent number: 7066372Abstract: The present invention solves a problem that in a wire bonding process, an inert gas used for prevention of oxidation of a substrate gave rise to shimmer due to the temperature difference during bonding, thereby degrading the precision of pattern recognition. With this invention's bonding device 21 provided with recognition device, a shimmer prevention blow mechanism 31 is disposed between a ring illumination 25 and a working hole 24 and near working hole 24. Though the nitrogen gas that blows out from working hole 24 gives rise to shimmer due to temperature difference, this shimmer can be blown away by the nitrogen gas blow from shimmer prevention blow mechanism 31. As a result, the recognition precision of a recognition camera can be improved and the wire bonding precision of the ?m order can be improved.Type: GrantFiled: February 3, 2004Date of Patent: June 27, 2006Assignee: Sanyo Electric Co., Ltd.Inventors: Kouji Seki, Noriyasu Sakai, Toshihiko Higashino
-
Patent number: 6824037Abstract: The present invention solves a problem with a wire bonding device, that during a wire bonding process, a cover at the periphery of a working hole warps upward to cause inadvertent sparking to occur across the cover that has warped upwards and a torch electrode. This invention's bonding device 21 provided with recognition device is characterized in that insulation treatment is applied to a part 231 of a cover 23 positioned at the periphery of a working hole 24. The interior of a working region is kept, for example, at 230° C. by a heater 30 inside a setting base 22, and by being placed under high temperature constantly, a part 471 of cover 23 warps upwards. However, since insulation treatment is applied to part 231 of cover 23, a bonding device can be realized with which inadvertent sparking between a torch electrode 28 will not occur.Type: GrantFiled: July 22, 2002Date of Patent: November 30, 2004Assignee: Sanyo Electric Co., Ltd.Inventors: Noriyasu Sakai, Kouji Seki, Toshihiko Higashino
-
Publication number: 20040154742Abstract: The present invention solves a problem that in a wire bonding process, an inert gas used for prevention of oxidation of a substrate gave rise to shimmer due to the temperature difference during bonding, thereby degrading the precision of pattern recognition. With this invention's bonding device 21 provided with recognition device, a shimmer prevention blow mechanism 31 is disposed between a ring illumination 25 and a working hole 24 and near working hole 24. Though the nitrogen gas that blows out from working hole 24 gives rise to shimmer due to temperature difference, this shimmer can be blown away by the nitrogen gas blow from shimmer prevention blow mechanism 31. As a result, the recognition precision of a recognition camera can be improved and the wire bonding precision of the &mgr;m order can be improved.Type: ApplicationFiled: February 3, 2004Publication date: August 12, 2004Applicant: Sanyo Electric Co., Ltd., a Japan corporationInventors: Kouji Seki, Noriyasu Sakai, Toshihiko Higashino
-
Publication number: 20040155089Abstract: The present invention solves a problem that in a wire bonding process, an inert gas used for prevention of oxidation of a substrate gave rise to shimmer due to the temperature difference during bonding, thereby degrading the precision of pattern recognition. With this invention's bonding device 21, shielding lids 31, 32, and 33 are disposed at upper and lower parts of a ring illumination 25 and at a lower part of lens barrel 29. Shimmer 37 of nitrogen gas that blows out from a working hole 24 can thus be prevented from entering inside ring illumination 25, especially by shielding lid 31 at the lower part of ring illumination 25. As a result, the recognition precision of a recognition camera can be improved and the wire bonding precision of the &mgr;m order can be improved.Type: ApplicationFiled: February 2, 2004Publication date: August 12, 2004Applicant: Sanyo Electric Co., Ltd., a Japan corporationInventors: Kouji Seki, Noriyasu Sakai, Toshihiko Higashino
-
Patent number: 6729528Abstract: The present invention solves a problem that in a wire bonding process, an inert gas used for prevention of oxidation of a substrate gave rise to shimmer due to the temperature difference during bonding, thereby degrading the precision of pattern recognition. With this invention's bonding device 21, shielding lids 31, 32, and 33 are disposed at upper and lower parts of a ring illumination 25 and at a lower part of lens barrel 29. Shimmer 37 of nitrogen gas that blows out from a working hole 24 can thus be prevented from entering inside ring illumination 25, especially by shielding lid 31 at the lower part of ring illumination 25. As a result, the recognition precision of a recognition camera can be improved and the wire bonding precision of the &mgr;m order can be improved.Type: GrantFiled: June 24, 2002Date of Patent: May 4, 2004Assignee: Sanyo Electric Co., Ltd.Inventors: Kouji Seki, Noriyasu Sakai, Toshihiko Higashino
-
Patent number: 6715660Abstract: The present invention solves a problem that in a wire bonding process, an inert gas used for prevention of oxidation of a substrate gave rise to shimmer due to the temperature difference during bonding, thereby degrading the precision of pattern recognition. With this invention's bonding device 21 provided with recognition device, a shimmer prevention blow mechanism 31 is disposed between a ring illumination 25 and a working hole 24 and near working hole 24. Though the nitrogen gas that blows out from working hole 24 gives rise to shimmer due to temperature difference, this shimmer can be blown away by the nitrogen gas blow from shimmer prevention blow mechanism 31. As a result, the recognition precision of a recognition camera can be improved and the wire bonding precision of the &mgr;m order can be improved.Type: GrantFiled: June 24, 2002Date of Patent: April 6, 2004Assignee: Sanyo Electric Co., Ltd.Inventors: Kouji Seki, Noriyasu Sakai, Toshihiko Higashino
-
Publication number: 20030019906Abstract: The present invention solves a problem with a wire bonding device, that during a wire bonding process, a cover at the periphery of a working hole warps upward to cause inadvertent sparking to occur across the cover that has warped upwards and a torch electrode. This invention's bonding device 21 provided with recognition device is characterized in that insulation treatment is applied to a part 231 of a cover 23 positioned at the periphery of a working hole 24. The interior of a working region is kept, for example, at 230° C. by a heater 30 inside a setting base 22, and by being placed under high temperature constantly, a part 471 of cover 23 warps upwards. However, since insulation treatment is applied to part 231 of cover 23, a bonding device can be realized with which inadvertent sparking between a torch electrode 28 will not occur.Type: ApplicationFiled: July 22, 2002Publication date: January 30, 2003Inventors: Noriyasu Sakai, Kouji Seki, Toshihiko Higashino
-
Publication number: 20030000995Abstract: The present invention solves a problem that in a wire bonding process, an inert gas used for prevention of oxidation of a substrate gave rise to shimmer due to the temperature difference during bonding, thereby degrading the precision of pattern recognition. With this invention's bonding device 21 provided with recognition device, a shimmer prevention blow mechanism 31 is disposed between a ring illumination 25 and a working hole 24 and near working hole 24. Though the nitrogen gas that blows out from working hole 24 gives rise to shimmer due to temperature difference, this shimmer can be blown away by the nitrogen gas blow from shimmer prevention blow mechanism 31. As a result, the recognition precision of a recognition camera can be improved and the wire bonding precision of the &mgr;m order can be improved.Type: ApplicationFiled: June 24, 2002Publication date: January 2, 2003Inventors: Kouji Seki, Noriyasu Sakai, Toshihiko Higashino
-
Publication number: 20030000993Abstract: The present invention solves a problem that in a wire bonding process, an inert gas used for prevention of oxidation of a substrate gave rise to shimmer due to the temperature difference during bonding, thereby degrading the precision of pattern recognition. With this invention's bonding device 21, shielding lids 31, 32, and 33 are disposed at upper and lower parts of a ring illumination 25 and at a lower part of lens barrel 29. Shimmer 37 of nitrogen gas that blows out from a working hole 24 can thus be prevented from entering inside ring illumination 25, especially by shielding lid 31 at the lower part of ring illumination 25. As a result, the recognition precision of a recognition camera can be improved and the wire bonding precision of the &mgr;m order can be improved.Type: ApplicationFiled: June 24, 2002Publication date: January 2, 2003Inventors: Kouji Seki, Noriyasu Sakai, Toshihiko Higashino
-
Patent number: 4951164Abstract: A magnetic recording/playback apparatus in which rotational torque from the drive shaft of a single motor is capable of being transmitted to a cassette loading mechanism and a tape loading mechanism includes a worm secured to the drive shaft and a worm wheel for being meshed freely with the worm, the worm wheel being provided with a toothless portion. The drive shaft is coupled to the cassette loading mechanism via the worm wheel. During operation of the tape loading mechanism by the drive shaft, the toothless portion of the worm wheel is brought into position opposite the worm wheel so that a driving force is no longer applied to the cassette loading mechanism. When a cassette is ejected, the toothless portion of the worm wheel is shifted after a tape loading operation, thereby reengaging the worm wheel and worm to actuate the cassette loading mechanism.Type: GrantFiled: February 24, 1989Date of Patent: August 21, 1990Assignee: Sanyo Electric Co., Ltd.Inventors: Yoshio Yasaka, Ken Motoi, Toshihiko Higashino, Takahiro Okuie, Kazuyoshi Ogino