Patents by Inventor Toshihiko Ishikawa

Toshihiko Ishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10948129
    Abstract: A high pressure tank includes: a liner made of a resin; a reinforced layer covering an outer surface of the liner; and a cap having formed therein a supplying/discharging hole for supplying/discharging a fluid to/from the liner. This cap includes: a flange section interposing between the liner and the reinforced layer; and an exposed section exposed from the reinforced layer. Furthermore, in this high pressure tank, a protective member is arranged between the flange section and the reinforced layer.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: March 16, 2021
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Toshihiko Kanezaki, Yusuke Ishikawa
  • Publication number: 20210063561
    Abstract: A radar device includes processing circuitry to select multiple combinations of one or more cells consecutively arranged, out of multiple cells included in an observation region, assume that an object of observation is present in each of the selected cell combinations, and set up each of objects of observation as a target candidate, and calculate the flow rate of a cell in which each target candidate is present, by using the flow velocity of the cell in which the target candidate is present, out of the calculated flow velocities and determine whether each target candidate has a possibility of being an object of observation on the basis of the flow rate are disposed, and specify a target candidate which has been determined continuously with respect to time to have a possibility of being an object of observation, and recognize the specified target candidate as an object of observation.
    Type: Application
    Filed: November 12, 2020
    Publication date: March 4, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Tetsutaro YAMADA, Tomoyuki KOYANAGI, Toshihiko ARIOKA, Hiroaki ISHIKAWA, Hiroshi KAMEDA
  • Publication number: 20190257474
    Abstract: A high pressure tank includes: a liner made of a resin; a reinforced layer covering an outer surface of the liner; and a cap having formed therein a supplying/discharging hole for supplying/discharging a fluid to/from the liner. This cap includes: a flange section interposing between the liner and the reinforced layer; and an exposed section exposed from the reinforced layer. Furthermore, in this high pressure tank, a protective member is arranged between the flange section and the reinforced layer.
    Type: Application
    Filed: February 19, 2019
    Publication date: August 22, 2019
    Inventors: Toshihiko Kanezaki, Yusuke Ishikawa
  • Publication number: 20190257473
    Abstract: A high pressure tank includes: a supplying/discharging hole; and a cap having formed therein a cap-side path which is a part of a flow path. A repelling coating interposes between a liner-side end surface facing a resin-made liner, of a flange section configuring the cap, or a flange section-facing outer surface facing the flange section, of the liner. The repelling coating is formed of a material that repels a matrix resin of a fiber-reinforced resin configuring a reinforced layer.
    Type: Application
    Filed: February 19, 2019
    Publication date: August 22, 2019
    Inventors: Toshihiko Kanezaki, Yusuke Ishikawa
  • Patent number: 8472769
    Abstract: An optical fiber that has no bubbles in the ultraviolet ray curable resin filled inside the air holes to seal the end parts thereof, an end part processing method of the optical fiber, and an end part processing apparatus of the optical fiber, are provided. In an end part processing method of an optical fiber that is comprised of a core and a cladding formed around the core, the cladding having a refraction index lower than that of the core and has a plurality of air holes formed therein along the axis of the core, wherein the end part process of the optical fiber is to form sealed portions on the ends of the air holes by sealing them with ultraviolet ray curable resin, the method is characterized in that the sealed portion is formed by heating the end of the optical fiber.
    Type: Grant
    Filed: November 8, 2010
    Date of Patent: June 25, 2013
    Assignee: Hitachi Cable, Ltd.
    Inventors: Masao Tachikura, Kazumasa Ohsono, Noribumi Shiina, Kanako Suzuki, Yoshikazu Namekawa, Kyoji Osozawa, Toshihiko Ishikawa, Masaru Ishikawa, Motoyoshi Nakamura
  • Patent number: 8213791
    Abstract: A communication light detecting device interconnecting light transmission paths and collocated therebetween, comprises: an optical coupling body including a core portion for photo coupling with the light transmission paths, and a light extracting portion for extracting a part of the communication light as a leakage light; and a light detecting portion having a light receiving member for receiving the leakage light. The light extracting portion is preferable to possess a lower refractive index than that of the core portion. Besides, the light extracting portion is preferable to include a light detecting use groove with a groove width of 50 ?m or more and 140 ?m or less formed by cutting and separating the core portion. Besides, the light extracting portion is preferable to be the optical coupling body in which outer diameter of the core portion is different from the outer diameter of a core of the light transmission path.
    Type: Grant
    Filed: May 14, 2009
    Date of Patent: July 3, 2012
    Assignees: Hitachi Cable, Ltd., Advanced Cable Systems Corp., NTT Communications Corporation
    Inventors: Seiji Kojima, Kanako Suzuki, Yoshihiro Nakatani, Toshihiko Ishikawa, Takao Nishikawa, Kojiro Ito, Tetsuya Sueoka
  • Publication number: 20110110637
    Abstract: An optical fiber that has no bubbles in the ultraviolet ray curable resin filled inside the air holes to seal the end parts thereof, an end part processing method of the optical fiber, and an end part processing apparatus of the optical fiber, are provided. In an end part processing method of an optical fiber that is comprised of a core and a cladding formed around the core, the cladding having a refraction index lower than that of the core and has a plurality of air holes formed therein along the axis of the core, wherein the end part process of the optical fiber is to form sealed portions on the ends of the air holes by sealing them with ultraviolet ray curable resin, the method is characterized in that the sealed portion is formed by heating the end of the optical fiber.
    Type: Application
    Filed: November 8, 2010
    Publication date: May 12, 2011
    Applicant: HITACHI CABLE, LTD.
    Inventors: Masao TACHIKURA, Kazumasa OHSONO, Noribumi SHIINA, Kanako SUZUKI, Yoshikazu NAMEKAWA, Kyoji OSOZAWA, Toshihiko ISHIKAWA, Masaru ISHIKAWA, Motoyoshi NAKAMURA
  • Publication number: 20100329604
    Abstract: An optical connector that requires no complicated fabrication operation such as highly accurate optical axis alignment and that permits an efficient pick up of part of the communication signal light being on-propagation along an optical transmission line, is provided.
    Type: Application
    Filed: June 29, 2010
    Publication date: December 30, 2010
    Applicants: HITACHI CABLE, LTD., Advanced Cable Systems Corporation
    Inventors: Seiji KOJIMA, Kanako SUZUKI, Yoshihiro NAKATANI, Toshihiko ISHIKAWA, Takao NISHIKAWA, Kojiro ITO, Tetsuya SUEOKA
  • Publication number: 20100008676
    Abstract: A communication light detecting device interconnecting light transmission paths and collocated therebetween, comprises: an optical coupling body including a core portion for photo coupling with the light transmission paths, and a light extracting portion for extracting a part of the communication light as a leakage light; and a light detecting portion having a light receiving member for receiving the leakage light. The light extracting portion is preferable to possess a lower refractive index than that of the core portion. Besides, the light extracting portion is preferable to include a light detecting use groove with a groove width of 50 ?m or more and 140 ?m or less formed by cutting and separating the core portion. Besides, the light extracting portion is preferable to be the optical coupling body in which outer diameter of the core portion is different from the outer diameter of a core of the light transmission path.
    Type: Application
    Filed: May 14, 2009
    Publication date: January 14, 2010
    Inventors: Seiji Kojima, Kanako Suzuki, Yoshihiro Nakatani, Toshihiko Ishikawa, Takao Nishikawa, Kojiro Ito, Tetsuya Sueoka
  • Publication number: 20060241360
    Abstract: Disclosed a living body measuring apparatus which comprises data measurement means for measuring plural types of biological data of a user, data selection means for selecting one of the plural types of measured biological data, data display means for displaying the selected biological data, a plurality of light emitters corresponding to the plural types of biological data, and illumination control means for activating one of the light emitters which corresponds to one selected from the biological data by the data selection means. The living body measuring apparatus of the present invention can eliminate the possibility of user's confusion about biological data display and operational complication, at the lowest cost possible.
    Type: Application
    Filed: July 20, 2005
    Publication date: October 26, 2006
    Inventors: James Montagnino, Toshihiko Ishikawa, Yuichi Miyashita
  • Patent number: 6910403
    Abstract: To cut a protecting sheet adhered over the obverse of a wafer, an inclination angle of a cutting tool is adjusted according to a form of a chamfered part of the wafer and a finishing thickness of the wafer so that the protecting sheet is cut into the required minimum size for protecting the obverse of the wafer. Thus, the protecting sheet is not included inside a removed portion in a grinding process of the reverse of the wafer with a grindstone even if the wafer is ground to have extremely thin finishing thickness. Hence, the protecting sheet is not ground while the reverse of the wafer is ground, and the grindstone is thus prevented from being clogged up with ground material of the protecting sheet.
    Type: Grant
    Filed: June 5, 2000
    Date of Patent: June 28, 2005
    Assignee: Tokyo Seimitsu Co., Ltd.
    Inventors: Toshihiko Ishikawa, Yasushi Katagiri
  • Patent number: 6910943
    Abstract: A polishing stage is mounted on a body provided with a rough grinding stage and a fine grinding stage so that a wafer can be roughly ground, finely ground and polished in one planarization apparatus. The planarization apparatus also has a cleaning stage for cleaning a polishing pad of the polishing stage to thereby clean the dirty cleaning pad. The planarization apparatus is also provided with an etching unit to thereby perform a sequence of planarization from the rough grinding to the etching.
    Type: Grant
    Filed: June 19, 2002
    Date of Patent: June 28, 2005
    Assignee: Tokyo Seimitsu Co., Ltd.
    Inventors: Toshihiko Ishikawa, Yasushi Katagiri
  • Patent number: 6734856
    Abstract: Disclosed is an improved living body variable measuring apparatus equipped with a display capable of presenting a time-related graphic representation. The graphic representation is composed of crosswise arrangement of rectangles relative to abscissa and ordinate representing time and measured quantity respectively. Each time-related column has a selected rectangle representing the quantity of a measured living body variable. The horizontal time-related arrangement of narrow rectangles facilitates survey of graphic representation. The living body variable measuring apparatus permits the user to select desired data among those measured for record, preventing so selected data from invading locations allotted to others' data and vice versa.
    Type: Grant
    Filed: January 25, 2001
    Date of Patent: May 11, 2004
    Assignee: Tanita Corporation
    Inventors: Toshihiko Ishikawa, Masato Kodama, Masaru Hirouchi, Kazuhiko Sakata
  • Patent number: 6583032
    Abstract: In a process of manufacturing semiconductor chips, first, the reverse of a wafer, on the obverse of which many chips are formed, is ground so as to shape the wafer with a predetermined thickness. Then, the reverse of the wafer is polished or etched so that the broken layer which is formed during the back grinding is removed. Next, grooves are formed on the reverse of the wafer in a predetermined depth along streets formed between the chips. Finally, the wafer is cleft along the grooves so as to be divided into separate chips. By this process, the broken layer formed on the reverse of the wafer is removed after the back grinding, then the wafer is divided into separate chips by use of the cleavage; therefore, chipping is effectively reduced.
    Type: Grant
    Filed: October 30, 2000
    Date of Patent: June 24, 2003
    Assignee: Tokyo Seimitsu Co., Ltd.
    Inventors: Toshihiko Ishikawa, Yasushi Katagiri
  • Patent number: 6519491
    Abstract: A bio-characteristic value measuring apparatus is provided, comprising an input device, a storage device, a measuring device, an arithmetic and control device, and a display device. The input device inputs a personal body data of a test subject; the storage device stores the inputted personal body data; the measuring device measure a physical characteristics of a living body; the arithmetic and control device evaluates a condition of the living body of the test subject based on the physical characteristics and the inputted personal body data; and the display device indicates the inputted personal body data and evaluated result. Upon setting the personal body data, a luminescent element in the input device corresponding to a section available for an entry operation is lighted up.
    Type: Grant
    Filed: January 26, 2001
    Date of Patent: February 11, 2003
    Assignee: Tanita Corporation
    Inventors: Toshihiko Ishikawa, Kazuyasu Koyama, Hiroki Kenmochi
  • Patent number: 6517420
    Abstract: A surface machining apparatus comprises a suction transfer device that is capable of transferring a ground thin wafer held thereon without damaging it. After the wafer is ground at two different grinding stages, the suction transfer device transfers the wafer from a chuck table to a cleaning stage. A holding surface of a suction disc in the suction transfer device is composed of a porous member having substantially the same diameter as the wafer, so that the entire surface of the wafer can be held on the holding surface of the suction disc.
    Type: Grant
    Filed: May 24, 2001
    Date of Patent: February 11, 2003
    Assignee: Tokyo Seimitsu Co., Ltd.
    Inventors: Toshihiko Ishikawa, Yasushi Katagiri
  • Publication number: 20020160691
    Abstract: A polishing stage is mounted on a body provided with a rough grinding stage and a fine grinding stage so that a wafer can be roughly ground, finely ground and polished in one planarization apparatus. The planarization apparatus also has a cleaning stage for cleaning a polishing pad of the polishing stage to thereby clean the dirty cleaning pad. The planarization apparatus is also provided with an etching unit to thereby perform a sequence of planarization from the rough grinding to the etching.
    Type: Application
    Filed: June 19, 2002
    Publication date: October 31, 2002
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventors: Toshihiko Ishikawa, Yasushi Katagiri
  • Publication number: 20020111559
    Abstract: Disclosed is a visceral fat measuring apparatus for providing living body information including visceral fat information. The apparatus comprises a display unit for displaying the visceral fat information in such manner that visceral fat area is reduced by a fixed rate to produce a reduced level value for the visceral fat area which is then displayed as the visceral fat information.
    Type: Application
    Filed: February 5, 2002
    Publication date: August 15, 2002
    Applicant: Tanita Corporation
    Inventors: Soji Kurata, Toshihiko Ishikawa
  • Patent number: 6431949
    Abstract: A planarization apparatus has a stocker in which a dressing board is stored. The dressing board is picked up from the stocker and mounted on a chuck table by a transport robot. Then, dressing of a grinding wheel or a polishing pad is performed with the dressing board. Thereafter, the used dressing board is withdrawn into the stocker by the transport robot after the process through cleaning and drying.
    Type: Grant
    Filed: July 10, 2000
    Date of Patent: August 13, 2002
    Assignee: Tokyo Seimitsu Co., Ltd.
    Inventors: Toshihiko Ishikawa, Yasushi Katagiri
  • Patent number: D546722
    Type: Grant
    Filed: October 21, 2005
    Date of Patent: July 17, 2007
    Assignee: Tanita Corporation
    Inventors: James G. Montagnino, Toshihiko Ishikawa, Hiromi Akahori