Abstract: A semiconductor package of the invention comprises: a semiconductor element provided with a circuit element on one surface of a semiconductor substrate; an external wiring region provided on an other surface of the semiconductor substrate; a support substrate disposed on the one surface of the semiconductor substrate; an electrode pad disposed on the one surface of the semiconductor substrate; and a through-electrode which extends from the electrode pad through to the other surface of the semiconductor substrate.

Abstract: A manufacturing method of a semiconductor substrate provided with a through hole electrode is proposed. In accordance with the methods, it is possible to effectively form a through hole electrode in a semiconductor substrate in which a device and a wiring pattern have been already fabricated. This manufacturing method includes the steps of forming a first silicon oxide film 12 on a principal surface of the semiconductor substrate 11, forming a small hole 13 through the semiconductor substrate 11 from the opposite the step to reach to the first silicon oxide film 12, covering the inside of the small hole 13 with the second silicon oxide film 14, forming a first thin metal film 15 and a second thin metal film 16 on the first silicon oxide film 12, partially removing the first silicon oxide film 12 corresponding to the end of the small hole 13, and filling the small hole 13 with the conductive material to form a through hole electrode 17.

Abstract: A two-dimensional driving actuator comprises a flat spring structure, and a driver for driving the flat spring structure. The flat spring structure includes a moving plate, a moving inner frame surrounding the moving plate, first torsion bars coupling the moving plate and the moving inner frame so as to allow the moving plate to be vibrated relative to the moving inner frame, a fixed outer frame surrounding the moving inner frame, and second torsion bars coupling the moving inner frame and the fixed outer frame so as to allow the moving inner frame to be vibrated relative to the fixed outer frame. The flat spring structure is manufactured from a single semiconductor substrate. The first and second torsion bars are made of different materials.

Abstract: A semiconductor package of the invention comprises: a semiconductor element provided with a circuit element on one surface of a semiconductor substrate; an external wiring region provided on an other surface of the semiconductor substrate; a support substrate disposed on the one surface of the semiconductor substrate; an electrode pad disposed on the one surface of the semiconductor substrate; and a through-electrode which extends from the electrode pad through to the other surface of the semiconductor substrate.

Abstract: A manufacturing method of a semiconductor substrate provided with a through hole electrode is proposed. In accordance with the methods, it is possible to effectively form a through hole electrode in a semiconductor substrate in which a device and a wiring pattern have been already fabricated. This manufacturing method includes the steps of forming a first silicon oxide film 12 on a principal surface of the semiconductor substrate 11, forming a small hole 13 through the semiconductor substrate 11 from the opposite the step to reach to the first silicon oxide film 12, covering the inside of the small hole 13 with the second silicon oxide film 14, forming a first thin metal film 15 and a second thin metal film 16 on the first silicon oxide film 12, partially removing the first silicon oxide film 12 corresponding to the end of the small hole 13, and filling the small hole 13 with the conductive material to form a through hole electrode 17.

Abstract: A two-dimensional driving actuator comprises a flat spring structure, and a driver for driving the flat spring structure. The flat spring structure includes a moving plate, a moving inner frame surrounding the moving plate, first torsion bars coupling the moving plate and the moving inner frame so as to allow the moving plate to be vibrated relative to the moving inner frame, a fixed outer frame surrounding the moving inner frame, and second torsion bars coupling the moving inner frame and the fixed outer frame so as to allow the moving inner frame to be vibrated relative to the fixed outer frame. The flat spring structure is manufactured from a single semiconductor substrate. The first and second torsion bars are made of different materials.