Patents by Inventor Toshihiko Kato
Toshihiko Kato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150283761Abstract: Laminate molding equipment includes a molding part with a molding table on which a three-dimensional shape molded object is molded, a powder layer forming part supplying material powder on the molding table to form a powder layer, a light beam radiating part radiating a light beam to the powder layer to form a solidified layer, the powder layer forming part includes powder laminating equipment sequentially forming the powder layer on the molding table by moving along a predetermined direction at the molding table, and a moving position detecting unit detecting a moving position along the predetermined direction at the powder laminating equipment, and the control part recognizes the moldable region by output from the moving position detecting unit, and controls the light beam radiating part, and scans the position of the light beam by adjusting angles of two scan mirrors according to processing data of controlling the scanning device.Type: ApplicationFiled: November 29, 2014Publication date: October 8, 2015Inventors: Toshio Maeda, Hiroshi Arakawa, Yasunori Takezawa, Toshihiko Kato, Koichi Amaya
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Publication number: 20150283611Abstract: Three-dimensional molding equipment includes powder supply equipment configured to supply powder material and form a powder layer, and a light beam scanning unit configured to radiate a light beam to the powder layer and move a radiated location thereof, where a three-dimensional shaped molding object is manufactured by alternately repeating processes of forming the powder layer and sintering the powder layer with light beam radiation. A region used for manufacturing the three-dimensional shaped molding object is divided into a plurality of divided regions such that respective divided regions have an equal-length molding path which is to be a scanning route of the beam such as having unequal-length molding parts by a scanning route of the beam, and radiation is executed by a plurality of the light beam scanning units to the respective plurality of divided regions to improve molding efficiency.Type: ApplicationFiled: October 20, 2014Publication date: October 8, 2015Inventors: Yasunori Takezawa, Toshio Maeda, Toshihiko Kato, Koichi Amaya
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Publication number: 20150283612Abstract: Three-dimensional molding equipment alternately repeats a laminating process forming a powder layer by powder supply equipment and a sintering process radiating a beam to the powder layer by a plurality of beam scanning equipment and further moving a radiated location with respective predetermined moving units set by a central control unit to sinter the powder layer, wherein a plurality of the beams by the beam scanning equipment are radiated on the same powder layer, and the radiated locations by the beam scanning equipment are synchronously moved in increments of moving units, the plurality of beam scanning equipment includes at least one beam scanning equipment for a large-diameter region forming at least one large-diameter radiated region on the powder layer surface; and at least one beam scanning equipment for a small-diameter region, forming at least one small-diameter radiated region having a smaller diameter on the powder layer surface.Type: ApplicationFiled: November 29, 2014Publication date: October 8, 2015Inventors: Toshio Maeda, Seiichi Tomita, Yasunori Takezawa, Toshihiko Kato, Koichi Amaya
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Publication number: 20150283762Abstract: Three-dimensional molding equipment includes powder supply equipment which forms powder layer in a laminating process; and a beam scanning unit which radiates a light or electron beam to the powder layer and moves a radiated location of the beam to sinter the powder layer, wherein the laminating and sintering processes alternately repeat, a molding path to be a scanning route of the beam on the inside of an object to be molded is preliminarily set as a continuous route which does not pass a same line and does not form any intersection, and the beam is continuously radiated along the molding path, wherein two molding paths adjacent each other formed of two straight or curve lines are set, and a distance between the adjacent scanning routes is formed larger than a radiation diameter of the beam and not larger than ten-times the radiation diameter of the same.Type: ApplicationFiled: November 29, 2014Publication date: October 8, 2015Inventors: Toshio Maeda, Kousuke Ishimoto, Yasunori Takezawa, Toshihiko Kato, Koichi Amaya
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Publication number: 20150283649Abstract: In metal powder processing equipment where metal powder is sequentially laminated on a table inside a chamber and laser beam melting or electron beam melting, and shaping by a cutting tool subsequent to the melting are performed, unmolded powder remaining at the time of the melting and cut powder generated by the cutting can be scattered by generating air flow with respect to the cutting tool from either side of a main shaft or a tool holder. As a result, life of the cutting tool is prolonged and quality of a cut surface can be improved.Type: ApplicationFiled: November 8, 2014Publication date: October 8, 2015Inventors: Koichi Amaya, Toshihiko Kato, Hideto Matsubara, Mitsuyoshi Yoshida
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Patent number: 9138807Abstract: Three-dimensional molding equipment includes powder supply equipment configured to supply powder material and form a powder layer, and a light beam scanning unit configured to radiate a light beam to the powder layer and move a radiated location thereof, where a three-dimensional shaped molding object is manufactured by alternately repeating processes of forming the powder layer and sintering the powder layer with light beam radiation. A region used for manufacturing the three-dimensional shaped molding object is divided into a plurality of divided regions such that respective divided regions have an equal-length molding path which is to be a scanning route of the beam such as having unequal-length molding parts by a scanning route of the beam, and radiation is executed by a plurality of the light beam scanning units to the respective plurality of divided regions to improve molding efficiency.Type: GrantFiled: October 20, 2014Date of Patent: September 22, 2015Assignee: Matsuura Machinery CorporationInventors: Yasunori Takezawa, Toshio Maeda, Toshihiko Kato, Koichi Amaya
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Patent number: 9083112Abstract: The magnetic coupling connector includes: first and second connector main bodies to be coupled with each other; a magnet member disposed in a coupling portion of the first connector main body and a mate-side magnetic material disposed in a coupling portion of the second connector main body, the magnet member in the first connector main body adsorbing onto the mate-side magnetic material in the second connector main body, thereby coupling the connector main bodies together; and a contact terminal disposed in the coupling portion of the first connector main body and a contact terminal disposed in the coupling portion of the second connector main body, the contact terminals being pressed against each other when coupled. In the magnetic coupling connector, the magnet member is held by the first connector main body so as to be allowed to swing.Type: GrantFiled: February 17, 2014Date of Patent: July 14, 2015Assignee: SMK CorporationInventors: Kiyoshi Asai, Toshihiko Kato, Koichi Izawa, Shintaro Nonaka, Yutaka Nakaone
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Publication number: 20140322929Abstract: The magnetic coupling connector includes: first and second connector main bodies to be coupled with each other; a magnet member disposed in a coupling portion of the first connector main body and a mate-side magnetic material disposed in a coupling portion of the second connector main body, the magnet member in the first connector main body adsorbing onto the mate-side magnetic material in the second connector main body, thereby coupling the connector main bodies together; and a contact terminal disposed in the coupling portion of the first connector main body and a contact terminal disposed in the coupling portion of the second connector main body, the contact terminals being pressed against each other when coupled. In the magnetic coupling connector, the magnet member is held by the first connector main body so as to be allowed to swing.Type: ApplicationFiled: February 17, 2014Publication date: October 30, 2014Applicant: SMK CORPORATIONInventors: Kiyoshi ASAI, Toshihiko KATO, Koichi IZAWA, Shintaro NONAKA, Yutaka NAKAONE
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Patent number: 8833540Abstract: A pallet changing system which utilizes the moving function itself of a machine head at a machining center for conveying a pallet and a configuration of a machining center equipping the system, combines a machine head 2 for machining a workpiece with a pallet changing unit 1 having a pallet changing arm 11 which can be rotated by a motor 13 and then allowed to move, by which a pallet 3 is conveyed, and the new pallet 3 for changing is changed with the existing pallet 3 gripped by a pallet clamping device 4 by turning the pallet changing arm 11, and a machining center which equips the above system and also machines a workpiece by using the machine head 2.Type: GrantFiled: December 15, 2011Date of Patent: September 16, 2014Assignee: Matsuura Machinery CorporationInventors: Kouichi Amaya, Toshihiko Kato, Masaki Kaneko
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Publication number: 20130051958Abstract: A pallet changing system which utilizes the moving function itself of a machine head at a machining center for conveying a pallet and a configuration of a machining center equipping the system, combines a machine head 2 for machining a workpiece with a pallet changing unit 1 having a pallet changing arm 11 which can be rotated by a motor 13 and then allowed to move, by which a pallet 3 is conveyed, and the new pallet 3 for changing is changed with the existing pallet 3 gripped by a pallet clamping device 4 by turning the pallet changing arm 11, and a machining center which equips the above system and also machines a workpiece by using the machine head 2.Type: ApplicationFiled: December 15, 2011Publication date: February 28, 2013Applicant: MATSUURA MACHINERY CORPORATIONInventors: Kouichi Amaya, Toshihiko Kato, Masaki Kaneko
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Patent number: 7942678Abstract: A headset connector assembly that includes a connector plate, a casing, and electrical contact members is provided. The connector plate can have a first mating surface, a second mating surface, and at least two apertures existing between the first and the second mating surfaces. The casing can have a first side in contact with the first mating surface and a second side. The casing can include a protruding cavity member for each of the at least two apertures. Each protruding cavity member can extend from the first side and be constructed to fit within one of the at least two apertures. Each protruding cavity member can house an electrical contact member.Type: GrantFiled: August 26, 2010Date of Patent: May 17, 2011Assignee: Apple Inc.Inventors: Emery A. Sanford, M. Evans Hankey, Christopher D. Prest, Way Chet Lim, Toshihiko Kato
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Publication number: 20110028041Abstract: A headset connector assembly that includes a connector plate, a casing, and electrical contact members is provided. The connector plate can have a first mating surface, a second mating surface, and at least two apertures existing between the first and the second mating surfaces. The casing can have a first side in contact with the first mating surface and a second side. The casing can include a protruding cavity member for each of the at least two apertures. Each protruding cavity member can extend from the first side and be constructed to fit within one of the at least two apertures. Each protruding cavity member can house an electrical contact member.Type: ApplicationFiled: August 26, 2010Publication date: February 3, 2011Applicant: Apple Inc.Inventors: Emery A. Sanford, M. Evans Hankey, Christopher D. Prest, Way Chet Lim, Toshihiko Kato
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Patent number: 7798831Abstract: A headset connector assembly that includes a connector plate, a casing, and electrical contact members is provided. The connector plate can have a first mating surface, a second mating surface, and at least two apertures existing between the first and the second mating surfaces. The casing can have a first side in contact with the first mating surface and a second side. The casing can include a protruding cavity member for each of the at least two apertures. Each protruding cavity member can extend from the first side and be constructed to fit within one of the at least two apertures. Each protruding cavity member can house an electrical contact member.Type: GrantFiled: December 6, 2007Date of Patent: September 21, 2010Assignee: Apple Inc.Inventors: Emery A. Sanford, M. Evans Hankey, Christopher D. Prest, Way Chet Lim, Toshihiko Kato
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Publication number: 20080166907Abstract: A headset connector assembly that includes a connector plate, a casing, and electrical contact members is provided. The connector plate can have a first mating surface, a second mating surface, and at least two apertures existing between the first and the second mating surfaces. The casing can have a first side in contact with the first mating surface and a second side. The casing can include a protruding cavity member for each of the at least two apertures. Each protruding cavity member can extend from the first side and be constructed to fit within one of the at least two apertures. Each protruding cavity member can house an electrical contact member.Type: ApplicationFiled: December 6, 2007Publication date: July 10, 2008Applicant: Apple Inc.Inventors: Emery A. Sanford, M. Evans Hankey, Christopher D. Prest, Way Chet Lim, Toshihiko Kato
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Patent number: 7023827Abstract: A WAP (Wireless Application Protocol) analyzer located on a transmission line between communication apparatuses using WAP. A WAP packet includes at least one WTP-PDU (Wireless Transaction Protocol—Protocol Data Unit). The WAP analyzer comprising, database (16) for storing state-transition specification data that define a state-transition with a cause-and-effect relationship between WTP-PDUs, states of a WTP layer, primitives between the WTP layer and WSP (Wireless Session Protocol) layer, and states of the WSP layer, based on WAP specification, means (11) for extracting the WTP-PDUs from the WAP packets, and means (13) for estimating the state-transition of the WTP layer and the WSP layer, to the apparatus that received one of the WTP-PDUs and subsequently sent other of the WTP-PDUs, for each pair of a sender and a receiver.Type: GrantFiled: September 12, 2001Date of Patent: April 4, 2006Assignee: KDDI CorporationInventors: Akio Ishikawa, Osamu Maeshima, Akira Idoue, Toshihiko Kato
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Patent number: 7010592Abstract: As shown in FIG. 2, when the SYN segment is detected, the amount of transmitted segment from the side which sent the detected SYN segment is obtained by counting the continuously detected DATA segments for collecting the traffic in a certain direction where it is impossible to directly capture the traffic. Further, the amount [ini_sdt] of the transmitted bytes from the side which sent the detected SYN segment is obtained by calculating the equation [ini_sdt]=[SEQn+LENn]?[SEQ1]. Wherein, [SEQ1] is the sequence number of the first detected DATA segment, [SEQn] is the sequence number of the last detected DATA segment and [LENn] is the user data length of the last detected DATA segment.Type: GrantFiled: March 29, 2001Date of Patent: March 7, 2006Assignee: DDI CorporationInventors: Tomohiko Ogishi, Akira Idoue, Toru Hasegawa, Toshihiko Kato
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Patent number: 6587435Abstract: The apparatus 10 is set on the line between the first and second computers 1,2 which respectively communicates by a protocol, such as TCP, having a flow control. The delay between the first computer 1 and a position, at which the apparatus 10 is set, is less than the delay between the position and the second computer 2. The apparatus 10 sends and receives a packet to/from the computers 1,2. The apparatus 10 transfers to the second computer 2, a data packet sent from the first computer 1 and being larger than a maximum data amount notified by the second computer 2. The apparatus 10 transfers, to the first computer 1, a data packet sent from the second computer 2, but does not transfer, to the first computer 1, an ACK packet sent from the second computer 2. The apparatus 10 generates, instead of the second computer 2, an ACK packet for a data packet sent from the first computer 1 and then sends the ACK packet to the first computer 1.Type: GrantFiled: March 5, 1999Date of Patent: July 1, 2003Assignee: KDD CorporationInventors: Yutaka Miyake, Teruyuki Hasegawa, Toru Hasegawa, Toshihiko Kato
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Patent number: 6535515Abstract: A TCP gateway terminates TCP flow control and retransmission control of TCP packets which are input from a transmitter side terminal, in place of a receiver side terminal. Also, the TCP gateway transfers the packet to the TCP gateway which is located on the opposite side, by using selective retransmission procedures in a data link layer using SSCOP and by using peculiar flow control procedures. In addition, the TCP gateway provides the process of transferring the packet to the receiver side terminal in accordance with the TCP process procedures in place of the transmitter side terminal, to a plurality of TCP connections simultaneously.Type: GrantFiled: May 19, 1999Date of Patent: March 18, 2003Assignee: KDD CorporationInventors: Teruyuki Hasegawa, Toru Hasegawa, Toshihiko Kato, Kouhei Yoshiizumi
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Publication number: 20020089961Abstract: A WAP (Wireless Application Protocol) analyzer located on a transmission line between communication apparatuses using WAP. A WAP packet includes at least one WTP-PDU (Wireless Transaction Protocol—Protocol Data Unit). The WAP analyzer comprising, database (16) for storing state-transition specification data that define a state-transition with a cause-and-effect relationship between WTP-PDUs, states of a WTP layer, primitives between the WTP layer and WSP (Wireless Session Protocol) layer, and states of the WSP layer, based on WAP specification, means (11) for extracting the WTP-PDUs from the WAP packets, and means (13) for estimating the state-transition of the WTP layer and the WSP layer, to the apparatus that received one of the WTP-PDUs and subsequently sent other of the WTP-PDUs, for each pair of a sender and a receiver.Type: ApplicationFiled: September 12, 2001Publication date: July 11, 2002Applicant: KDDI CORPORATIONInventors: Akio Ishikawa, Osamu Maeshima, Akira Idoue, Toshihiko Kato
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Publication number: 20020059452Abstract: A method of transferring data in mobile IP of the present invention comprises the steps of: causing the home agent(HA) to store as a care-of-address of the mobile host (MH) an address of the foreign agent (FA) received from MH; causing a DNS server in the home network (HN) to demand the care-of-address of MH from HA in response to the request of the communication terminal about the IP address and the care-of-address of MH; causing HA to provide the DNS server with the care-of-address of MH upon receiving the demand; and causing the DNS server to deliver the IP address and the care-of-address of MH to the communication terminal.Type: ApplicationFiled: September 13, 2001Publication date: May 16, 2002Applicant: KDDI CorporationInventors: Hidetoshi Yokota, Koichi Hirose, Osamu Maeshima, Akira Idoue, Toshihiko Kato